LCMXO1200E-3TN100I

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP

Quantity 239 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O73Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3TN100I – MachXO Field Programmable Gate Array (FPGA) IC, 1200 Logic Elements, 73 I/Os, 100-LQFP

The LCMXO1200E-3TN100I is a MachXO-family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general-purpose control logic. It integrates 1,200 logic elements, approximately 9.4 Kbits (9,421 bits) of on-chip RAM, and 73 I/Os in a 100-pin LQFP package to deliver instant-on, single-chip configurability without external configuration memory.

Designed for industrial applications, the device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

  • Non-volatile, instant-on architecture  Single-chip design with no external configuration memory required; provides instant-on and secure single-chip configuration.
  • Logic capacity  1,200 logic elements suitable for glue logic and mid-density control logic implementations.
  • On-chip memory  Approximately 9.4 Kbits (9,421 bits) of embedded RAM for distributed and block memory needs.
  • I/O and package  73 user I/Os in a 100-pin LQFP package (supplier lists 100-TQFP, 14×14 mm); surface-mount package for compact board designs.
  • Power and temperature  Core voltage specified at 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C for robust deployment.
  • Reconfiguration and programming  Supports in-system programming and background programming of non-volatile memory via JTAG; TransFR reconfiguration enables in-field logic updates while the system operates.
  • Low-power mode  Sleep mode provides significant static current reduction for power-sensitive applications.
  • Flexible I/O buffer support  Programmable I/O buffers support LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards.
  • Clocking and system features  Includes one analog PLL and system-level support such as IEEE 1149.1 boundary scan, onboard oscillator, and IEEE 1532 compliant in-system programming.
  • Compliance  RoHS compliant.

Typical Applications

  • Glue Logic and System Control  Implement glue logic and board-level control functions where single-chip instant-on and non-volatile configuration simplify system design.
  • Bus Bridging and Interfacing  Bridge between digital buses and implement protocol-limited interfacing leveraging flexible I/O buffer support.
  • Power-Up Sequencing and Management  Manage power-up control and sequencing with instant-on behavior and in-field programmable logic.
  • Embedded Control and State Machines  Implement control logic, state machines and small embedded functions that benefit from on-chip RAM and PLL-based clocking.

Unique Advantages

  • Single-chip configurable solution: Eliminates the need for external configuration memory, simplifying BOM and board layout.
  • Instant-on, secure configuration: Non-volatile architecture provides immediate availability at power-up and avoids external bitstream exposure.
  • In-field reconfiguration (TransFR): Update SRAM-based logic while the system is operating to enable live firmware/logic upgrades.
  • Broad interface flexibility: Programmable sysIO buffers support a wide range of signaling standards to interface with diverse peripherals and buses.
  • Industrial readiness: Industrial-grade operating temperature range (−40 °C to 100 °C) and surface-mount package support deployment in demanding environments.
  • Low-power modes: Sleep mode enables substantial static current reduction for power-sensitive designs.

Why Choose LCMXO1200E-3TN100I?

The LCMXO1200E-3TN100I positions itself as a compact, non-volatile FPGA option for designers needing instant-on, reconfigurable logic with moderate capacity. With 1,200 logic elements, on-chip RAM, a dedicated PLL, and 73 I/Os in a 100-pin LQFP package, it addresses common board-level tasks such as glue logic, bus interfacing, and power sequencing while reducing system complexity by removing external configuration memory.

This device is well suited to industrial applications requiring robust temperature performance and flexible I/O signaling. The MachXO family’s programming and toolchain support (including JTAG and in-system programming) help streamline development, field updates and long-term maintainability.

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