LCMXO1200E-3FT256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 1,301 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3FT256I – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

The LCMXO1200E-3FT256I is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a single-chip solution. It combines approximately 1,200 logic elements and an array of programmable I/O to address glue logic, bus bridging and interfacing, power-up control, and general system control tasks for industrial applications.

Designed for integration and flexible deployment, this device delivers a high pin-to-logic ratio with 211 I/Os, on-chip memory, and a compact 256-ball BGA package while supporting industrial operating conditions.

Key Features

  • Core Logic: Approximately 1,200 logic elements arranged across 150 logic blocks provide the programmable fabric for glue logic and control functions.
  • On-chip Memory: Total on-chip RAM of 9,421 bits for embedded and distributed memory requirements within the device.
  • I/O Density & Standards: Up to 211 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling.
  • Non-volatile, Instant-on Architecture: Single-chip non-volatile configuration enables microsecond power-up and eliminates external configuration memory.
  • Reconfiguration & Sleep: Supports in-field reconfiguration (background/programming) and a Sleep Mode that can reduce static current by up to 100×.
  • Clocking: Includes on-chip sysCLOCK PLL capability as part of the MachXO family feature set.
  • Power Supply: Core voltage supply specified at 1.14 V to 1.26 V; device supports a range of I/O supply voltages through programmable buffers.
  • Package & Mounting: 256-ball LBGA package; supplier device package listed as 256-FTBGA (17×17). Surface mount construction.
  • Industrial Temperature Range: Rated for operation from –40 °C to 100 °C suitable for industrial environments.
  • Standards & Programming: Family-level support for JTAG programming, in-system programming and background non-volatile memory programming.

Typical Applications

  • Glue Logic and System Integration: Replace discrete glue logic with a single reconfigurable device to simplify board design and reduce BOM complexity.
  • Bus Bridging and Interfacing: Implement protocol conversion and bus interfacing functions using the device’s high I/O count and wide I/O standard support.
  • Power-up and Reset Control: Use instant-on capability and non-volatile configuration for deterministic startup and power-sequencing logic.
  • Control Logic: Implement embedded control, monitoring, and supervisory functions in industrial equipment leveraging the device’s programmable fabric and on-chip memory.

Unique Advantages

  • Single-chip Non-volatile Configuration: Eliminates the need for external configuration memory, enabling rapid microsecond-level power-up and simplifying board design.
  • High I/O-to-Logic Ratio: 211 I/Os combined with ~1,200 logic elements enables dense interfacing without excessive device size.
  • Flexible I/O Standards: Programmable sysIO buffers support multiple signaling standards, reducing the need for external level shifters and interface components.
  • Low-power Options: Sleep Mode offers substantial static current reduction for power-sensitive designs.
  • Industrial Robustness: Operation from –40 °C to 100 °C and industrial-grade specification support reliable deployment in industrial environments.
  • Compact BGA Packaging: 256-ball package provides a small PCB footprint while delivering high I/O count for space-constrained designs.

Why Choose LCMXO1200E-3FT256I?

The LCMXO1200E-3FT256I positions itself as a compact, industrial-grade MachXO FPGA for designs that require instant-on, non-volatile configuration and flexible I/O in a single-chip solution. With roughly 1,200 logic elements, 211 I/Os, and on-chip memory, it is well suited for engineers implementing glue logic, bus interfacing, power-up control and embedded control tasks where integration and deterministic startup matter.

Its combination of programmable I/O standards, Sleep Mode for reduced static current, and robust operating temperature range delivers long-term value for industrial designs that demand reliable, compact, and reconfigurable logic solutions.

Request a quote or submit a product inquiry to get pricing and availability for the LCMXO1200E-3FT256I.

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