LCMXO1200E-3FTN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 169 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3FTN256I – MachXO FPGA, 1200 logic elements, 211 I/Os, 256-LBGA
The LCMXO1200E-3FTN256I is a MachXO family Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It provides 1200 logic elements and up to 211 I/Os in a single, non-volatile device aimed at industrial applications requiring flexible glue logic, board-level control, and I/O expansion.
Designed for instant-on single-chip operation and in-field reconfiguration, this device delivers compact integration and system-level features that simplify board design and reduce external component count.
Key Features
- Core Logic 1200 logic elements (LUTs) for implementing glue logic, control functions, and low-to-mid density FPGA tasks.
- On-chip Memory Total on-chip RAM: 9,421 bits (approximately 9.4 Kbits) for small buffers and state storage.
- I/O Capacity 211 I/Os to support dense peripheral, bus, and sensor interfacing in a single device.
- Non-volatile, Instant-On MachXO family non-volatile architecture with single-chip configuration and instant-on behavior; no external configuration memory required.
- In-field Reconfiguration TransFR™ reconfiguration enables in-system logic updates while the system operates; supports background programming of non-volatile memory.
- Programmable I/O sysIO™ programmable buffer support for a wide range of I/O standards (family-level support includes LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL and common differential interfaces as defined for the MachXO family).
- Clocking Includes up to one sysCLOCK™ analog PLL (MachXO1200 family device feature) for clock multiply/divide and phase shifting.
- Power and Packaging Core supply range 1.14 V to 1.26 V; surface-mount 256-LBGA package (supplier package: 256-FTBGA, 17×17 mm); lead-free / RoHS compliant.
- Industrial Temperature Grade Specified operating temperature range from −40 °C to 100 °C for industrial-grade deployments.
- System Support Family-level features include JTAG programmability, background programming, sleep mode for static current reduction, and IEEE 1149.1 boundary scan support (as described for the MachXO family).
Typical Applications
- Glue Logic & Board Control Replace multiple discrete logic devices with a single configurable FPGA for power-up sequencing, reset control, and system glue functions.
- Bus Bridging & Protocol Conversion Use the device’s high I/O count and programmable I/O buffers to implement board-level bus interfacing and simple protocol bridging.
- Sensor and I/O Aggregation Aggregate and condition signals from multiple sensors or peripherals, leveraging the device’s I/O density and on-chip RAM for buffering.
- Industrial Control Deploy in industrial systems that require an industrial temperature range and reliable, single-chip non-volatile configuration for control and monitoring logic.
Unique Advantages
- Instant-on Non-volatile Operation: Single-chip configuration eliminates the need for external configuration memory and provides rapid power-up behavior.
- High I/O Density in a Compact Package: 211 I/Os in a 256-ball BGA (256-FTBGA, 17×17 mm) reduces board area while supporting rich peripheral connectivity.
- In-field Programmability: TransFR™ reconfiguration and background programming let you update logic in-system without removing the device from the board.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports industrial deployments and robust environmental performance.
- Low-voltage Core: Core supply specified between 1.14 V and 1.26 V aligns with low-voltage system designs.
- Regulatory and Assembly Friendly: Surface-mount, lead-free / RoHS compliant package simplifies manufacturing and compliance processes.
Why Choose LCMXO1200E-3FTN256I?
The LCMXO1200E-3FTN256I balances moderate logic density, substantial I/O, and non-volatile instant-on behavior in a compact, industrial-grade BGA package. It is well suited for engineers seeking to consolidate board-level logic, implement bus interfacing, or provide reconfigurable control functions while minimizing external components.
With industry-focused temperature tolerance, programmable I/O capabilities, in-field reconfiguration, and an integrated clocking option, this MachXO device provides a dependable platform for long-life industrial systems and flexible prototyping-to-production paths within the MachXO family ecosystem.
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