LCMXO2-1200HC-4TG100I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP |
|---|---|
| Quantity | 929 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200HC-4TG100I – MachXO2 Field Programmable Gate Array (FPGA), 1280 logic elements, 65,536-bit RAM, 79 I/Os, 100‑LQFP
The LCMXO2-1200HC-4TG100I is a MachXO2 family FPGA in a 100‑pin LQFP surface-mount package, offering 1,280 logic elements and 65,536 bits of on-chip RAM. Designed for industrial-grade embedded and system-control roles, it combines non-volatile configuration, flexible I/O and low-power operation for control, interface bridging and system-management tasks.
Key Features
- Core Logic 1,280 logic elements provide the programmable fabric for glue logic, protocol translation and control functions.
- Embedded Memory 65,536 bits (approximately 64 kbits) of on-chip RAM for FIFOs, state storage and small data buffers.
- I/O Capacity and Flexibility 79 I/Os in a 100‑pin package with family-level support for a wide range of interface standards and programmable buffer modes.
- On‑chip Non‑volatile User Flash Family-level MachXO2 devices include on-chip user flash for instant-on configuration and in-field updates; user flash supports background programming and robust rewrite cycles.
- Clocking and PLL Device-level clock resources include primary clocks and an analog PLL for flexible timing and high-speed interface support.
- Low Power Operation Built on an advanced low-power process; family devices support standby and other power-saving modes to reduce system power consumption.
- Packaging and Mounting Surface-mount 100‑LQFP package (supplier device package listed as 100‑TQFP, 14×14 mm) for ease of PCB assembly in space-constrained designs.
- Industrial Grade and Temperature Range Industrial-grade device rated for operation from −40 °C to 100 °C.
- Regulatory and Environmental RoHS compliant.
Typical Applications
- Industrial Control Implement control logic, sensor interfacing and deterministic glue logic that require industrial-temperature operation and reliable non-volatile configuration.
- Interface Bridging Translate between legacy and modern interfaces or act as a protocol bridge using the device’s flexible I/O and programmable logic.
- System Management and Boot Control Provide board-level supervision, secure instant-on configuration and in-field reconfiguration capabilities for embedded systems.
- Memory and Display Interfaces Support source-synchronous and DDR-style I/O patterns for display or external-memory interface control where precise timing is needed.
Unique Advantages
- Non‑volatile, instant-on configuration: Enables secure single-chip configuration without external volatile memory, simplifying power-up behavior and system design.
- Compact, industrial-grade package: 100‑pin LQFP surface-mount package with −40 °C to 100 °C rating supports rugged embedded deployments.
- On‑chip RAM for fast local buffering: 65,536 bits of embedded RAM reduce dependency on external memory for small FIFO and state-storage needs.
- Flexible I/O and clocking: 79 programmable I/Os and device clocking resources enable tailored interface timing and protocol support.
- Low-power options: Family-level power-saving modes and low standby power reduce system energy consumption in idle or low-activity states.
- RoHS compliant and surface-mount ready: Streamlines manufacturing and regulatory acceptance for commercial and industrial products.
Why Choose LCMXO2-1200HC-4TG100I?
This MachXO2 device balances programmable logic density, embedded RAM and flexible I/O in a compact, industrial-grade package. It is well suited to designers who need reliable non-volatile configuration, local buffering and versatile interface control in systems operating across a wide temperature range.
For teams targeting control, interface bridging or system-management roles, the LCMXO2-1200HC-4TG100I delivers a scalable, low-power FPGA option with the configuration and I/O features necessary to simplify BOM and accelerate time-to-market.
Request a quote or submit an inquiry to receive pricing and availability for LCMXO2-1200HC-4TG100I. Our team can provide lead-time and ordering information to support your design schedule.

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