LCMXO1200E-5BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,249 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-5BN256C – MachXO Field Programmable Gate Array (FPGA) IC, 1200 logic elements, 211 I/O, 256-ball BGA
The LCMXO1200E-5BN256C is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic tasks. It combines LUT-based logic with on-chip memory and programmable I/O to deliver a compact, single-chip solution for commercial embedded designs.
This device offers non-volatile, instant-on operation with no external configuration memory required, 1200 logic elements, 211 I/O pins in a 256-ball package, and a supply voltage range of 1.14 V to 1.26 V. It is specified for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core Logic — Provides 1200 logic elements for implementing combinational and sequential logic; architecture uses LUT-based logic for flexible resource mapping.
- On-chip Memory — Total on-chip RAM of 9421 bits to support small embedded memories and control-state storage.
- High I/O Count — Up to 211 programmable I/O pins to support complex interfacing and bus connections.
- Non-volatile, Instant-on — Single-chip non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
- Reconfiguration and In-field Updates — Supports SRAM reconfiguration in milliseconds and TransFR™ Reconfiguration for in-field logic updates while the system operates.
- Power and Low-Power Modes — Operates from 1.14 V to 1.26 V and includes a Sleep Mode that enables substantial static current reduction for power-sensitive systems.
- Clocking — Includes an analog sysCLOCK PLL (family support) for clock multiply/divide and phase adjustments appropriate for timing-critical interfaces.
- Package & Thermal — Available in 256-ball caBGA / LFBGA package (14×14 mm); commercial-grade operation from 0 °C to 85 °C.
- Standards & Programming — Supports JTAG programming and background programming of non-volatile memory for flexible development and deployment workflows.
Typical Applications
- Glue Logic — Implements glue logic between discrete ICs to reduce component count and simplify PCB routing.
- Bus Bridging — Performs protocol translation and bus bridging tasks where flexible I/O and on-chip logic are required.
- Bus Interfacing — Handles signal conditioning, buffering and interface adaptation across parallel and serial buses.
- Power-up Control — Manages system initialization and sequencing with instant-on, single-chip configuration to ensure predictable startup behavior.
- General Control Logic — Hosts state machines, control sequencing and peripheral aggregation for embedded systems.
Unique Advantages
- Single-chip non-volatile configuration: Eliminates external configuration memory and secures design bitstreams without added components.
- Instant-on behavior: Powers up in microseconds to accelerate system boot and reduce startup latency.
- High pin-to-logic density: 211 I/O pins combined with 1200 logic elements give designers the flexibility to implement complex interfaces within a compact footprint.
- In-field reconfiguration: TransFR™ and background programming let you update logic while the system is running, minimizing downtime.
- Low-power support: Sleep Mode enables significant static current reduction for energy-conscious designs.
- Compact BGA package: 256-ball (14×14 mm) package options allow high I/O count in a small PCB area for space-constrained applications.
Why Choose LCMXO1200E-5BN256C?
The LCMXO1200E-5BN256C positions itself as a practical, highly integrated FPGA choice for commercial embedded applications that require instant-on operation, flexible I/O and reliable on-chip memory. With 1200 logic elements, 211 I/Os and non-volatile configuration, it reduces BOM complexity and accelerates system startup while enabling in-field updates and low-power operation.
This device is well-suited for engineers building control, interface and sequencing functions in compact systems that operate within a commercial temperature range. Support for standard JTAG programming and family design flows makes development and deployment straightforward for production designs.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO1200E-5BN256C and to discuss how it fits your next embedded design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016