LCMXO1200E-3B256I

The LCMXO1200E-3B256I is a MachXO family Field Programmable Gate Array (FPGA) in a 256‑ball LFBGA/CSPBGA package. It combines non-volatile configuration with FPGA-style LUT-based logic to deliver instant-on, reconfigurable logic and a high I/O-to-logic density for glue logic, bus interfacing, and system control functions.

Designed for industrial use, this device provides 1,200 logic elements, 9,421 bits of on-chip RAM and up to 211 I/O pins in a compact 14×14 mm package, supporting fast system startup and in-field reconfiguration while meeting RoHS compliance.

Key Features

• Logic Capacity — 1,200 logic elements (LUT-based architecture) suitable for glue logic, bus bridging, and control functions.
• On‑chip Memory — 9,421 total RAM bits (approximately 9.4 Kbits) for embedded and distributed memory requirements.
• I/O Density — Up to 211 I/Os in the 256‑ball package for high pin-count interfacing and flexible system connections.
• Non‑volatile, Instant‑on Configuration — Single‑chip, non‑volatile configuration eliminates external configuration memory and enables power‑up in microseconds.
• In‑field Reconfiguration — Support for reconfiguring SRAM-based logic in milliseconds and TransFR™ reconfiguration for in-field logic updates while the system operates.
• Sleep Mode — Sleep mode available to reduce static current for lower idle power.
• Clocking — MachXO1200 family devices include an analog PLL (1 PLL for the 1200 device) for clock multiply/divide and phase shifting.
• System Programming & Test — SRAM and non‑volatile memory programmable through the JTAG port; supports IEEE 1149.1 boundary scan and IEEE 1532 in-system programming.
• Power Supply — Device-specific core supply range of 1.14 V to 1.26 V (refer to device documentation for I/O rail requirements).
• Package & Mounting — 256‑LFBGA / CSPBGA (supplier package: 256‑caBGA, 14×14 mm) optimized for surface-mount assembly.
• Temperature & Grade — Industrial grade operation from −40 °C to 100 °C.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control — Implement startup sequencing, power control, and board-level control logic with fast, non‑volatile startup.
• Bus Bridging & Interface Conversion — Use the high I/O count and programmable I/O buffers to bridge buses and adapt legacy or mixed‑voltage interfaces.
• Peripheral & Sensor Interfacing — Aggregate and condition signals from sensors and peripherals, leveraging the device’s I/O density and on‑chip RAM for buffering.
• Field Upgradeable Logic — Deploy in-field updates using TransFR™ and background programming capabilities to evolve system functionality without removing the device.

Unique Advantages

• Instant‑on, single‑chip solution: Non‑volatile configuration eliminates external memory and enables microsecond power‑up for rapid system readiness.
• High I/O-to-logic density: 211 I/Os paired with 1,200 logic elements allows compact designs that require many external connections without large FPGA die sizes.
• Field reconfiguration and background programming: Update logic in milliseconds and program non‑volatile memory through standard JTAG methods to reduce downtime and support incremental upgrades.
• Industrial temperature range: Rated for −40 °C to 100 °C, supporting robust operation in industrial environments.
• Compact, surface-mount package: 256‑ball LFBGA/CSPBGA (14×14 mm) provides a small footprint for space-constrained boards while keeping high I/O availability.
• Standards-based system support: Boundary scan and IEEE 1532 in-system programming simplify testing, manufacturing, and field maintenance.

Why Choose LCMXO1200E-3B256I?

The LCMXO1200E-3B256I positions itself as a compact, industrial-grade MachXO FPGA that blends non‑volatile, instant‑on operation with FPGA-style programmability. Its combination of 1,200 logic elements, approximately 9.4 Kbits of on‑chip RAM and up to 211 I/Os in a 256‑ball LFBGA package makes it well-suited for embedded designers needing dense I/O, fast startup, and field-update capability.

For teams designing control logic, bus interfaces, or system glue, this device reduces BOM complexity by removing external configuration memory, supports in-field evolution through TransFR and JTAG programming, and fits into industrial temperature environments with RoHS‑compliant packaging.

Request a quote or submit an inquiry for pricing and availability for the LCMXO1200E-3B256I to get started with your design procurement.