LCMXO2-1200ZE-2MG132I

The LCMXO2-1200ZE-2MG132I is a MachXO2 family FPGA from Lattice Semiconductor Corporation, offered in a 132-ball CSPBGA (8×8) surface-mount package. It delivers 1280 logic elements with 65,536 bits of on-chip RAM and 104 I/O pins, making it suitable for industrial-grade control, interface bridging, and mid-density glue logic applications.

Designed for low-voltage systems, the device operates from 1.14 V to 1.26 V and across an industrial temperature range (–40 °C to 100 °C), providing a compact, non-volatile FPGA option for embedded systems that require reconfigurability and integrated peripheral support.

Key Features

• Logic Capacity — 1280 logic elements suitable for mid-density programmable logic tasks and glue logic integration.
• On-chip Memory — 65,536 bits of embedded RAM for data buffering, state storage, and small lookup tables.
• I/O — 104 programmable I/O pins in a compact 132-LFBGA (CSPBGA) package, enabling a variety of interface connections in a small footprint.
• Package and Mounting — 132-ball CSPBGA (8×8) package, surface-mount compatible for PCB assembly.
• Supply Voltage — Single-supply operation within a 1.14 V to 1.26 V range for low-voltage system designs.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and regulatory compliance.
• Family-Level Capabilities — MachXO2 family features include low-power architecture, on-chip user flash memory, programmable I/O buffer options, multiple clocking resources, and hardened functions such as SPI, I²C and timer/counter (refer to MachXO2 family datasheet for full details).

Typical Applications

• Industrial Control — Implement control logic, protocol bridging and peripheral interfacing while meeting industrial temperature requirements.
• Embedded System Glue Logic — Replace discrete glue logic with a reconfigurable solution to simplify PCB design and consolidate functions.
• Interface Bridging — Use the device’s I/O density and programmable buffers to bridge between different digital interfaces in compact systems.
• User Interface Control — Manage buttons, indicators and local displays with onboard logic and memory resources.

Unique Advantages

• Compact, Surface-Mount Package: 132-ball CSPBGA (8×8) provides a small footprint for space-constrained PCBs while offering 104 I/Os.
• Industrial Reliability: Rated for –40 °C to 100 °C operation, supporting deployment in industrial environments.
• Low-Voltage Operation: Supports a narrow supply range (1.14 V–1.26 V), enabling integration into modern low-voltage systems.
• On-Chip Memory and Logic: 65,536 bits of embedded RAM and 1280 logic elements reduce external component count for mid-density designs.
• RoHS Compliance: Enables lead-free manufacturing processes and regulatory alignment.
• Family Ecosystem: Access to MachXO2 family features such as non-volatile configuration and hardened peripheral functions for easier system integration (see family datasheet for details).

Why Choose LCMXO2-1200ZE-2MG132I?

The LCMXO2-1200ZE-2MG132I positions itself as a compact, industrial-grade FPGA option for designers needing mid-density logic, embedded RAM, and a substantial I/O count in a small CSPBGA package. Its low-voltage operation and RoHS compliance make it suitable for modern embedded applications where board space, thermal performance, and regulatory considerations matter.

This device is well suited for teams seeking a reconfigurable, non-volatile logic element to consolidate interfaces, implement control functions, or add flexible logic to industrial systems while leveraging the broader MachXO2 family capabilities documented in the product datasheet.

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