LCMXO1200E-5BN256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA

Quantity 1,249 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-5BN256C – MachXO Field Programmable Gate Array (FPGA) IC, 1200 logic elements, 211 I/O, 256-ball BGA

The LCMXO1200E-5BN256C is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic tasks. It combines LUT-based logic with on-chip memory and programmable I/O to deliver a compact, single-chip solution for commercial embedded designs.

This device offers non-volatile, instant-on operation with no external configuration memory required, 1200 logic elements, 211 I/O pins in a 256-ball package, and a supply voltage range of 1.14 V to 1.26 V. It is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Core Logic — Provides 1200 logic elements for implementing combinational and sequential logic; architecture uses LUT-based logic for flexible resource mapping.
  • On-chip Memory — Total on-chip RAM of 9421 bits to support small embedded memories and control-state storage.
  • High I/O Count — Up to 211 programmable I/O pins to support complex interfacing and bus connections.
  • Non-volatile, Instant-on — Single-chip non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory.
  • Reconfiguration and In-field Updates — Supports SRAM reconfiguration in milliseconds and TransFR™ Reconfiguration for in-field logic updates while the system operates.
  • Power and Low-Power Modes — Operates from 1.14 V to 1.26 V and includes a Sleep Mode that enables substantial static current reduction for power-sensitive systems.
  • Clocking — Includes an analog sysCLOCK PLL (family support) for clock multiply/divide and phase adjustments appropriate for timing-critical interfaces.
  • Package & Thermal — Available in 256-ball caBGA / LFBGA package (14×14 mm); commercial-grade operation from 0 °C to 85 °C.
  • Standards & Programming — Supports JTAG programming and background programming of non-volatile memory for flexible development and deployment workflows.

Typical Applications

  • Glue Logic — Implements glue logic between discrete ICs to reduce component count and simplify PCB routing.
  • Bus Bridging — Performs protocol translation and bus bridging tasks where flexible I/O and on-chip logic are required.
  • Bus Interfacing — Handles signal conditioning, buffering and interface adaptation across parallel and serial buses.
  • Power-up Control — Manages system initialization and sequencing with instant-on, single-chip configuration to ensure predictable startup behavior.
  • General Control Logic — Hosts state machines, control sequencing and peripheral aggregation for embedded systems.

Unique Advantages

  • Single-chip non-volatile configuration: Eliminates external configuration memory and secures design bitstreams without added components.
  • Instant-on behavior: Powers up in microseconds to accelerate system boot and reduce startup latency.
  • High pin-to-logic density: 211 I/O pins combined with 1200 logic elements give designers the flexibility to implement complex interfaces within a compact footprint.
  • In-field reconfiguration: TransFR™ and background programming let you update logic while the system is running, minimizing downtime.
  • Low-power support: Sleep Mode enables significant static current reduction for energy-conscious designs.
  • Compact BGA package: 256-ball (14×14 mm) package options allow high I/O count in a small PCB area for space-constrained applications.

Why Choose LCMXO1200E-5BN256C?

The LCMXO1200E-5BN256C positions itself as a practical, highly integrated FPGA choice for commercial embedded applications that require instant-on operation, flexible I/O and reliable on-chip memory. With 1200 logic elements, 211 I/Os and non-volatile configuration, it reduces BOM complexity and accelerates system startup while enabling in-field updates and low-power operation.

This device is well-suited for engineers building control, interface and sequencing functions in compact systems that operate within a commercial temperature range. Support for standard JTAG programming and family design flows makes development and deployment straightforward for production designs.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO1200E-5BN256C and to discuss how it fits your next embedded design.

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