LCMXO2-1200ZE-1TG144IR1

IC FPGA 107 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP

Quantity 845 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O107Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-1TG144IR1 – MachXO2 FPGA, 1280 Logic Elements, 64 kbits RAM, 107 I/Os, 144-LQFP

The LCMXO2-1200ZE-1TG144IR1 is a MachXO2 family Field Programmable Gate Array (FPGA) delivered in a 144-pin LQFP package. It provides 1280 logic elements, approximately 64 kbits of on-chip RAM, and 107 general-purpose I/Os, making it suitable for control, glue-logic and interface-rich designs in industrial environments.

This device combines non-volatile configuration, low-power operation and flexible I/O capabilities to address applications that require instant-on responsiveness, programmable logic and a broad mix of interface standards within an industrial temperature range.

Key Features

  • Core & Logic: 1280 logic elements suitable for implementing glue logic, state machines and small to mid-size programmable logic functions.
  • Embedded Memory: Approximately 64 kbits of on-chip RAM for data buffering and small FIFO implementations.
  • I/O Capacity & Flexibility: 107 I/Os with programmable sysIO buffer options and support for a wide range of signaling standards including LVCMOS, LVTTL and differential interfaces as documented for the MachXO2 family.
  • Non-volatile Configuration & Flash: On-chip user flash memory and single-chip instant-on operation with background programming and in-field reconfiguration (TransFR) capabilities described for the family.
  • Power & Low-Power Modes: Low-power 65 nm family process and programmable power-saving options; family datasheet reports standby currents in the microamp/μW range.
  • Clocking & PLLs: Flexible on-chip clocking with support for primary clocks and analog PLLs (family-level feature set includes up to two PLLs for this class of device).
  • System-Level Functions: Hardened on-chip functions such as SPI, I2C and timer/counter reduce external component count and simplify system design.
  • Package & Environmental: Surface-mount 144-LQFP (supplier package listed as 144-TQFP 20×20), RoHS compliant, industrial grade with operating range −40 °C to 100 °C and a supply voltage range of 1.14 V to 1.26 V.

Typical Applications

  • Industrial Control and Automation: Implement motor control state machines, sensor interfacing and deterministic glue logic within an industrial temperature range.
  • Interface Bridging and Protocol Conversion: Use the large I/O count and flexible sysIO buffer options to bridge between legacy and modern interfaces or manage mixed-voltage signal domains.
  • Display and Memory Interfaces: Leverage the family’s pre-engineered source-synchronous I/O, DDR gearing and dedicated FIFO control logic for display driving and memory interface tasks.
  • Embedded System Management: On-chip SPI/I2C and user flash enable boot management, configuration storage and in-field updates without additional non-volatile components.

Unique Advantages

  • Highly integrated I/O and logic: 107 I/Os paired with 1280 logic elements reduce external glue components and simplify PCB routing for interface-heavy designs.
  • Non-volatile instant-on capability: On-chip user flash provides single-chip configuration and background programming for rapid system startup and field reconfiguration.
  • Flexible signaling support: Family-level sysIO buffer programmability and differential I/O support make it easier to adapt the device to a wide variety of interface standards.
  • Low-power operation: Built on an advanced low-power process with family-level power-saving modes that lower standby power consumption for energy-sensitive designs.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh and industrial environments.
  • On-chip system peripherals: Integrated SPI, I2C and timer/counter functions reduce BOM and simplify system architecture.

Why Choose LCMXO2-1200ZE-1TG144IR1?

The LCMXO2-1200ZE-1TG144IR1 positions itself as a compact, industrial-grade FPGA that balances moderate logic capacity with a high I/O count and embedded non-volatile memory. It is well suited for designers who need instant-on programmable logic, flexible interface support and built-in system functions while minimizing external components.

With its industrial temperature rating, surface-mount 144-LQFP packaging and family-level features such as low-power operation, on-chip flash and hardened peripherals, this device offers a stable, scalable option for control, interface and embedded system designs that require reliable operation across a wide temperature range.

Request a quote or submit an inquiry to check availability and pricing for the LCMXO2-1200ZE-1TG144IR1 and to discuss how it fits your design requirements.

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