LCMXO2-1200HC-4SG32I

The LCMXO2-1200HC-4SG32I is a MachXO2 family Field Programmable Gate Array (FPGA) IC offering 1,280 logic elements and 21 general-purpose I/Os in a compact 32‑UFQFN exposed pad package. Designed for embedded and industrial applications, it combines non-volatile configuration, on-chip memory resources and flexible I/O support to implement control, interface and glue-logic functions.

With a single-chip FPGA architecture that supports instant-on behavior and in-field reconfiguration, this device targets designs that require low-power standby modes, moderate logic density and reliable operation across an extended industrial temperature range.

Key Features

• Core Logic — 1,280 logic elements (LUT-based resources) suitable for mid-density control, bridging and glue-logic tasks.
• On-chip Memory — Approximately 65,536 bits (64 kbits) of embedded RAM for small FIFOs, buffering and state storage; includes on-chip user flash memory for configuration storage.
• I/O and Interfaces — 21 I/O pins available for a variety of interfaces and peripheral connections; I/O behavior and standards are supported across the MachXO2 family.
• Power — Single-supply operation across a nominal range of 2.375 V to 3.465 V, enabling use with common system rails.
• Package and Mounting — 32‑UFQFN exposed pad (5 mm × 5 mm) surface-mount package optimized for compact PCB layouts.
• Industrial Temperature Range — Specified operation from −40 °C to 100 °C for robust performance in industrial environments.
• Non-volatile, Reconfigurable — MachXO2 family features include instant-on, in-field reconfiguration and non-volatile user memory for boot and configuration storage.
• Compliance — RoHS-compliant device construction.

Typical Applications

• Industrial Control — Implement control logic, protocol translation and peripheral interfacing where extended temperature operation and reliable non-volatile configuration are required.
• Interface and Glue Logic — Bridge between system blocks, handle signal conditioning and manage custom handshakes with flexible I/O and embedded memory.
• Embedded Systems — Integrate small state machines, startup/configuration controllers, and user-defined peripherals using on-chip flash and RAM.
• Instrumentation and Test — Provide customizable front-end logic and timing functions in compact footprints while maintaining industrial-grade temperature support.

Unique Advantages

• Compact, manufacturable package: The 32‑UFQFN exposed pad (5×5 mm) enables a small PCB footprint while supporting surface-mount assembly and thermal dissipation via the exposed pad.
• Single-supply flexibility: Operation from 2.375 V to 3.465 V reduces BOM complexity and eases integration with common system power rails.
• Non-volatile, instant-on operation: Built-in user flash and MachXO2 architecture allow fast startup and field reconfiguration without external configuration memory.
• Industrial-grade operating range: Specified for −40 °C to 100 °C, supporting reliable deployment in industrial environments.
• Balanced logic and memory resources: 1,280 logic elements combined with ~64 kbits of RAM provide adequate capacity for mid-density control, buffering and small custom peripherals.

Why Choose LCMXO2-1200HC-4SG32I?

The LCMXO2-1200HC-4SG32I positions itself as a practical, mid-density FPGA solution for designers needing non-volatile configuration, modest logic capacity and compact packaging. Its mix of 1,280 logic elements, approximately 64 kbits of on-chip RAM and 21 I/Os makes it well suited to control, interface and embedded tasks where instant-on behavior and industrial temperature capability are important.

Choose this MachXO2 device when your design requires a reliable, reconfigurable single-chip solution that simplifies system architecture, reduces external components for configuration, and supports deployment across a wide temperature range with RoHS-compliant packaging.

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