LCMXO2-1200ZE-1TG100C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP |
|---|---|
| Quantity | 171 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-1TG100C – MachXO2 Field Programmable Gate Array (FPGA), 1280 logic elements, 79 I/Os, 100-LQFP
The LCMXO2-1200ZE-1TG100C is a MachXO2 family FPGA delivering 1280 logic elements, 79 user I/Os and 65,536 bits of on-chip RAM in a 100-pin LQFP (14 × 14 mm) surface-mount package. It is a commercial-grade, low-power, reconfigurable device designed for control, interface and glue-logic roles that require instant-on behavior and flexible I/O support.
With a single-chip, non-volatile configuration approach and programmable I/O options, the device targets designs that need compact, low-power, and field-reconfigurable logic in a standard 100-TQFP footprint. The device operates from a core voltage range of 1.14 V to 1.26 V and is rated for 0 °C to 85 °C ambient.
Key Features
- Core Logic 1280 logic elements provide mid-range programmable logic capacity suitable for control, glue logic and interface tasks.
- Embedded Memory 65,536 bits of on-chip RAM for small buffers, state storage and FIFO implementations.
- Low Power Operation Family-level low-power optimizations with standby modes (family datasheet cites standby power as low as 22 μW), enabling energy-efficient always-on or battery-backed designs.
- Flexible I/O 79 I/Os in the 100-LQFP package and programmable sysIO buffers supporting a wide range of interfaces and signaling options for system-level interfacing.
- Advanced I/O Features I/O cells include DDR registers, programmable differential support and display gearing options suitable for source-synchronous and display-oriented interfaces.
- On-Chip Configuration and Non-Volatile Memory Instant-on, single-chip configuration with non-volatile on-chip user flash in the MachXO2 family and support for programming via JTAG, SPI and I²C (family-level features).
- Clocking and Timing Multiple primary clocks and up to two analog PLLs per device (family-level) provide flexible clocking and fractional-n frequency synthesis for diverse timing needs.
- Package and Mounting 100-LQFP (100-TQFP, 14 × 14 mm) surface-mount package suitable for compact PCBs and standard assembly processes.
- Commercial Grade and Compliance Commercial operating grade with RoHS compliance and an ambient operating temperature range of 0 °C to 85 °C.
Typical Applications
- Display and Video Interfaces — Dedicated gearing and DDR-capable I/O cells support source-synchronous display interfaces and buffering for display controller designs.
- Memory Interface Bridging — Pre-engineered DDR and dedicated memory interface features in the MachXO2 family help implement DDR/DDR2/LPDDR bridging and timing logic.
- System Glue Logic and Protocol Conversion — Programmable sysIO buffers and a broad range of supported signaling standards suit protocol translation, bus bridging and I/O expansion tasks.
- Control and Supervisory Functions — Low-power standby, on-chip timers/counters, and embedded RAM make the device appropriate for system supervisory roles and always-on control logic.
Unique Advantages
- Instant-on, single-chip configuration: Non-volatile configuration and instant-on behavior simplify system startup and eliminate external configuration ROM for many designs (family-level capability).
- Compact, production-ready package: 100-LQFP (14 × 14 mm) surface-mount package with 79 I/Os delivers a balance of pin count and small PCB footprint.
- Low standby power: Family-level low-power modes reduce energy consumption for battery-backed or always-on applications.
- Versatile I/O signaling: Programmable sysIO buffer and DDR-capable I/Os enable support for numerous interface standards and source-synchronous links.
- On-chip memory and logic density: 65,536 bits of embedded RAM combined with 1280 logic elements provide the resources to implement control, buffering and finite-state logic on a single device.
- Flexible clocking: Multiple primary clocks and up to two analog PLLs (family-level) help meet diverse timing and frequency synthesis requirements.
Why Choose LCMXO2-1200ZE-1TG100C?
The LCMXO2-1200ZE-1TG100C positions itself as a mid-density, low-power, reconfigurable solution for commercial designs that need reliable on-chip memory, flexible I/O and instant-on configuration in a compact 100-LQFP package. With 1280 logic elements, 79 I/Os and 65,536 bits of embedded RAM, it is well suited for designs that require interface bridging, control logic and display or memory interfacing capabilities.
Built on the MachXO2 family architecture, the device benefits from family-level features such as low-power standby options, programmable I/O buffers, clocking flexibility and on-chip non-volatile configuration. These capabilities provide scalable migration options across the MachXO2 family and support system-level integration that can reduce BOM and PCB complexity.
Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-1200ZE-1TG100C. Our team can provide lead-time details and ordering information to help you move your design forward.

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