LCMXO2-1200HC-6TG144IR1

The LCMXO2-1200HC-6TG144IR1 is a MachXO2 family Field Programmable Gate Array (FPGA) in a 144‑pin LQFP package designed for industrial-grade embedded control and I/O consolidation. It provides 1280 logic elements, approximately 64 kbits of on-chip RAM, and 107 general-purpose I/Os in a compact surface-mount 144‑LQFP footprint.

As part of the MachXO2 family, this device targets system control, glue logic, and I/O expansion use cases where non‑volatile, reconfigurable logic, low-power operation and robust I/O options are required for industrial environments.

Key Features

• Logic Capacity — 1280 logic elements, suitable for glue logic, state machines, and control functions in embedded systems.
• Embedded Memory — 65,536 bits (approximately 64 kbits) of on‑chip RAM for distributed storage and buffering.
• I/O Density & Flexibility — 107 I/Os available in the 144‑pin package, enabling broad sensor, peripheral and bus interfacing.
• Voltage & Power — Single supply operation across a wide range: 2.375 V to 3.465 V to support a variety of system rails.
• Clocking and PLL — MachXO2 family clocking features including primary clocks and analog PLL(s) at the family level to support timing-critical interfaces.
• On‑Chip Non‑Volatile Configuration — MachXO2 family supports on‑chip user flash and instant‑on reconfiguration features for simplified board-level design and in‑field updates.
• Industrial Grade — Specified for operation from -40 °C to 100 °C, suitable for industrial environments.
• Package & Mounting — Surface mount 144‑LQFP (supplier device package: 144‑TQFP, 20 × 20 mm) for easy PCB integration and assembly.
• Embedded System Functions — Family-level hardened functions such as SPI, I2C and timers provide system-level peripherals without consuming logic resources.

Typical Applications

• Industrial Control — Implement machine control, sequencing and deterministic state machines with industrial temperature support and flexible I/O.
• I/O Expansion & Protocol Bridging — Consolidate multiple peripheral interfaces or implement bus bridging using abundant I/Os and on‑chip logic.
• System Glue Logic — Replace discrete logic and CPLDs with a single reconfigurable device for board-level integration and BOM reduction.
• Embedded System Management — Host system monitors, SPI/I2C peripherals and boot-time configuration using on‑chip flash and family-level peripheral support.

Unique Advantages

• Compact, High‑I/O Footprint — 107 I/Os in a 144‑LQFP package enable dense interfacing without a larger BGA footprint.
• Non‑Volatile, Reconfigurable — MachXO2 family instant‑on and on‑chip flash capability allow persistent configurations and in‑field updates without external configuration PROM.
• Industrial Temperature Range — Rated from -40 °C to 100 °C for deployable performance in harsh operating environments.
• Flexible Power Input — Wide supply range (2.375 V–3.465 V) simplifies power rail compatibility across designs.
• On‑Chip System Peripherals — Built‑in SPI, I2C and timer functions reduce external component count and free fabric resources for application logic.
• Surface‑Mount Integration — 144‑pin LQFP surface-mount package supports standard PCB assembly processes and simplifies prototyping and production.

Why Choose LCMXO2-1200HC-6TG144IR1?

This MachXO2 device balances logic capacity, embedded memory and high I/O count in a surface-mount 144‑LQFP package tailored for industrial embedded designs. It is well suited for engineers seeking a non‑volatile, reconfigurable device that consolidates glue logic, I/O expansion and system management functions while operating across a wide supply and temperature range.

With family-level features such as on‑chip flash, hardened SPI/I2C peripherals and flexible clocking, the LCMXO2-1200HC-6TG144IR1 offers a practical platform for scalable designs that require reliable operation and in‑field configurability.

Request a quote or submit an RFQ for the LCMXO2-1200HC-6TG144IR1 to obtain pricing and lead-time information for your next design.