LCMXO1200E-3M132I

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 9421 1200 132-LFBGA, CSPBGA

Quantity 578 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3M132I – MachXO FPGA, 1,200 Logic Elements, 132‑ball CSPBGA

The LCMXO1200E-3M132I is a MachXO series Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a non-volatile MachXO architecture with an array of programmable logic blocks and flexible I/O for tasks such as glue logic, bus bridging, power-up control and general-purpose control logic.

Designed for industrial applications, this device provides 1,200 logic elements, approximately 9,421 bits of on-chip RAM, and 101 I/Os in a 132‑ball CSPBGA (8×8 mm) package, with a specified operating range of −40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V.

Key Features

  • Core Logic — 1,200 logic elements and 150 logic blocks arranged in a two-dimensional grid for flexible implementation of control and glue logic.
  • On‑chip Memory — 9,421 total RAM bits of embedded and distributed memory for small data buffers, state storage, and localized data processing.
  • I/O Capacity & Flexibility — 101 I/Os in the 132‑ball CSPBGA package. The MachXO family offers a programmable I/O buffer that supports interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, and RSDS.
  • Non‑volatile, Instant‑On Architecture — Single‑chip non‑volatile configuration enables fast power‑up without external configuration memory and supports in-field reconfiguration.
  • Reconfiguration & Power Modes — Supports background programming and TransFR™ reconfiguration for in-field logic updates; includes a Sleep Mode to reduce static current.
  • Clocking — MachXO family devices include sysCLOCK PLL functionality; the LCMXO1200 device implements the family features suitable for clock multiply/divide and phase shifting.
  • Power & Temperature — Core supply specified at 1.14 V to 1.26 V and rated for industrial operation from −40 °C to 100 °C.
  • Package — 132‑LFBGA / 132‑CSPBGA (8×8 mm) surface‑mount package optimized for compact board designs with 101 available I/Os.
  • Standards & Programming — MachXO family supports IEEE 1149.1 boundary scan and IEEE 1532 in-system programming, and FPGA configuration and memory programming via JTAG.

Typical Applications

  • Glue Logic and System Control — Replace discrete glue logic with a single programmable device for board-level control and sequencing tasks.
  • Bus Bridging and Interfacing — Implement protocol glue and bus translators using flexible I/O support and programmable logic.
  • Power‑Up and Reset Control — Manage power sequencing, supervisor functions and deterministic start-up behavior with non‑volatile instant‑on configuration.
  • User Interface and Control — Handle debouncing, state machines, and peripheral control where compact, reconfigurable logic is required.

Unique Advantages

  • Single‑chip Non‑volatile FPGA: Eliminates the need for external configuration memory, enabling fast, secure power‑up and simplified BOM.
  • In‑field Reconfiguration: TransFR™ background programming allows selective logic updates while the system remains operational, reducing downtime for updates.
  • Flexible I/O Range: Programmable I/O buffers support a wide set of signaling standards, simplifying interface design across voltage domains.
  • Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in industrial environments.
  • Compact High‑I/O Package: 132‑ball CSPBGA (8×8 mm) provides up to 101 I/Os in a small footprint for dense board designs.

Why Choose LCMXO1200E-3M132I?

The LCMXO1200E-3M132I positions itself as a compact, industrial‑grade MachXO FPGA that balances integration and flexibility. With 1,200 logic elements, roughly 9.4 Kbits of on‑chip RAM, and broad I/O support in a 132‑ball CSPBGA package, it is suited for designs that require instant-on, secure configuration and in-field reprogrammability.

Engineers implementing glue logic, bus bridges, power sequencing, or general control functions will find the device’s non‑volatile configuration, sleep mode, and reconfiguration features valuable for reducing system complexity and enabling product updates without hardware changes. The device is supported by the MachXO family feature set for clocking, programmable I/O, and standardized programming interfaces.

If you would like pricing, availability, or to request a quote for the LCMXO1200E-3M132I, submit a quote request or contact the supplier for a formal quotation.

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