LCMXO2-1200UHC-6FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA

Quantity 697 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-1200UHC-6FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA

The LCMXO2-1200UHC-6FTG256I is a MachXO2 family FPGA in a 256-ball BGA package designed for industrial applications requiring non-volatile, reconfigurable logic. The device provides 1280 logic elements, 206 I/Os and 75,776 bits of on-chip RAM in a surface-mount 256-LBGA (256-FTBGA, 17×17) package.

As part of the MachXO2 family, this device targets system-level glue logic, interface bridging and control functions where low standby power, flexible I/O and instant-on, non-volatile configuration are required. It supports a wide single-supply range (2.375 V to 3.465 V) and an industrial temperature range (−40 °C to 100 °C).

Key Features

  • Core Logic — 1280 logic elements provide a compact programmable fabric for glue logic, protocol adaptation and small to medium-scale control functions.
  • Embedded Memory — 75,776 bits of on-chip RAM for distributed and embedded storage of state, FIFOs or small buffers; useful for packet buffering and interface staging.
  • I/O Density & Package — 206 user I/Os in a 256-LBGA footprint (supplier package: 256-FTBGA, 17×17) for high pin-count interfacing in a compact surface-mount package.
  • Power and Supply Flexibility — Single supply operating range from 2.375 V to 3.465 V and family-level low-power architecture suitable for designs where standby and active power are considerations.
  • Industrial Temperature — Rated for −40 °C to 100 °C operation to meet a broad set of industrial environments.
  • Non-Volatile, Instant-On Architecture — MachXO2 family features on-chip non-volatile configuration for instant-on behavior and field reconfiguration capabilities.
  • Flexible I/O and Protocol Support — Family-level programmable I/O buffers and pre‑engineered source-synchronous I/O options support a wide range of signaling standards and DDR interfaces for diverse system requirements.
  • System Reliability & Compliance — Surface-mount 256-ball BGA packaging and RoHS compliance for modern manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control — Integrate control logic, sensor aggregation and timing functions while meeting industrial temperature requirements and single-supply constraints.
  • Interface Bridging — Implement protocol translation, bus bridging and glue-logic between disparate subsystems using the device’s 206 I/Os and flexible I/O buffer support.
  • Display and Video I/O — Use source-synchronous and DDR-capable I/O (family-level feature) for display timing, gearing and interface tasks.
  • Configuration & System Management — Provide non-volatile configuration, background programming and system control functions without an external configuration device.

Unique Advantages

  • Compact, High I/O Count: 206 I/Os in a 256-ball BGA enable dense connectivity while minimizing PCB area.
  • Integrated Memory for On-Chip Data Handling: 75,776 bits of RAM reduce the need for small external buffers and simplify board-level memory design.
  • Wide Supply Range: Operation from 2.375 V to 3.465 V allows flexibility with common system power rails.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environments.
  • Non-Volatile, Reconfigurable Architecture: Instant-on and in-field reconfiguration options lower system complexity for configuration storage and updates.
  • RoHS Compliant: Meets lead-free manufacturing and environmental requirements for modern production flows.

Why Choose LCMXO2-1200UHC-6FTG256I?

This MachXO2 device balances a medium-density logic fabric with high I/O count and on-chip RAM, packaged in a 256-ball BGA for compact, production-ready boards. It is well suited for engineers building industrial control, interface bridging and system management functions that need non-volatile configuration, wide supply flexibility and an extended temperature range.

Choosing this part provides a scalable platform within the MachXO2 family, enabling designers to leverage family-level features such as low-power operation, flexible I/O and reconfiguration to simplify BOM and accelerate development.

Request a quote or submit an inquiry to receive pricing and availability information for LCMXO2-1200UHC-6FTG256I. Our team can provide lead times and support for your procurement and design planning.

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