LCMXO2-1200HC-4TG100IR1

The LCMXO2-1200HC-4TG100IR1 is a MachXO2 family field programmable gate array (FPGA) offered in a 100‑pin LQFP package. It provides 1,280 logic elements and 79 I/Os in a surface-mount, industrial‑grade device designed for control, interface bridging, and system glue logic in industrial and embedded applications.

Built on the MachXO2 family architecture, the device combines flexible logic, embedded memory, on‑chip nonvolatile features, and configurable I/O to deliver low-power reconfigurable logic with a broad range of system‑level support options.

Key Features

• Core Logic — 1,280 logic elements suitable for glue logic, control and small to mid-density programmable functions.
• Embedded Memory — Total RAM: 65,536 bits (approximately 64 kbits) of on‑chip memory for FIFOs, small buffers, and state storage.
• I/O Capacity & Flexibility — 79 programmable I/Os with support for differential signaling and on‑chip termination options as provided by the MachXO2 family.
• Low Power Operation — Family features include an advanced 65 nm low‑power process and standby modes; family standby power can be as low as 22 µW.
• Nonvolatile and Reconfigurable — MachXO2 family supports on‑chip user flash and instant‑on, with background programming and in‑field reconfiguration (TransFR™) as part of the family feature set.
• Clocking & PLLs — Flexible on‑chip clocking with multiple primary clocks and up to two analog PLLs per device (family capability) for fractional‑n frequency synthesis.
• Package & Environmental — 100‑pin LQFP package (supplier device package listed as 100‑TQFP, 14 × 14 mm); surface‑mount; RoHS compliant; industrial operating temperature −40 °C to 100 °C.
• Supply Voltage Range — Single‑supply operation across 2.375 V to 3.465 V to support a variety of system power rails.

Typical Applications

• Industrial Control — Use for protocol bridging, sensor interface logic, and real‑time control tasks that benefit from reprogrammable logic and extended temperature range.
• Embedded System Glue Logic — Implement custom bus interfaces, chip enable sequencing, and peripheral arbitration to reduce component count and simplify PCB design.
• Human‑Machine Interfaces (HMI) — Drive and manage display I/Os, rotary encoders, and button arrays with configurable I/O and small on‑chip memory for buffering.
• Test & Measurement — Implement timing, capture, and simple signal processing functions where instant‑on behavior and in‑field updates are beneficial.

Unique Advantages

• Compact, Reprogrammable Integration: 1,280 logic elements and integrated memory enable consolidation of glue logic and interface functions into a single, reprogrammable device.
• Low Power Standby: Family low‑power design and standby modes help minimize power draw in always‑on or battery‑assisted systems.
• Flexible I/O Support: 79 I/Os and MachXO2 family programmable sysIO buffers support a wide range of signaling standards and on‑chip termination, simplifying board‑level interfacing.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliability in industrial and harsh‑environment deployments.
• Single Supply Operation: Broad supply range (2.375 V to 3.465 V) allows direct integration with common system rails.
• Nonvolatile, Field‑Updatable: MachXO2 family nonvolatile configuration and TransFR reconfiguration support in‑field updates without external volatile configuration devices.

Why Choose LCMXO2-1200HC-4TG100IR1?

This MachXO2 device is positioned for designers who need a compact, industrial‑grade FPGA to consolidate interface logic, implement custom control functions, and enable in‑field updates. With 1,280 logic elements, approximately 64 kbits of embedded RAM, flexible I/O, and a broad single‑supply voltage window, it fits a wide range of embedded and industrial use cases where reprogrammability, low power, and extended temperature operation matter.

Choosing this part delivers a scalable, reconfigurable solution backed by the MachXO2 family feature set—offering on‑chip nonvolatile resources, flexible clocking, and family‑level I/O capabilities—to simplify BOM, shorten development cycles, and support long‑life deployed systems.

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