LCMXO2-1200ZE-2TG100IR1
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP |
|---|---|
| Quantity | 1,264 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-2TG100IR1 – MachXO2 FPGA, 1280 Logic Elements, 79 I/Os, 100‑LQFP
The LCMXO2-1200ZE-2TG100IR1 is a MachXO2 family field programmable gate array (FPGA) offered in a 100‑pin LQFP package for surface‑mount applications. It provides 1,280 logic elements, 65,536 bits of on‑chip RAM and 79 user I/Os, making it suitable for mid‑density glue logic, control and interface consolidation in industrial systems.
Built on the MachXO2 family architecture, the device combines reconfigurable logic and embedded memory with non‑volatile configuration options and low standby power to simplify system design and reduce component count.
Key Features
- Logic Capacity — 1,280 logic elements to implement medium‑complexity custom logic and glue functions.
- Embedded Memory — 65,536 bits (64 kbits) of on‑chip RAM for FIFOs, buffers and small data storage needs.
- On‑Chip User Flash Memory — Family features include on‑chip user flash memory; the MachXO2 family supports user flash for configuration and data storage.
- I/O Flexibility — 79 general‑purpose I/Os in a 100‑LQFP footprint, providing broad connectivity for sensors, peripherals and external devices.
- Low‑Power Architecture — MachXO2 family devices are designed for low standby power and power‑saving modes as part of the family feature set.
- Clocking and PLL — Family architecture provides flexible on‑chip clocking with primary clocks and analog PLL options for frequency synthesis.
- System Functions — MachXO2 family includes hardened system functions such as SPI, I²C and timer/counter primitives for easier integration.
- Reconfiguration and Non‑Volatile Operation — Family supports instant‑on, single‑chip non‑volatile configuration and in‑field reconfiguration capabilities.
- Industrial Grade Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- Power Supply — Core supply range specified at 1.14 V to 1.26 V for the device core.
- Package and Mounting — 100‑pin LQFP (14 × 14 mm) package, surface‑mount mounting for PCB assembly.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Consolidate multiple peripheral interfaces and implement protocol adaptation using the device’s 79 I/Os and reconfigurable logic.
- Control and Sequencing — Implement machine control state machines, timers and counters using embedded RAM and hardened timer/counter functions.
- Display and Memory Interfaces — Leverage MachXO2 family source‑synchronous I/O features and clocking options for display gearing and memory interface glue logic.
- In‑field Updatable Systems — Use the family’s non‑volatile configuration and TransFR reconfiguration capability for firmware updates and field upgrades without board replacement.
Unique Advantages
- Compact, Mid‑Density Integration — 1,280 logic elements and 79 I/Os in a 100‑LQFP package reduce the need for multiple discrete components, lowering BOM and board area.
- Embedded SRAM for Local Storage — 65,536 bits of on‑chip RAM provide immediate on‑device buffering for data paths and FIFOs, simplifying PCB memory topology.
- Industrial Temperature Support — −40 °C to 100 °C rating supports deployed systems in demanding environments.
- Flexible Power and Clocking — Narrow core voltage range and MachXO2 family clocking/PLL features enable deterministic timing and power optimization in system designs.
- Non‑Volatile, Field‑Upgradeable — Family-level instant‑on and in‑field reconfiguration reduce downtime and enable secure updates.
- Proven System Primitives — Built‑in SPI, I²C and timer/counter blocks accelerate integration and lower development time for common functions.
Why Choose LCMXO2-1200ZE-2TG100IR1?
The LCMXO2-1200ZE-2TG100IR1 positions itself as a practical mid‑density FPGA option for industrial designs that need a balance of logic capacity, on‑chip RAM and flexible I/O in a compact 100‑LQFP package. Its MachXO2 family heritage brings low standby power, reconfiguration features and hardened system primitives that help streamline designs and reduce system complexity.
Choose this device when you need a reconfigurable, industrial‑temperature component that consolidates control, interface and buffering functions while providing field update capability and reduced component count for robust, maintainable systems.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-1200ZE-2TG100IR1 and to discuss how it fits into your next design.