LCMXO2-1200UHC-4FTG256I

The LCMXO2-1200UHC-4FTG256I is a MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It delivers a flexible logic architecture with 1280 logic elements and approximately 75.8 kbits of on-chip RAM, coupled with a high I/O count of 206 pins in a 256-ball ftBGA package.

Designed for industrial applications, this surface-mount device supports a wide supply range (2.375 V to 3.465 V) and an operating temperature range of -40 °C to 100 °C, providing a reconfigurable, low-power solution for control, interface, and glue-logic functions in embedded systems.

Key Features

• Logic Capacity — 1280 logic elements suitable for medium-density glue logic, control paths, and combinational/sequential logic integration.
• Embedded Memory — 75,776 bits (approximately 75.8 kbits) of on-chip RAM for FIFOs, small buffers, and distributed storage.
• High I/O Density — 206 user I/Os in a 256-ball ftBGA footprint (17 mm × 17 mm supplier package), enabling rich interfacing and board-level connectivity.
• Flexible Power — Single supply operation across 2.375 V to 3.465 V simplifies power-rail planning and integration with common system voltages.
• Industrial Operating Range — Rated for -40 °C to 100 °C operation for reliability in industrial environments.
• Family-Level Capabilities — MachXO2 family features include low-power operation, on-chip user Flash, programmable I/O buffer types, and in-field reconfiguration, enabling instant-on and secure single-chip solutions.
• Package & Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FTBGA, 17×17) for compact board integration and automated assembly.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control — Reconfigurable logic and I/O density for machine control, signal conditioning, and real-time interface tasks in industrial equipment.
• Interface Bridging — High I/O count and flexible I/O standards (MachXO2 family feature set) support bridging between processors, memory interfaces, and peripherals.
• Display and Memory I/O — Family support for source-synchronous and geared display I/Os and DDR-style interfaces makes the device suitable for display controllers and memory interface logic.
• System Management & Glue Logic — On-chip nonvolatile reconfiguration and embedded functions enable consolidation of SPI/I²C logic, timers, and peripheral control in a single device.

Unique Advantages

• High integration in a compact package: 206 I/Os and 1280 logic elements in a 256-ball ftBGA reduce board count and simplify system design.
• Industrial robustness: Rated for -40 °C to 100 °C operation and surface-mount packaging suited for automated manufacturing.
• Flexible power options: Broad supply range (2.375 V–3.465 V) eases integration with common system rails.
• Reconfigurable platform: MachXO2 family capabilities enable in-field updates and instant-on operation for evolving product requirements.
• Environmentally compliant: RoHS compliance supports responsible design and regulatory adherence.

Why Choose LCMXO2-1200UHC-4FTG256I?

The LCMXO2-1200UHC-4FTG256I positions itself as a versatile, industrial-grade FPGA solution that balances logic capacity, embedded memory, and high I/O count within a compact 256-LBGA package. It is well suited for designers who need reconfigurable logic, robust environmental performance, and flexible voltage support in applications such as control systems, interface bridging, and display or memory I/O acceleration.

Backed by MachXO2 family features—such as low-power operation, on-chip configuration options, and hardened peripheral functions—this device offers a scalable platform for long-term designs that require field updates, system consolidation, and dependable operation in industrial environments.

If you would like pricing, availability, or to request a quote for LCMXO2-1200UHC-4FTG256I, please submit a quote request or contact sales for more information.