LCMXO2-1200ZE-1MG132I

The LCMXO2-1200ZE-1MG132I is a MachXO2 series field programmable gate array (FPGA) supplied in a 132-ball CSPBGA surface-mount package. It delivers 1,280 logic elements and 65,536 bits of on-chip RAM, targeted at mid-density control, glue-logic and system integration tasks in industrial applications.

Designed for low-voltage operation and in-field configurability, this device supports a mix of flexible I/O, embedded memory and non-volatile configuration options to simplify board-level design and shorten time-to-market for industrial and embedded systems.

Key Features

• Core Logic — 1,280 logic elements provide capacity for mid-density programmable logic and glue functions.
• On-chip Memory — 65,536 bits of embedded RAM for FIFOs, small buffers and local data storage.
• Non-volatile Configuration — MachXO2 family architecture supports on-chip user flash and instant-on configuration for single-chip, non-volatile operation.
• Flexible I/O — 104 I/Os available in the 132-ball CSPBGA package to interface with a broad range of peripherals and sensors.
• Low-Voltage Supply — Operational supply range of 1.14 V to 1.26 V to support low-power system designs.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Package & Mounting — 132-LFBGA / 132-CSPBGA (8×8 mm) surface-mount package for compact board-level integration.
• Standards & Reliability — Industrial grade device with RoHS compliance and family-level support for in-system programming and boundary-scan.

Typical Applications

• Industrial Control — Implement control logic, protocol conversion and supervisory functions within factory automation and process-control equipment.
• Peripheral and Sensor Interface — Aggregate and condition sensor data or provide custom I/O timing and buffering for industrial sensors and actuators.
• Human‑Machine Interfaces (HMIs) — Drive custom front-end logic, manage display and input timing, or implement display gearing and DDR-friendly I/O where required.
• System Glue and Integration — Replace discrete glue logic and simplify BOM by consolidating bus bridging, clocking and interface adaptation into a single device.

Unique Advantages

• Instant-on, non-volatile operation: Single-chip, secure configuration enables immediate availability after power-up without external configuration memory.
• Compact, industry-ready packaging: 132-ball CSPBGA (8×8 mm) package optimizes PCB area while providing 104 user I/Os for flexible board integration.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) supports low-power system architectures and simplifies power rail design.
• Industrial thermal margin: Rated for −40 °C to 100 °C, making the device suitable for a wide range of industrial environments.
• Embedded memory and user flash: On-chip RAM and non-volatile user memory enable local data buffering and field updates without external memory components.
• Rich I/O count for integration: 104 I/Os enable versatile interfacing to peripherals, sensors and other system components, reducing external logic needs.

Why Choose LCMXO2-1200ZE-1MG132I?

The LCMXO2-1200ZE-1MG132I combines a mid-density logic fabric with meaningful on-chip RAM and non-volatile configuration in a compact BGA package designed for industrial use. Its voltage and temperature specifications, together with a high I/O count, make it a practical choice for designers looking to consolidate system logic, manage custom interfaces, or implement in-field updates without increasing board complexity.

This part suits teams building industrial controls, HMI front-ends, sensor aggregation and system glue logic who need a balance of integration, configurability and industrial operating range backed by the MachXO2 family feature set.

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