LCMXO2-1200ZE-2SG32C

IC FPGA 21 I/O 32QFNS
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 21 65536 1280 32-UFQFN Exposed Pad

Quantity 783 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package32-QFN (5x5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case32-UFQFN Exposed PadNumber of I/O21Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-2SG32C – MachXO2 FPGA, 1280 Logic Elements, 32-UFQFN

The LCMXO2-1200ZE-2SG32C is a MachXO2 family field programmable gate array (FPGA) in a compact 32-UFQFN exposed-pad package. It delivers 1280 logic elements, approximately 65,536 bits of on-chip RAM, and 21 I/Os, targeting compact, low-power logic integration for commercial embedded systems.

Built on the MachXO2 architecture, this device offers an integrated mix of configurable logic, embedded memory, on-chip user flash and flexible I/O, providing a single-chip solution for glue logic, interface bridging and in-field reconfiguration in space-constrained designs.

Key Features

  • Core Logic — 1280 logic elements (LUT-based architecture) suitable for mid-density glue logic, protocol adaptation and control functions.
  • Embedded Memory — Approximately 65,536 bits of total on-chip RAM to support FIFOs, small buffers and state storage in logic designs.
  • I/O — 21 general-purpose I/Os with flexible buffer options noted across the MachXO2 family for supporting a wide range of interfaces.
  • Low-Power Operation — Family-level ultra low power capabilities from the MachXO2 line, including standby modes and power-saving options.
  • Non‑volatile Configuration — On-chip user flash memory and instant-on, single-chip, infinitely reconfigurable capability as described for MachXO2 devices.
  • Clocking & PLLs — Family supports flexible clocking including primary clocks and analog PLLs for frequency synthesis.
  • Package & Mounting — 32-UFQFN exposed pad, surface-mount package (supplier package: 32-QFN, 5 × 5 mm) for small-footprint board designs.
  • Supply & Temperature — Operates from 1.14 V to 1.26 V with a commercial operating range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Implement protocol adapters, bus translators and glue logic where moderate-density programmable logic and embedded RAM are required.
  • Display and Source-Synchronous Interfaces — Use the MachXO2 family’s source-synchronous and display gearing features for display or high-speed I/O conditioning in compact systems.
  • In-Field Upgradable Logic — On-chip flash and TransFR™ reconfiguration enable field updates and incremental feature rollouts without board-level changes.
  • Embedded Control and Peripheral Management — Handle timers, watchdogs, SPI/I²C peripherals and simple control tasks within a single low-power FPGA.

Unique Advantages

  • Compact, Low-Profile Package: 32-UFQFN (5 × 5 mm) exposed-pad package reduces board area while providing thermal performance for surface-mount designs.
  • Integrated Non-Volatile Configuration: On-chip user flash allows instant-on behavior and secure single-chip configuration without external memory.
  • Low Power Modes: MachXO2 family-level standby and power-saving options help minimize system idle power consumption.
  • Flexible I/O and Clocking: Family features include programmable I/O buffers and analog PLLs, enabling a range of interface standards and clock synthesis options.
  • Embedded Memory for System Functions: Approximately 65 kbits of on-chip RAM supports buffering and small data storage without external SRAM.
  • Commercial Temperature and RoHS Compliance: Designed for commercial-grade environments (0 °C to 85 °C) and RoHS-compliant manufacturing.

Why Choose LCMXO2-1200ZE-2SG32C?

The LCMXO2-1200ZE-2SG32C pairs mid-density programmable logic (1280 logic elements) with on-chip memory and non-volatile configuration in a small 32-UFQFN package, making it well-suited for space-constrained commercial embedded designs that need flexible I/O and in-field reconfiguration. Its low-voltage supply range and family-level low-power features help minimize system power in both active and standby modes.

This device is a practical choice for engineers seeking a compact, reconfigurable building block for interface bridging, control logic and peripheral management, offering the MachXO2 family ecosystem of programmable I/O, clocking and configuration options to simplify BOM and accelerate time-to-market.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the LCMXO2-1200ZE-2SG32C.

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