LCMXO2-1200ZE-2SG32C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 21 65536 1280 32-UFQFN Exposed Pad |
|---|---|
| Quantity | 783 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 32-QFN (5x5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 32-UFQFN Exposed Pad | Number of I/O | 21 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-2SG32C – MachXO2 FPGA, 1280 Logic Elements, 32-UFQFN
The LCMXO2-1200ZE-2SG32C is a MachXO2 family field programmable gate array (FPGA) in a compact 32-UFQFN exposed-pad package. It delivers 1280 logic elements, approximately 65,536 bits of on-chip RAM, and 21 I/Os, targeting compact, low-power logic integration for commercial embedded systems.
Built on the MachXO2 architecture, this device offers an integrated mix of configurable logic, embedded memory, on-chip user flash and flexible I/O, providing a single-chip solution for glue logic, interface bridging and in-field reconfiguration in space-constrained designs.
Key Features
- Core Logic — 1280 logic elements (LUT-based architecture) suitable for mid-density glue logic, protocol adaptation and control functions.
- Embedded Memory — Approximately 65,536 bits of total on-chip RAM to support FIFOs, small buffers and state storage in logic designs.
- I/O — 21 general-purpose I/Os with flexible buffer options noted across the MachXO2 family for supporting a wide range of interfaces.
- Low-Power Operation — Family-level ultra low power capabilities from the MachXO2 line, including standby modes and power-saving options.
- Non‑volatile Configuration — On-chip user flash memory and instant-on, single-chip, infinitely reconfigurable capability as described for MachXO2 devices.
- Clocking & PLLs — Family supports flexible clocking including primary clocks and analog PLLs for frequency synthesis.
- Package & Mounting — 32-UFQFN exposed pad, surface-mount package (supplier package: 32-QFN, 5 × 5 mm) for small-footprint board designs.
- Supply & Temperature — Operates from 1.14 V to 1.26 V with a commercial operating range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Implement protocol adapters, bus translators and glue logic where moderate-density programmable logic and embedded RAM are required.
- Display and Source-Synchronous Interfaces — Use the MachXO2 family’s source-synchronous and display gearing features for display or high-speed I/O conditioning in compact systems.
- In-Field Upgradable Logic — On-chip flash and TransFR™ reconfiguration enable field updates and incremental feature rollouts without board-level changes.
- Embedded Control and Peripheral Management — Handle timers, watchdogs, SPI/I²C peripherals and simple control tasks within a single low-power FPGA.
Unique Advantages
- Compact, Low-Profile Package: 32-UFQFN (5 × 5 mm) exposed-pad package reduces board area while providing thermal performance for surface-mount designs.
- Integrated Non-Volatile Configuration: On-chip user flash allows instant-on behavior and secure single-chip configuration without external memory.
- Low Power Modes: MachXO2 family-level standby and power-saving options help minimize system idle power consumption.
- Flexible I/O and Clocking: Family features include programmable I/O buffers and analog PLLs, enabling a range of interface standards and clock synthesis options.
- Embedded Memory for System Functions: Approximately 65 kbits of on-chip RAM supports buffering and small data storage without external SRAM.
- Commercial Temperature and RoHS Compliance: Designed for commercial-grade environments (0 °C to 85 °C) and RoHS-compliant manufacturing.
Why Choose LCMXO2-1200ZE-2SG32C?
The LCMXO2-1200ZE-2SG32C pairs mid-density programmable logic (1280 logic elements) with on-chip memory and non-volatile configuration in a small 32-UFQFN package, making it well-suited for space-constrained commercial embedded designs that need flexible I/O and in-field reconfiguration. Its low-voltage supply range and family-level low-power features help minimize system power in both active and standby modes.
This device is a practical choice for engineers seeking a compact, reconfigurable building block for interface bridging, control logic and peripheral management, offering the MachXO2 family ecosystem of programmable I/O, clocking and configuration options to simplify BOM and accelerate time-to-market.
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