LCMXO2-1200ZE-1UWG25ITR1K

IC FPGA 18 I/O 25WLCSP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 18 65536 1280 25-WLCSP

Quantity 1,204 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package25-WLCSPGradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-1UWG25ITR1K – MachXO2 FPGA 25-WLCSP (Industrial)

The LCMXO2-1200ZE-1UWG25ITR1K is a MachXO2 field programmable gate array (FPGA) in a compact 25-ball WLCSP surface-mount package. It provides a flexible logic architecture with on-chip non-volatile configuration and a mix of embedded memory, programmable I/O, and system functions aimed at compact, low-power industrial designs.

Targeted for system glue logic, control and interface functions, and small-footprint embedded designs, this device combines reconfigurability with low standby power, a broad I/O feature set, and industrial temperature operation.

Key Features

  • Core Logic — 1,280 logic elements and 160 logic blocks provide programmable combinational and sequential resources for glue logic, control, and state machines.
  • Embedded Memory — 65,536 bits of total on-chip RAM (approximately 64 kbits) for distributed RAM and small FIFOs or buffers.
  • Power and Supply — Single-core voltage range of 1.14 V to 1.26 V designed for low-power operation and efficient system integration.
  • I/O — 18 programmable I/Os in a small WLCSP footprint for compact board-level designs and peripheral interfacing.
  • Non-Volatile Configuration & Reconfiguration — MachXO2 family features such as instant-on and in-field reconfiguration modes provide flexible deployment and update options.
  • Interfaces & Hardened Functions — Family-level support for standard serial interfaces and system utilities (for example: SPI, I²C, JTAG and on-chip timer/counter) for streamlined peripheral and system management.
  • Package & Mounting — 25-ball WLCSP (surface mount) package offering a minimal PCB footprint for space-constrained applications.
  • Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C suitable for demanding environments.
  • Compliance — RoHS compliant for environmental and regulatory requirements.

Typical Applications

  • Industrial Control and Automation — Use for sensor interfacing, protocol conversion, and small-scale control logic where industrial temperature range and board space are constrained.
  • Display and HMI Interfaces — Small display controllers and user-interface glue logic leveraging the MachXO2 family’s source-synchronous I/O and gearing features.
  • Peripheral and Bus Bridging — Implement SPI/I²C bridges, custom peripheral timing, and protocol adaptation using the device’s programmable I/O and embedded memory.
  • In-Field Updatable Logic — Systems that require field reconfiguration or incremental feature updates benefit from non-volatile, reconfigurable logic and background programming capabilities.

Unique Advantages

  • Compact, Low-Profile Package: The 25-WLCSP surface-mount package minimizes PCB area and enables very small form-factor designs.
  • Non-Volatile, Instant-On Configuration: On-chip configuration enables rapid startup and simplifies hardware designs by removing the need for external volatile configuration memory.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployed equipment in harsh or variable environments.
  • Integrated Memory Resources: 65,536 bits of on-chip RAM provide localized buffering and distributed memory for control tasks without adding external memory.
  • Flexible I/O and System Functions: Programmable I/Os together with family-level support for SPI, I²C and timer/counter functions reduce BOM and accelerate integration of peripheral interfaces.
  • RoHS Compliant: Meets common environmental compliance needs for commercial and industrial products.

Why Choose LCMXO2-1200ZE-1UWG25ITR1K?

The LCMXO2-1200ZE-1UWG25ITR1K positions itself as a compact, reconfigurable solution for industrial applications that require a small footprint, reliable operation across a wide temperature range, and integrated system functions. With 1,280 logic elements, on-chip RAM, non-volatile configuration, and a minimal 25-ball WLCSP package, it is well suited for designers needing space- and power-efficient programmable logic for control, interface, and glue-logic roles.

Its combination of embedded memory, programmable I/O, and family-level support for standard serial interfaces provides scalability and longevity for designs where field updates and compact system integration are important. This device is a practical choice for teams focused on robust, reconfigurable hardware with low component count and predictable electrical and environmental characteristics.

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