LCMXO2-1200UHC-6FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA |
|---|---|
| Quantity | 697 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-1200UHC-6FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA
The LCMXO2-1200UHC-6FTG256I is a MachXO2 family FPGA in a 256-ball BGA package designed for industrial applications requiring non-volatile, reconfigurable logic. The device provides 1280 logic elements, 206 I/Os and 75,776 bits of on-chip RAM in a surface-mount 256-LBGA (256-FTBGA, 17×17) package.
As part of the MachXO2 family, this device targets system-level glue logic, interface bridging and control functions where low standby power, flexible I/O and instant-on, non-volatile configuration are required. It supports a wide single-supply range (2.375 V to 3.465 V) and an industrial temperature range (−40 °C to 100 °C).
Key Features
- Core Logic — 1280 logic elements provide a compact programmable fabric for glue logic, protocol adaptation and small to medium-scale control functions.
- Embedded Memory — 75,776 bits of on-chip RAM for distributed and embedded storage of state, FIFOs or small buffers; useful for packet buffering and interface staging.
- I/O Density & Package — 206 user I/Os in a 256-LBGA footprint (supplier package: 256-FTBGA, 17×17) for high pin-count interfacing in a compact surface-mount package.
- Power and Supply Flexibility — Single supply operating range from 2.375 V to 3.465 V and family-level low-power architecture suitable for designs where standby and active power are considerations.
- Industrial Temperature — Rated for −40 °C to 100 °C operation to meet a broad set of industrial environments.
- Non-Volatile, Instant-On Architecture — MachXO2 family features on-chip non-volatile configuration for instant-on behavior and field reconfiguration capabilities.
- Flexible I/O and Protocol Support — Family-level programmable I/O buffers and pre‑engineered source-synchronous I/O options support a wide range of signaling standards and DDR interfaces for diverse system requirements.
- System Reliability & Compliance — Surface-mount 256-ball BGA packaging and RoHS compliance for modern manufacturing and regulatory requirements.
Typical Applications
- Industrial Control — Integrate control logic, sensor aggregation and timing functions while meeting industrial temperature requirements and single-supply constraints.
- Interface Bridging — Implement protocol translation, bus bridging and glue-logic between disparate subsystems using the device’s 206 I/Os and flexible I/O buffer support.
- Display and Video I/O — Use source-synchronous and DDR-capable I/O (family-level feature) for display timing, gearing and interface tasks.
- Configuration & System Management — Provide non-volatile configuration, background programming and system control functions without an external configuration device.
Unique Advantages
- Compact, High I/O Count: 206 I/Os in a 256-ball BGA enable dense connectivity while minimizing PCB area.
- Integrated Memory for On-Chip Data Handling: 75,776 bits of RAM reduce the need for small external buffers and simplify board-level memory design.
- Wide Supply Range: Operation from 2.375 V to 3.465 V allows flexibility with common system power rails.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environments.
- Non-Volatile, Reconfigurable Architecture: Instant-on and in-field reconfiguration options lower system complexity for configuration storage and updates.
- RoHS Compliant: Meets lead-free manufacturing and environmental requirements for modern production flows.
Why Choose LCMXO2-1200UHC-6FTG256I?
This MachXO2 device balances a medium-density logic fabric with high I/O count and on-chip RAM, packaged in a 256-ball BGA for compact, production-ready boards. It is well suited for engineers building industrial control, interface bridging and system management functions that need non-volatile configuration, wide supply flexibility and an extended temperature range.
Choosing this part provides a scalable platform within the MachXO2 family, enabling designers to leverage family-level features such as low-power operation, flexible I/O and reconfiguration to simplify BOM and accelerate development.
Request a quote or submit an inquiry to receive pricing and availability information for LCMXO2-1200UHC-6FTG256I. Our team can provide lead times and support for your procurement and design planning.

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