LCMXO2-1200UHC-4FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA |
|---|---|
| Quantity | 565 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-1200UHC-4FTG256C – MachXO2 FPGA, 1280 Logic Elements
The LCMXO2-1200UHC-4FTG256C is a MachXO2 Field Programmable Gate Array (FPGA) in a 256-ball LBGA package offering 1,280 logic elements and 206 user I/Os. It combines on-chip memory, flexible I/O support and non-volatile configuration capabilities to address designs that require configurable logic, interface bridging and system control functions.
Designed for commercial-grade applications, this surface-mount FPGA operates from a single supply range of 2.375 V to 3.465 V and supports an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and supplied in a 256-FTBGA (17 × 17 mm) footprint.
Key Features
- Core Logic — 1,280 logic elements (cells) provide programmable LUT-based logic resources suitable for glue logic, control and interface tasks.
- On-chip Memory — Total on-chip RAM of 75,776 bits (approximately 75.8 kbits) for distributed and embedded storage needs in your design.
- High I/O Count — 206 user I/Os available in the 256-LBGA package to support extensive peripheral and bus interfacing.
- On-chip User Flash Memory (UFM) — MachXO2 family UFM capability; XO2-1200 family devices include 64 kbits of UFM for non-volatile storage and configuration options.
- Flexible Power — Single-supply operation across 2.375 V to 3.465 V accommodates a range of system power rails.
- Low Power Family Features — MachXO2 family architecture provides low standby power modes and other power-saving options suitable for energy-conscious designs.
- Clocking and PLLs — Family-level support includes phase-locked loop (PLL) resources; XO2-1200 family devices provide one PLL for flexible clock management.
- Non-volatile, Instant-on Configuration — MachXO2 family devices support instant-on, single-chip non-volatile configuration and in-field reconfiguration capabilities.
- Package & Mounting — 256-LBGA package (supplier package: 256-FTBGA, 17 × 17 mm), surface-mount for compact board layouts and high pin-count routing.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
- Standards & Programming Interfaces — Family-level support for JTAG, SPI and I²C programming and in-system configuration options from the MachXO2 family.
- Regulatory — RoHS compliant for lead-free manufacturing flows.
Typical Applications
- Interface Bridging — Use the 206 I/Os and flexible I/O buffer support to bridge disparate buses and protocols between system components.
- System Control and Glue Logic — 1,280 logic elements and on-chip RAM are well suited for control sequencing, power management control and board-level glue logic.
- Peripheral Aggregation — Aggregate and manage multiple sensors, serial interfaces or low- to mid-speed peripherals where compact packaging and many I/Os are required.
Unique Advantages
- Highly configurable logic resource: 1,280 logic elements allow designers to implement custom finite-state machines, bus adapters and control logic without external ASICs.
- Ample I/O in a compact package: 206 I/Os in a 256-LBGA footprint reduce board area while enabling broad interface connectivity.
- Non-volatile instant-on capability: MachXO2 family non-volatile configuration eliminates the need for external boot flash for faster system startup and simplified BOM.
- On-chip memory for data buffering: Approximately 75.8 kbits of total RAM supports local buffering, small FIFOs and state storage without external SRAM.
- Single-supply flexibility: Operation across 2.375 V to 3.465 V fits common system supply rails and simplifies power domain design.
- Commercial temperature suitability and RoHS compliance: Rated for 0 °C to 85 °C and compliant with RoHS requirements for mainstream commercial deployments.
Why Choose LCMXO2-1200UHC-4FTG256C?
The LCMXO2-1200UHC-4FTG256C delivers a balanced mix of programmable logic, on-chip memory and extensive I/O in a compact 256-LBGA package. Its MachXO2 family heritage provides non-volatile instant-on configuration, family-level low-power features and flexible programming interfaces, making it suitable for designs that require reliable, field-updatable programmable logic without a large board footprint.
This device is ideal for commercial embedded systems, interface logic consolidation and control applications where moderate logic density, significant I/O, and on-chip RAM reduce BOM complexity and speed development. Its single-supply operation and RoHS compliance support common manufacturing and power architectures while providing access to MachXO2 family capabilities.
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