LCMXO1200E-5FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 729 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-5FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA
The LCMXO1200E-5FT256C is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile, infinitely reconfigurable architecture with instant-on behavior and on-chip resources to deliver flexible, single‑chip system logic integration.
This surface-mount device offers a balance of logic density, on-chip memory and I/O count suited to commercial embedded and control applications where rapid startup, security of configuration and in-field updates are important.
Key Features
- Non-volatile, instant-on configuration Single-chip non-volatile architecture provides instant-on operation and eliminates the need for external configuration memory.
- Reconfigurable logic Approximately 1,200 logic elements enable flexible implementation of glue logic, control functions and bus adapters.
- On-chip RAM Approximately 9.4 Kbits (9,421 bits) of on-chip RAM for embedded and distributed memory needs.
- High I/O density Up to 211 I/O pins available in the 256-ball package to support complex board-level interfacing.
- Flexible I/O buffer standards Programmable sysIO buffer supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- In-field reconfiguration (TransFR™) Supports background and in-field logic updates to modify SRAM-based logic while the system continues to operate.
- Low-power modes Sleep mode capability provides significant static current reduction for power-sensitive applications.
- Clock management Includes sysCLOCK PLL resources (family documentation shows up to one PLL for this density) for clock multiply/divide and phase shifting.
- Commercial temperature grade Rated for operation from 0 °C to 85 °C.
- Package and mounting 256-ball ftBGA (17 × 17 mm) package, surface mount; RoHS compliant.
- Supply voltage Core supply specified at 1.14 V to 1.26 V.
Typical Applications
- Glue Logic Implement board-level control, signal routing and protocol handshaking with compact, non-volatile logic.
- Bus Bridging and Interfacing Use the device’s high I/O count and flexible I/O standards to implement bus adapters and level translation.
- Power-up and System Control Instant-on behavior and single-chip configuration simplify power sequencing and startup control tasks.
- Field-upgradable Control Logic TransFR and background programming enable in-field updates to control algorithms and user logic without external configuration memory.
Unique Advantages
- Instant-on, secure configuration: Non-volatile single-chip architecture removes the need for external configuration storage and reduces configuration exposure.
- High pin count in a compact package: 211 I/Os in a 256-ball ftBGA (17×17 mm) supports dense board-level connectivity while minimizing PCB area.
- Balanced logic and memory: ~1,200 logic elements combined with ~9.4 Kbits of on-chip RAM supports a range of control and buffering tasks on a single device.
- In-field flexibility: TransFR reconfiguration and background programming enable rapid updates and iterative development without system downtime.
- Power management options: Sleep mode capability provides substantial static current reduction for power-conscious designs.
- Proven development ecosystem: Family-level tooling (ispLEVER support referenced in the MachXO family documentation) facilitates design implementation and migration within the MachXO family.
Why Choose LCMXO1200E-5FT256C?
The LCMXO1200E-5FT256C positions itself as a versatile, non-volatile FPGA for commercial embedded and control applications that require rapid startup, reliable single‑chip configuration and flexible in-field updates. Its combination of ~1,200 logic elements, approximately 9.4 Kbits of on-chip RAM and up to 211 I/Os in a compact ftBGA package make it well suited for glue logic, bus interfacing, system control and similar tasks.
With family-level support for programmable I/O standards, PLL-based clock management and development tools referenced in MachXO documentation, this device is appropriate for teams seeking a scalable, reprogrammable solution that reduces external BOM and simplifies board-level integration.
Request a quote or submit an inquiry to learn more about availability and pricing for the LCMXO1200E-5FT256C. Our team can provide purchasing details and help match the device to your design needs.

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