LCMXO2-1200ZE-2SG32I

The LCMXO2-1200ZE-2SG32I is a MachXO2 family Field Programmable Gate Array (FPGA) IC providing a flexible, low-power logic fabric in a compact 32‑UFQFN exposed pad package. It combines 1,280 logic elements with approximately 65,536 bits of embedded RAM and 21 user I/Os, targeting industrial embedded applications that require in-system programmability and compact form factors.

Built for integration and efficiency, the device supports on-chip non-volatile configuration, a wide set of I/O options, and single-supply operation within a 1.14 V to 1.26 V range, making it suitable for industrial-grade control, interface bridging, and low-power logic consolidation tasks.

Key Features

• Core Logic  1,280 logic elements provide a flexible logic architecture suitable for glue logic, control functions, and small to mid-density custom logic implementations.
• Embedded Memory  Approximately 65,536 bits of on-chip RAM support local buffering and small data structures for state machines and peripheral interfaces.
• On-Chip User Flash (UFM)  On-chip non-volatile user flash memory (UFM) in the MachXO2-1200 family provides 64 kbits of storage for configuration or small data storage needs.
• Clocking and PLL  Family features include flexible on-chip clocking and one analog PLL for clock generation and deskewing in timing-sensitive interfaces.
• I/O Flexibility  21 I/Os with the family’s programmable sysIO buffer architecture support a wide range of signaling standards and source-synchronous I/O modes for display and memory interfaces.
• Low-Voltage Operation  Designed for single-supply operation with a specified voltage range of 1.14 V to 1.26 V to match low-voltage system rails.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and embedded systems requiring extended temperature range.
• Compact Package  32‑UFQFN exposed pad (32‑QFN, 5 × 5 mm) surface-mount package for space-constrained PCBs while maintaining thermal path through the exposed pad.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Use as local control, glue logic, or protocol bridging in industrial automation where extended temperature and robust packaging are required.
• Interface and I/O Expansion  Implement custom interface bridging, signal conditioning, or protocol adaptation using the device’s flexible I/O and configurable logic.
• Display and Memory Interfaces  Support pre-engineered source-synchronous I/O and DDR/GEARING features from the MachXO2 family for display I/O or memory interface timing roles.
• Embedded System Integration  Consolidate peripheral glue logic, timers/counters, and serial interfaces to reduce BOM and simplify board design.

Unique Advantages

• Compact, Industrial-Grade Integration: Combines 1,280 logic elements, embedded RAM, and on-chip UFM in a 5 × 5 mm QFN package rated to −40 °C to 100 °C for space- and temperature-constrained designs.
• Low-Voltage, Low-Power Operation: Operates from a 1.14 V to 1.26 V supply, enabling direct integration in low-voltage systems and helping reduce overall power budget.
• On-Chip Non-Volatile Configuration: UFM provides 64 kbits of on-chip user flash for configuration and small data storage, enabling single-chip instant-on behavior and field updates.
• Flexible I/O and Clocking: Programmable sysIO and on-chip PLL support a variety of signaling standards and synchronized interfaces, simplifying system timing and interface requirements.
• Reduced BOM and Board Area: Small QFN package and integrated peripherals (I2C, SPI, timers) allow consolidation of discrete glue logic and controllers into a single device.

Why Choose LCMXO2-1200ZE-2SG32I?

The LCMXO2-1200ZE-2SG32I positions itself as a compact, industrial-grade FPGA option for designers needing modest logic capacity, embedded RAM, and on-chip non-volatile configuration in a small surface-mount package. Its combination of 1,280 logic elements, approximately 65 kbits of RAM, and family-level support for UFM and flexible I/O makes it well suited to embedded control, interface bridging, and display/memory timing tasks.

For teams focused on board space, reduced component count, and reliable operation across a wide temperature range, this MachXO2 device delivers a balanced mix of integration and configurability while adhering to RoHS environmental standards.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LCMXO2-1200ZE-2SG32I.