LCMXO1200E-5FT256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 729 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-5FT256C – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

The LCMXO1200E-5FT256C is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile, infinitely reconfigurable architecture with instant-on behavior and on-chip resources to deliver flexible, single‑chip system logic integration.

This surface-mount device offers a balance of logic density, on-chip memory and I/O count suited to commercial embedded and control applications where rapid startup, security of configuration and in-field updates are important.

Key Features

  • Non-volatile, instant-on configuration  Single-chip non-volatile architecture provides instant-on operation and eliminates the need for external configuration memory.
  • Reconfigurable logic  Approximately 1,200 logic elements enable flexible implementation of glue logic, control functions and bus adapters.
  • On-chip RAM  Approximately 9.4 Kbits (9,421 bits) of on-chip RAM for embedded and distributed memory needs.
  • High I/O density  Up to 211 I/O pins available in the 256-ball package to support complex board-level interfacing.
  • Flexible I/O buffer standards  Programmable sysIO buffer supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
  • In-field reconfiguration (TransFR™)  Supports background and in-field logic updates to modify SRAM-based logic while the system continues to operate.
  • Low-power modes  Sleep mode capability provides significant static current reduction for power-sensitive applications.
  • Clock management  Includes sysCLOCK PLL resources (family documentation shows up to one PLL for this density) for clock multiply/divide and phase shifting.
  • Commercial temperature grade  Rated for operation from 0 °C to 85 °C.
  • Package and mounting  256-ball ftBGA (17 × 17 mm) package, surface mount; RoHS compliant.
  • Supply voltage  Core supply specified at 1.14 V to 1.26 V.

Typical Applications

  • Glue Logic  Implement board-level control, signal routing and protocol handshaking with compact, non-volatile logic.
  • Bus Bridging and Interfacing  Use the device’s high I/O count and flexible I/O standards to implement bus adapters and level translation.
  • Power-up and System Control  Instant-on behavior and single-chip configuration simplify power sequencing and startup control tasks.
  • Field-upgradable Control Logic  TransFR and background programming enable in-field updates to control algorithms and user logic without external configuration memory.

Unique Advantages

  • Instant-on, secure configuration: Non-volatile single-chip architecture removes the need for external configuration storage and reduces configuration exposure.
  • High pin count in a compact package: 211 I/Os in a 256-ball ftBGA (17×17 mm) supports dense board-level connectivity while minimizing PCB area.
  • Balanced logic and memory: ~1,200 logic elements combined with ~9.4 Kbits of on-chip RAM supports a range of control and buffering tasks on a single device.
  • In-field flexibility: TransFR reconfiguration and background programming enable rapid updates and iterative development without system downtime.
  • Power management options: Sleep mode capability provides substantial static current reduction for power-conscious designs.
  • Proven development ecosystem: Family-level tooling (ispLEVER support referenced in the MachXO family documentation) facilitates design implementation and migration within the MachXO family.

Why Choose LCMXO1200E-5FT256C?

The LCMXO1200E-5FT256C positions itself as a versatile, non-volatile FPGA for commercial embedded and control applications that require rapid startup, reliable single‑chip configuration and flexible in-field updates. Its combination of ~1,200 logic elements, approximately 9.4 Kbits of on-chip RAM and up to 211 I/Os in a compact ftBGA package make it well suited for glue logic, bus interfacing, system control and similar tasks.

With family-level support for programmable I/O standards, PLL-based clock management and development tools referenced in MachXO documentation, this device is appropriate for teams seeking a scalable, reprogrammable solution that reduces external BOM and simplifies board-level integration.

Request a quote or submit an inquiry to learn more about availability and pricing for the LCMXO1200E-5FT256C. Our team can provide purchasing details and help match the device to your design needs.

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