LCMXO1200E-3B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 143 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3B256C – MachXO Field Programmable Gate Array (FPGA) IC
The LCMXO1200E-3B256C is a MachXO family FPGA device that combines non-volatile configuration with FPGA-style logic and embedded memory. It targets glue-logic, bus bridging, power-up control and general control-logic applications where instant-on behavior, reconfigurability, and a compact package are required.
With 1,200 logic elements, up to 211 I/Os, and on-chip RAM, this surface-mount 256-ball BGA device delivers a balance of integration and flexibility for commercial-grade embedded systems operating across standard logic supply rails and a 0 °C to 85 °C operating range.
Key Features
- Logic Capacity — 1,200 logic elements (LUTs) for implementing glue logic, control functions, and bus interfacing in a compact FPGA fabric.
- On-chip Memory — Approximately 9.4 Kbits (9,421 bits) of embedded RAM available for distributed and block memory usage within designs.
- I/O — Up to 211 programmable I/Os to support rich peripheral and bus connectivity directly from the package.
- Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables instant-on operation without external configuration memory and supports in-field reconfiguration.
- Reconfiguration and Programming — Supports background and JTAG programming workflows and TransFR™ in-field reconfiguration for updating logic while the system operates.
- Clocking — Family-level sysCLOCK PLL support; the LCMXO1200 device includes one analog PLL for clock multiplication, division, and phase shifting.
- Power and Low-Power Modes — Sleep mode capability to significantly reduce static current (up to 100× reduction is supported by the family architecture).
- Package and Mounting — 256-ball caBGA / 256-LFBGA package (14×14 mm), surface-mount mounting for compact board layouts; RoHS compliant.
- Supply and Temperature — Core supply documented at 1.14 V to 1.26 V; family support for common rails (1.2 V, 1.8 V, 2.5 V, 3.3 V) is included in the MachXO family documentation. Commercial operating range: 0 °C to 85 °C.
Typical Applications
- Glue Logic & System Control — Implement startup sequencing, power-up control and platform glue logic with fast, non-volatile configuration and compact logic capacity.
- Bus Bridging & Interface Adaptation — Bridge or adapt between different bus standards and I/O voltages using abundant I/O and programmable logic.
- Peripheral and Sensor Interfaces — Manage multiplexing, signal conditioning, and protocol conversion for sensors and peripherals with embedded RAM for buffering.
- Field-updatable Control Logic — Deploy in-field updates and logic revisions using TransFR reconfiguration and JTAG-based programming without removing the device.
Unique Advantages
- Instant-on, single-chip configuration: Non-volatile configuration eliminates the need for external configuration memory and enables microsecond power-up behavior.
- High I/O-to-logic density: 211 I/Os paired with 1,200 logic elements supports dense interface designs in a small package.
- On-chip RAM for buffering and state: Approximately 9.4 Kbits of embedded memory simplifies small FIFOs, state machines, and temporary storage without external SRAM.
- Field reconfiguration capability: TransFR and background programming allow in-system updates and iterative firmware/logic improvements.
- Compact BGA footprint: 256-ball caBGA / LFBGA (14×14 mm) surface-mount package reduces PCB area while providing high pin count.
- Commercial-grade reliability: Designed for 0 °C to 85 °C operation with RoHS-compliant packaging suitable for mainstream embedded applications.
Why Choose LCMXO1200E-3B256C?
The LCMXO1200E-3B256C positions itself as a versatile, compact FPGA solution for embedded designs that need instant-on, in-field reconfigurability, and a solid balance of logic, memory, and I/O. Its non-volatile configuration and support for background updates reduce system complexity and bill-of-materials while enabling rapid power-up and secure configuration storage.
This device is well suited to engineers and procurement teams building commercial embedded systems requiring reliable control logic, interface bridging, or field-update capability. The MachXO family ecosystem and documented feature set provide a practical migration path for designs needing similar capabilities across different logic densities.
If you would like pricing or availability, request a quote or submit a procurement inquiry to receive a tailored response for your design needs.