LCMXO2-1200UHC-6FTG256C

The LCMXO2-1200UHC-6FTG256C is a commercial-grade MachXO2 family FPGA offering mid-density reconfigurable logic with 1280 logic elements and 206 general-purpose I/Os in a 256-ball BGA package. It provides a compact, low-power platform for glue logic, interface bridging and system control in commercial electronic products.

Built on the MachXO2 architecture, the device combines flexible I/O, on-chip memory and embedded system functions to reduce board complexity and accelerate time-to-market while operating over a 2.375 V to 3.465 V supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 1280 logic elements suitable for mid-density control and glue-logic tasks.
• On-chip Memory Approximately 75,776 bits of embedded RAM for buffering, FIFOs and small data structures.
• I/O Density & Flexibility 206 I/Os with programmable sysIO buffer support for multiple signaling standards and on-chip differential termination options.
• Low-Power Operation MachXO2 family low-power architecture with standby modes—standby power can be as low as 22 μW (family specification).
• On-Chip Non-Volatile Memory MachXO2 family provides on-chip User Flash Memory and supports background programming and dual-boot configurations (family feature).
• Clocking and PLLs Flexible on-chip clocking including multiple primary clocks and analog PLL support (family supports fractional‑N PLLs).
• Embedded System Functions Hardened I2C, SPI and timer/counter functions plus an on-chip oscillator for simplified system integration (family features).
• Package 256-ball ftBGA supplier package (256-FTBGA, 17×17 mm) in a compact 256-LBGA case.
• Commercial Grade & Compliance Grade: Commercial with an operating range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Interface Bridging and Protocol Conversion Use the high I/O count and on-chip SPI/I2C blocks for board-level protocol bridging and peripheral aggregation.
• System Glue Logic Implement control logic, reset sequencing and system state machines using the 1280 logic elements and embedded RAM.
• Display and Memory Interfaces Leverage MachXO2 family pre-engineered source-synchronous I/O and DDR gearing for display timing and memory interface tasks.
• Power-Sensitive Consumer Electronics Apply standby and low-power modes to minimize idle draw in battery-powered or energy-conscious commercial products.

Unique Advantages

• High I/O in a Small Footprint 206 I/Os in a 256-ball BGA package enable dense, multi-protocol connectivity without large package alternatives.
• Integrated System Peripherals On-chip I2C, SPI and timers reduce external component count and simplify PCB routing.
• Instant-On and Reconfigurability MachXO2 family instant-on architecture and in-field reconfiguration options enable flexible boot and update strategies.
• Low Standby Power Family-level low-power features (standby down to micro-watts) help conserve energy in idle modes.
• Broad I/O Signaling Support Programmable I/O buffers and differential support from the MachXO2 family enable diverse interface standards on a single device.
• Commercial Temperature Range Rated for 0 °C to 85 °C to match typical commercial electronics deployment scenarios.

Why Choose LCMXO2-1200UHC-6FTG256C?

The LCMXO2-1200UHC-6FTG256C is positioned for designs that need a balance of reconfigurable logic, high I/O count and integrated system functions in a compact, commercial-grade package. Its 1280 logic elements, substantial on-chip RAM and family-level features—such as on-chip non-volatile memory, flexible clocking and low-power modes—make it well suited for glue logic, protocol bridging, and control subsystems.

For engineering teams targeting reduced BOM, quick integration of peripherals and field-upgradeable logic, this MachXO2 device offers a practical combination of integration, configurability and energy-efficient operation aligned to commercial electronics requirements.

Request a quote or submit a pricing inquiry to check availability and lead times for LCMXO2-1200UHC-6FTG256C.