LCMXO1200E-3B256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA

Quantity 143 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3B256C – MachXO Field Programmable Gate Array (FPGA) IC

The LCMXO1200E-3B256C is a MachXO family FPGA device that combines non-volatile configuration with FPGA-style logic and embedded memory. It targets glue-logic, bus bridging, power-up control and general control-logic applications where instant-on behavior, reconfigurability, and a compact package are required.

With 1,200 logic elements, up to 211 I/Os, and on-chip RAM, this surface-mount 256-ball BGA device delivers a balance of integration and flexibility for commercial-grade embedded systems operating across standard logic supply rails and a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity — 1,200 logic elements (LUTs) for implementing glue logic, control functions, and bus interfacing in a compact FPGA fabric.
  • On-chip Memory — Approximately 9.4 Kbits (9,421 bits) of embedded RAM available for distributed and block memory usage within designs.
  • I/O — Up to 211 programmable I/Os to support rich peripheral and bus connectivity directly from the package.
  • Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables instant-on operation without external configuration memory and supports in-field reconfiguration.
  • Reconfiguration and Programming — Supports background and JTAG programming workflows and TransFR™ in-field reconfiguration for updating logic while the system operates.
  • Clocking — Family-level sysCLOCK PLL support; the LCMXO1200 device includes one analog PLL for clock multiplication, division, and phase shifting.
  • Power and Low-Power Modes — Sleep mode capability to significantly reduce static current (up to 100× reduction is supported by the family architecture).
  • Package and Mounting — 256-ball caBGA / 256-LFBGA package (14×14 mm), surface-mount mounting for compact board layouts; RoHS compliant.
  • Supply and Temperature — Core supply documented at 1.14 V to 1.26 V; family support for common rails (1.2 V, 1.8 V, 2.5 V, 3.3 V) is included in the MachXO family documentation. Commercial operating range: 0 °C to 85 °C.

Typical Applications

  • Glue Logic & System Control — Implement startup sequencing, power-up control and platform glue logic with fast, non-volatile configuration and compact logic capacity.
  • Bus Bridging & Interface Adaptation — Bridge or adapt between different bus standards and I/O voltages using abundant I/O and programmable logic.
  • Peripheral and Sensor Interfaces — Manage multiplexing, signal conditioning, and protocol conversion for sensors and peripherals with embedded RAM for buffering.
  • Field-updatable Control Logic — Deploy in-field updates and logic revisions using TransFR reconfiguration and JTAG-based programming without removing the device.

Unique Advantages

  • Instant-on, single-chip configuration: Non-volatile configuration eliminates the need for external configuration memory and enables microsecond power-up behavior.
  • High I/O-to-logic density: 211 I/Os paired with 1,200 logic elements supports dense interface designs in a small package.
  • On-chip RAM for buffering and state: Approximately 9.4 Kbits of embedded memory simplifies small FIFOs, state machines, and temporary storage without external SRAM.
  • Field reconfiguration capability: TransFR and background programming allow in-system updates and iterative firmware/logic improvements.
  • Compact BGA footprint: 256-ball caBGA / LFBGA (14×14 mm) surface-mount package reduces PCB area while providing high pin count.
  • Commercial-grade reliability: Designed for 0 °C to 85 °C operation with RoHS-compliant packaging suitable for mainstream embedded applications.

Why Choose LCMXO1200E-3B256C?

The LCMXO1200E-3B256C positions itself as a versatile, compact FPGA solution for embedded designs that need instant-on, in-field reconfigurability, and a solid balance of logic, memory, and I/O. Its non-volatile configuration and support for background updates reduce system complexity and bill-of-materials while enabling rapid power-up and secure configuration storage.

This device is well suited to engineers and procurement teams building commercial embedded systems requiring reliable control logic, interface bridging, or field-update capability. The MachXO family ecosystem and documented feature set provide a practical migration path for designs needing similar capabilities across different logic densities.

If you would like pricing or availability, request a quote or submit a procurement inquiry to receive a tailored response for your design needs.

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