LCMXO1200E-3TN100I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP |
|---|---|
| Quantity | 239 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3TN100I – MachXO Field Programmable Gate Array (FPGA) IC, 1200 Logic Elements, 73 I/Os, 100-LQFP
The LCMXO1200E-3TN100I is a MachXO-family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general-purpose control logic. It integrates 1,200 logic elements, approximately 9.4 Kbits (9,421 bits) of on-chip RAM, and 73 I/Os in a 100-pin LQFP package to deliver instant-on, single-chip configurability without external configuration memory.
Designed for industrial applications, the device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.
Key Features
- Non-volatile, instant-on architecture Single-chip design with no external configuration memory required; provides instant-on and secure single-chip configuration.
- Logic capacity 1,200 logic elements suitable for glue logic and mid-density control logic implementations.
- On-chip memory Approximately 9.4 Kbits (9,421 bits) of embedded RAM for distributed and block memory needs.
- I/O and package 73 user I/Os in a 100-pin LQFP package (supplier lists 100-TQFP, 14×14 mm); surface-mount package for compact board designs.
- Power and temperature Core voltage specified at 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C for robust deployment.
- Reconfiguration and programming Supports in-system programming and background programming of non-volatile memory via JTAG; TransFR reconfiguration enables in-field logic updates while the system operates.
- Low-power mode Sleep mode provides significant static current reduction for power-sensitive applications.
- Flexible I/O buffer support Programmable I/O buffers support LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards.
- Clocking and system features Includes one analog PLL and system-level support such as IEEE 1149.1 boundary scan, onboard oscillator, and IEEE 1532 compliant in-system programming.
- Compliance RoHS compliant.
Typical Applications
- Glue Logic and System Control Implement glue logic and board-level control functions where single-chip instant-on and non-volatile configuration simplify system design.
- Bus Bridging and Interfacing Bridge between digital buses and implement protocol-limited interfacing leveraging flexible I/O buffer support.
- Power-Up Sequencing and Management Manage power-up control and sequencing with instant-on behavior and in-field programmable logic.
- Embedded Control and State Machines Implement control logic, state machines and small embedded functions that benefit from on-chip RAM and PLL-based clocking.
Unique Advantages
- Single-chip configurable solution: Eliminates the need for external configuration memory, simplifying BOM and board layout.
- Instant-on, secure configuration: Non-volatile architecture provides immediate availability at power-up and avoids external bitstream exposure.
- In-field reconfiguration (TransFR): Update SRAM-based logic while the system is operating to enable live firmware/logic upgrades.
- Broad interface flexibility: Programmable sysIO buffers support a wide range of signaling standards to interface with diverse peripherals and buses.
- Industrial readiness: Industrial-grade operating temperature range (−40 °C to 100 °C) and surface-mount package support deployment in demanding environments.
- Low-power modes: Sleep mode enables substantial static current reduction for power-sensitive designs.
Why Choose LCMXO1200E-3TN100I?
The LCMXO1200E-3TN100I positions itself as a compact, non-volatile FPGA option for designers needing instant-on, reconfigurable logic with moderate capacity. With 1,200 logic elements, on-chip RAM, a dedicated PLL, and 73 I/Os in a 100-pin LQFP package, it addresses common board-level tasks such as glue logic, bus interfacing, and power sequencing while reducing system complexity by removing external configuration memory.
This device is well suited to industrial applications requiring robust temperature performance and flexible I/O signaling. The MachXO family’s programming and toolchain support (including JTAG and in-system programming) help streamline development, field updates and long-term maintainability.
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