LCMXO1200E-3FTN256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 169 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3FTN256I – MachXO FPGA, 1200 logic elements, 211 I/Os, 256-LBGA

The LCMXO1200E-3FTN256I is a MachXO family Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It provides 1200 logic elements and up to 211 I/Os in a single, non-volatile device aimed at industrial applications requiring flexible glue logic, board-level control, and I/O expansion.

Designed for instant-on single-chip operation and in-field reconfiguration, this device delivers compact integration and system-level features that simplify board design and reduce external component count.

Key Features

  • Core Logic  1200 logic elements (LUTs) for implementing glue logic, control functions, and low-to-mid density FPGA tasks.
  • On-chip Memory  Total on-chip RAM: 9,421 bits (approximately 9.4 Kbits) for small buffers and state storage.
  • I/O Capacity  211 I/Os to support dense peripheral, bus, and sensor interfacing in a single device.
  • Non-volatile, Instant-On  MachXO family non-volatile architecture with single-chip configuration and instant-on behavior; no external configuration memory required.
  • In-field Reconfiguration  TransFR™ reconfiguration enables in-system logic updates while the system operates; supports background programming of non-volatile memory.
  • Programmable I/O  sysIO™ programmable buffer support for a wide range of I/O standards (family-level support includes LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL and common differential interfaces as defined for the MachXO family).
  • Clocking  Includes up to one sysCLOCK™ analog PLL (MachXO1200 family device feature) for clock multiply/divide and phase shifting.
  • Power and Packaging  Core supply range 1.14 V to 1.26 V; surface-mount 256-LBGA package (supplier package: 256-FTBGA, 17×17 mm); lead-free / RoHS compliant.
  • Industrial Temperature Grade  Specified operating temperature range from −40 °C to 100 °C for industrial-grade deployments.
  • System Support  Family-level features include JTAG programmability, background programming, sleep mode for static current reduction, and IEEE 1149.1 boundary scan support (as described for the MachXO family).

Typical Applications

  • Glue Logic & Board Control  Replace multiple discrete logic devices with a single configurable FPGA for power-up sequencing, reset control, and system glue functions.
  • Bus Bridging & Protocol Conversion  Use the device’s high I/O count and programmable I/O buffers to implement board-level bus interfacing and simple protocol bridging.
  • Sensor and I/O Aggregation  Aggregate and condition signals from multiple sensors or peripherals, leveraging the device’s I/O density and on-chip RAM for buffering.
  • Industrial Control  Deploy in industrial systems that require an industrial temperature range and reliable, single-chip non-volatile configuration for control and monitoring logic.

Unique Advantages

  • Instant-on Non-volatile Operation: Single-chip configuration eliminates the need for external configuration memory and provides rapid power-up behavior.
  • High I/O Density in a Compact Package: 211 I/Os in a 256-ball BGA (256-FTBGA, 17×17 mm) reduces board area while supporting rich peripheral connectivity.
  • In-field Programmability: TransFR™ reconfiguration and background programming let you update logic in-system without removing the device from the board.
  • Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports industrial deployments and robust environmental performance.
  • Low-voltage Core: Core supply specified between 1.14 V and 1.26 V aligns with low-voltage system designs.
  • Regulatory and Assembly Friendly: Surface-mount, lead-free / RoHS compliant package simplifies manufacturing and compliance processes.

Why Choose LCMXO1200E-3FTN256I?

The LCMXO1200E-3FTN256I balances moderate logic density, substantial I/O, and non-volatile instant-on behavior in a compact, industrial-grade BGA package. It is well suited for engineers seeking to consolidate board-level logic, implement bus interfacing, or provide reconfigurable control functions while minimizing external components.

With industry-focused temperature tolerance, programmable I/O capabilities, in-field reconfiguration, and an integrated clocking option, this MachXO device provides a dependable platform for long-life industrial systems and flexible prototyping-to-production paths within the MachXO family ecosystem.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the LCMXO1200E-3FTN256I.

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