LCMXO2-1200ZE-1SG32I

The LCMXO2-1200ZE-1SG32I is a MachXO2 field programmable gate array (FPGA) IC offering 1,280 logic elements and 65,536 bits of on-chip RAM in a compact 32‑UFQFN exposed pad package. Built for industrial applications, this device targets control, I/O expansion and system integration roles where low power, instant-on non‑volatile configuration and flexible interfacing are important.

Key Features

• Core Logic — 1,280 logic elements for implementing glue logic, state machines and small to mid-density FPGA functions.
• On‑chip Memory — Total RAM bits: 65,536 (~64 kbits) of embedded RAM suitable for distributed storage and small FIFOs; on-chip user Flash memory support is available in the MachXO2 family.
• I/O Flexibility — 21 I/Os with the family’s programmable sysIO buffer supporting a wide range of I/O standards and on‑chip differential termination to simplify interface design.
• Low Voltage Supply — Operates from 1.14 V to 1.26 V, enabling integration with low‑voltage systems.
• Low Power Operation — Family features include ultra‑low standby power options (datasheet notes standby power as low as 22 μW), plus programmable power modes for power‑sensitive designs.
• Clocking and PLL — MachXO2 family clocking includes multiple primary clocks and analog PLL support; XO2-1200 devices include one PLL for frequency synthesis and jitter management.
• On‑chip Functions — Hardened peripherals in the family include SPI, I²C and timer/counter blocks, plus an on‑chip oscillator and IEEE 1149.1 boundary scan support.
• Non‑volatile, Reconfigurable — Instant‑on, single‑chip non‑volatile configuration with background programming and in‑field reconfiguration capability (TransFR™) provided by the MachXO2 family.
• Package and Temperature — Surface‑mount 32‑UFQFN exposed pad package (supplier package: 32‑QFN, 5×5 mm) and industrial operating range of −40 °C to 100 °C.
• Standards and Programming — Supports JTAG, SPI and I²C programming and offers IEEE 1532 compliant in‑system programming options (as described for the MachXO2 family).

Typical Applications

• System Glue Logic — Implement board-level control, protocol translation and glue logic between microcontrollers, sensors and peripherals using compact FPGA resources and on‑chip RAM.
• I/O Expansion and Interface Bridging — Provide programmable I/O buffering and interface conversion for displays, memory interfaces or legacy I/O using the device’s flexible sysIO capabilities and differential support.
• Boot and Configuration Control — Use non‑volatile configuration and TransFR™ reconfiguration for secure instant‑on boot control, background programming and firmware update handling.
• User Interface and Display — Drive and manage display I/Os, DDR or source‑synchronous interfaces supported by the MachXO2 family’s dedicated I/O gearing and DDR register features.

Unique Advantages

• Compact, Industrial‑grade Package: 32‑UFQFN exposed pad in a 5×5 mm footprint combined with −40 °C to 100 °C rating simplifies deployment in space‑constrained industrial designs.
• Integrated Non‑volatile Configuration: Instant‑on, single‑chip non‑volatile configuration reduces external BOM and enables secure, maintenance‑friendly field updates.
• Low‑voltage, Low‑power Operation: 1.14 V to 1.26 V supply range and family low‑power modes support power‑sensitive applications and energy‑efficient system designs.
• Rich On‑chip Peripherals: Built‑in SPI, I²C and timer/counter logic plus boundary‑scan support reduce the need for external controllers and simplify system-level integration.
• Flexible I/O and Memory: 21 programmable I/Os and approximately 64 kbits of embedded RAM provide versatile options for buffering, FIFOs and local data storage without additional components.

Why Choose LCMXO2-1200ZE-1SG32I?

The LCMXO2-1200ZE-1SG32I positions itself as a compact, non‑volatile FPGA solution for industrial applications that require reliable instant‑on behavior, flexible I/O and low power operation. With 1,280 logic elements, ~64 kbits of RAM and a 21‑pin I/O count in a small 32‑UFQFN package, it fits board‑level control, interface bridging and configuration tasks where space and power are constrained.

Designers benefit from the MachXO2 family’s integrated peripherals, reconfiguration capabilities and production‑ready packaging, enabling scalable designs with reduced BOM and straightforward in‑field update paths.

Request a quote or submit an RFQ to obtain pricing, lead time and availability for the LCMXO2-1200ZE-1SG32I. Our team can provide ordering information and support for volume requirements.