LCMXO1200E-3T100I

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP

Quantity 1,496 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O73Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3T100I – MachXO Field Programmable Gate Array (FPGA) IC 73 I/Os, 9421 bits, 1200 logic elements, 100‑LQFP

The LCMXO1200E-3T100I is a MachXO family, non-volatile FPGA optimized for glue logic, bus interfacing and control tasks. It combines on-chip configuration memory and reconfigurable logic to deliver instant-on behavior and single-chip system integration.

Designed for industrial applications, this surface-mount device offers 1200 logic elements, 73 I/Os and approximately 9.4 Kbits of on-chip RAM in a 100‑pin LQFP package, with an operating range from ‑40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V.

Key Features

  • Non-volatile, instant-on architecture Single-chip configuration with no external configuration memory required; powers up in microseconds for fast system availability.
  • Reconfigurability and in-field updates Supports background programming and TransFR™ Reconfiguration for in-field logic updates while the system operates; JTAG programmability is supported.
  • Core logic Provides 1200 logic elements for implementing glue logic, state machines and small to medium control functions.
  • On-chip memory Approximately 9.4 Kbits of total on-chip RAM (9421 bits) suitable for distributed storage and small buffering tasks.
  • I/O and interface flexibility 73 I/Os with a programmable sysIO™ buffer supporting a wide range of standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, RSDS) for diverse interface requirements.
  • Clocking Includes sysCLOCK PLL support (family provides up to two analog PLLs; this device includes device-appropriate PLL resources) for clock multiplication, division and phase shift.
  • Power and low-power modes Core supply 1.14 V to 1.26 V; family-level sleep mode enables significant static current reduction for low-power operation.
  • Industrial temperature and mounting Grade: Industrial; operating temperature range −40 °C to 100 °C; surface-mount package.
  • Package 100‑pin LQFP package (supplier device package listed as 100‑TQFP, 14 × 14 mm) for standard PCB assembly and prototyping.
  • Standards and system support Family-level support for IEEE 1149.1 boundary scan and IEEE 1532 in-system programming; onboard oscillator available at the family level.
  • RoHS compliant Device is RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Glue logic and board-level control Implement address decoding, bus arbitration and custom control logic with compact, reconfigurable resources.
  • Bus bridging and interfacing Use the flexible I/O buffer and 73 I/Os to bridge between voltage domains and protocol variants on mixed-signal PCBs.
  • Power-up and system sequencing Leverage instant-on non-volatile configuration for deterministic power-up control and immediate system availability.
  • Peripheral and sensor interfacing Manage sensor aggregation, simple signal conditioning and peripheral control with on-chip RAM and programmable I/O.

Unique Advantages

  • Single-chip configuration: Eliminates the need for external configuration memory, reducing BOM and board complexity.
  • Instant-on behavior: Powers up in microseconds to accelerate system initialization and reduce system boot time.
  • Field reprogrammability: Background programming and TransFR reconfiguration enable in-field updates without full system downtime.
  • Industrial robustness: Industrial-grade temperature range (−40 °C to 100 °C) supports demanding environmental conditions.
  • Flexible interfacing: Wide-ranging sysIO buffer support and 73 I/Os simplify integration with multiple voltage levels and signaling standards.
  • Compact package: 100‑pin LQFP/TQFP (14 × 14 mm) balances pin count and PCB footprint for space-conscious designs.

Why Choose LCMXO1200E-3T100I?

The LCMXO1200E-3T100I positions itself as a compact, industrial-grade, non-volatile FPGA for system glue logic, interface bridging and control applications. Its combination of 1200 logic elements, approximately 9.4 Kbits of on-chip RAM, 73 flexible I/Os and instant-on single-chip configuration makes it suitable for designs that require fast startup, field updates and a small BOM footprint.

Designed for engineers focused on reliable, maintainable designs, this MachXO device integrates configuration, flexible I/O and power management features alongside ecosystem support from family-level design tools, enabling efficient development and deployment in industrial and embedded systems.

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