LCMXO1200E-5FTN256C

The LCMXO1200E-5FTN256C is a MachXO family FPGA device offering 1,200 logic elements and a high I/O count in a compact BGA package. It delivers non-volatile, reconfigurable logic with fast power-up characteristics and on-chip memory, targeting glue logic, bus interfacing, power-up control, and general control applications in commercial-temperature systems.

Key Features

• Core Logic — 1,200 logic elements for implementing glue logic, control paths, and small- to mid-size finite state machines.
• I/O Density — 211 I/Os to support wide peripheral and bus connectivity without external multiplexing.
• On-chip Memory — Approximately 9.4 Kbits (9,421 bits) of on-chip RAM for small buffers, state storage, and distributed memory needs.
• Non-volatile, Instant-on — Single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
• Reconfiguration and Background Programming — Supports in-field reconfiguration and background programming of non-volatile memory for updates while minimizing system downtime.
• Clocking — Integrated PLL support as provided in the MachXO family for clock multiplication, division, and phase shifting.
• Power — Core supply specified at 1.14 V to 1.26 V to match low-voltage system domains; includes a sleep mode to reduce static current.
• Package & Mounting — Supplied in a 256-ball ftBGA (17×17 mm) / 256-LBGA case for low-profile surface-mount applications.
• Temperature & Compliance — Commercial operating range (0 °C to 85 °C) and RoHS-compliant packaging.

Typical Applications

• Glue Logic & Bus Bridging — Implement address decoding, bus arbitration, level translation, and protocol bridging with high I/O availability.
• Power-up and Reset Control — Fast, deterministic startup and non-volatile configuration make it suitable for system sequencing and power management logic.
• System Control & Peripheral Management — Centralize control functions, I/O aggregation, and small state-machine tasks to reduce BOM and simplify PCB routing.
• Field Upgradeable Logic — Support in-field updates and background programming to revise control logic or add features without replacing hardware.

Unique Advantages

• Single-chip Non-volatile Configuration: Eliminates external configuration memory and provides instant-on capability for faster system availability.
• High I/O Count with Moderate Logic Density: 211 I/Os paired with 1,200 logic elements let you connect numerous peripherals while retaining sufficient logic for glue and control tasks.
• Compact, Surface-mount Package: 256-ball ftBGA (17×17 mm) packaging minimizes PCB footprint while offering robust pin count for complex interfacing.
• Low-voltage Core Operation: Core supply specified between 1.14 V and 1.26 V to align with low-voltage system rails and modern power domains.
• In-field Reconfiguration & Background Programming: Update non-volatile logic with minimal system interruption, enabling feature upgrades and bug fixes in the field.
• Commercial Temperature and RoHS Compliance: Designed for commercial-grade environments and compliant packaging for standard production requirements.

Why Choose LCMXO1200E-5FTN256C?

The LCMXO1200E-5FTN256C balances I/O density and programmable logic in a non-volatile, instant-on FPGA package suited for glue logic, bus interfacing, control, and power sequencing tasks. Its combination of 1,200 logic elements, approximately 9.4 Kbits of on-chip RAM, and 211 I/Os in a compact 256-ball ftBGA package makes it a practical choice for commercial designs that require flexible, reprogrammable logic without external configuration memory.

Designed to support in-field updates, background programming, and low-voltage core operation, this device is a strong fit for teams focused on reducing BOM complexity and accelerating system startup while retaining the ability to evolve logic post-deployment.

Request a quote or submit an inquiry to obtain pricing and lead-time information for the LCMXO1200E-5FTN256C and evaluate its fit for your next design.