LCMXO2-1200UHC-4FTG256C

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA

Quantity 565 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-1200UHC-4FTG256C – MachXO2 FPGA, 1280 Logic Elements

The LCMXO2-1200UHC-4FTG256C is a MachXO2 Field Programmable Gate Array (FPGA) in a 256-ball LBGA package offering 1,280 logic elements and 206 user I/Os. It combines on-chip memory, flexible I/O support and non-volatile configuration capabilities to address designs that require configurable logic, interface bridging and system control functions.

Designed for commercial-grade applications, this surface-mount FPGA operates from a single supply range of 2.375 V to 3.465 V and supports an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and supplied in a 256-FTBGA (17 × 17 mm) footprint.

Key Features

  • Core Logic — 1,280 logic elements (cells) provide programmable LUT-based logic resources suitable for glue logic, control and interface tasks.
  • On-chip Memory — Total on-chip RAM of 75,776 bits (approximately 75.8 kbits) for distributed and embedded storage needs in your design.
  • High I/O Count — 206 user I/Os available in the 256-LBGA package to support extensive peripheral and bus interfacing.
  • On-chip User Flash Memory (UFM) — MachXO2 family UFM capability; XO2-1200 family devices include 64 kbits of UFM for non-volatile storage and configuration options.
  • Flexible Power — Single-supply operation across 2.375 V to 3.465 V accommodates a range of system power rails.
  • Low Power Family Features — MachXO2 family architecture provides low standby power modes and other power-saving options suitable for energy-conscious designs.
  • Clocking and PLLs — Family-level support includes phase-locked loop (PLL) resources; XO2-1200 family devices provide one PLL for flexible clock management.
  • Non-volatile, Instant-on Configuration — MachXO2 family devices support instant-on, single-chip non-volatile configuration and in-field reconfiguration capabilities.
  • Package & Mounting — 256-LBGA package (supplier package: 256-FTBGA, 17 × 17 mm), surface-mount for compact board layouts and high pin-count routing.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
  • Standards & Programming Interfaces — Family-level support for JTAG, SPI and I²C programming and in-system configuration options from the MachXO2 family.
  • Regulatory — RoHS compliant for lead-free manufacturing flows.

Typical Applications

  • Interface Bridging — Use the 206 I/Os and flexible I/O buffer support to bridge disparate buses and protocols between system components.
  • System Control and Glue Logic — 1,280 logic elements and on-chip RAM are well suited for control sequencing, power management control and board-level glue logic.
  • Peripheral Aggregation — Aggregate and manage multiple sensors, serial interfaces or low- to mid-speed peripherals where compact packaging and many I/Os are required.

Unique Advantages

  • Highly configurable logic resource: 1,280 logic elements allow designers to implement custom finite-state machines, bus adapters and control logic without external ASICs.
  • Ample I/O in a compact package: 206 I/Os in a 256-LBGA footprint reduce board area while enabling broad interface connectivity.
  • Non-volatile instant-on capability: MachXO2 family non-volatile configuration eliminates the need for external boot flash for faster system startup and simplified BOM.
  • On-chip memory for data buffering: Approximately 75.8 kbits of total RAM supports local buffering, small FIFOs and state storage without external SRAM.
  • Single-supply flexibility: Operation across 2.375 V to 3.465 V fits common system supply rails and simplifies power domain design.
  • Commercial temperature suitability and RoHS compliance: Rated for 0 °C to 85 °C and compliant with RoHS requirements for mainstream commercial deployments.

Why Choose LCMXO2-1200UHC-4FTG256C?

The LCMXO2-1200UHC-4FTG256C delivers a balanced mix of programmable logic, on-chip memory and extensive I/O in a compact 256-LBGA package. Its MachXO2 family heritage provides non-volatile instant-on configuration, family-level low-power features and flexible programming interfaces, making it suitable for designs that require reliable, field-updatable programmable logic without a large board footprint.

This device is ideal for commercial embedded systems, interface logic consolidation and control applications where moderate logic density, significant I/O, and on-chip RAM reduce BOM complexity and speed development. Its single-supply operation and RoHS compliance support common manufacturing and power architectures while providing access to MachXO2 family capabilities.

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