LCMXO2-1200HC-4TG100I

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP

Quantity 929 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O79Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200HC-4TG100I – MachXO2 Field Programmable Gate Array (FPGA), 1280 logic elements, 65,536-bit RAM, 79 I/Os, 100‑LQFP

The LCMXO2-1200HC-4TG100I is a MachXO2 family FPGA in a 100‑pin LQFP surface-mount package, offering 1,280 logic elements and 65,536 bits of on-chip RAM. Designed for industrial-grade embedded and system-control roles, it combines non-volatile configuration, flexible I/O and low-power operation for control, interface bridging and system-management tasks.

Key Features

  • Core Logic  1,280 logic elements provide the programmable fabric for glue logic, protocol translation and control functions.
  • Embedded Memory  65,536 bits (approximately 64 kbits) of on-chip RAM for FIFOs, state storage and small data buffers.
  • I/O Capacity and Flexibility  79 I/Os in a 100‑pin package with family-level support for a wide range of interface standards and programmable buffer modes.
  • On‑chip Non‑volatile User Flash  Family-level MachXO2 devices include on-chip user flash for instant-on configuration and in-field updates; user flash supports background programming and robust rewrite cycles.
  • Clocking and PLL  Device-level clock resources include primary clocks and an analog PLL for flexible timing and high-speed interface support.
  • Low Power Operation  Built on an advanced low-power process; family devices support standby and other power-saving modes to reduce system power consumption.
  • Packaging and Mounting  Surface-mount 100‑LQFP package (supplier device package listed as 100‑TQFP, 14×14 mm) for ease of PCB assembly in space-constrained designs.
  • Industrial Grade and Temperature Range  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Regulatory and Environmental  RoHS compliant.

Typical Applications

  • Industrial Control  Implement control logic, sensor interfacing and deterministic glue logic that require industrial-temperature operation and reliable non-volatile configuration.
  • Interface Bridging  Translate between legacy and modern interfaces or act as a protocol bridge using the device’s flexible I/O and programmable logic.
  • System Management and Boot Control  Provide board-level supervision, secure instant-on configuration and in-field reconfiguration capabilities for embedded systems.
  • Memory and Display Interfaces  Support source-synchronous and DDR-style I/O patterns for display or external-memory interface control where precise timing is needed.

Unique Advantages

  • Non‑volatile, instant-on configuration: Enables secure single-chip configuration without external volatile memory, simplifying power-up behavior and system design.
  • Compact, industrial-grade package: 100‑pin LQFP surface-mount package with −40 °C to 100 °C rating supports rugged embedded deployments.
  • On‑chip RAM for fast local buffering: 65,536 bits of embedded RAM reduce dependency on external memory for small FIFO and state-storage needs.
  • Flexible I/O and clocking: 79 programmable I/Os and device clocking resources enable tailored interface timing and protocol support.
  • Low-power options: Family-level power-saving modes and low standby power reduce system energy consumption in idle or low-activity states.
  • RoHS compliant and surface-mount ready: Streamlines manufacturing and regulatory acceptance for commercial and industrial products.

Why Choose LCMXO2-1200HC-4TG100I?

This MachXO2 device balances programmable logic density, embedded RAM and flexible I/O in a compact, industrial-grade package. It is well suited to designers who need reliable non-volatile configuration, local buffering and versatile interface control in systems operating across a wide temperature range.

For teams targeting control, interface bridging or system-management roles, the LCMXO2-1200HC-4TG100I delivers a scalable, low-power FPGA option with the configuration and I/O features necessary to simplify BOM and accelerate time-to-market.

Request a quote or submit an inquiry to receive pricing and availability for LCMXO2-1200HC-4TG100I. Our team can provide lead-time and ordering information to support your design schedule.

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