LCMXO1200E-3FT256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 1,301 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3FT256I – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA
The LCMXO1200E-3FT256I is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single-chip solution. It combines approximately 1,200 logic elements and an array of programmable I/O to address glue logic, bus bridging and interfacing, power-up control, and general system control tasks for industrial applications.
Designed for integration and flexible deployment, this device delivers a high pin-to-logic ratio with 211 I/Os, on-chip memory, and a compact 256-ball BGA package while supporting industrial operating conditions.
Key Features
- Core Logic: Approximately 1,200 logic elements arranged across 150 logic blocks provide the programmable fabric for glue logic and control functions.
- On-chip Memory: Total on-chip RAM of 9,421 bits for embedded and distributed memory requirements within the device.
- I/O Density & Standards: Up to 211 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling.
- Non-volatile, Instant-on Architecture: Single-chip non-volatile configuration enables microsecond power-up and eliminates external configuration memory.
- Reconfiguration & Sleep: Supports in-field reconfiguration (background/programming) and a Sleep Mode that can reduce static current by up to 100×.
- Clocking: Includes on-chip sysCLOCK PLL capability as part of the MachXO family feature set.
- Power Supply: Core voltage supply specified at 1.14 V to 1.26 V; device supports a range of I/O supply voltages through programmable buffers.
- Package & Mounting: 256-ball LBGA package; supplier device package listed as 256-FTBGA (17×17). Surface mount construction.
- Industrial Temperature Range: Rated for operation from –40 °C to 100 °C suitable for industrial environments.
- Standards & Programming: Family-level support for JTAG programming, in-system programming and background non-volatile memory programming.
Typical Applications
- Glue Logic and System Integration: Replace discrete glue logic with a single reconfigurable device to simplify board design and reduce BOM complexity.
- Bus Bridging and Interfacing: Implement protocol conversion and bus interfacing functions using the device’s high I/O count and wide I/O standard support.
- Power-up and Reset Control: Use instant-on capability and non-volatile configuration for deterministic startup and power-sequencing logic.
- Control Logic: Implement embedded control, monitoring, and supervisory functions in industrial equipment leveraging the device’s programmable fabric and on-chip memory.
Unique Advantages
- Single-chip Non-volatile Configuration: Eliminates the need for external configuration memory, enabling rapid microsecond-level power-up and simplifying board design.
- High I/O-to-Logic Ratio: 211 I/Os combined with ~1,200 logic elements enables dense interfacing without excessive device size.
- Flexible I/O Standards: Programmable sysIO buffers support multiple signaling standards, reducing the need for external level shifters and interface components.
- Low-power Options: Sleep Mode offers substantial static current reduction for power-sensitive designs.
- Industrial Robustness: Operation from –40 °C to 100 °C and industrial-grade specification support reliable deployment in industrial environments.
- Compact BGA Packaging: 256-ball package provides a small PCB footprint while delivering high I/O count for space-constrained designs.
Why Choose LCMXO1200E-3FT256I?
The LCMXO1200E-3FT256I positions itself as a compact, industrial-grade MachXO FPGA for designs that require instant-on, non-volatile configuration and flexible I/O in a single-chip solution. With roughly 1,200 logic elements, 211 I/Os, and on-chip memory, it is well suited for engineers implementing glue logic, bus interfacing, power-up control and embedded control tasks where integration and deterministic startup matter.
Its combination of programmable I/O standards, Sleep Mode for reduced static current, and robust operating temperature range delivers long-term value for industrial designs that demand reliable, compact, and reconfigurable logic solutions.
Request a quote or submit a product inquiry to get pricing and availability for the LCMXO1200E-3FT256I.

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