LCMXO2-1200ZE-1TG144I

IC FPGA 107 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP

Quantity 526 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O107Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-1TG144I – MachXO2 Field Programmable Gate Array (FPGA) IC

The LCMXO2-1200ZE-1TG144I is a MachXO2 family FPGA from Lattice Semiconductor designed as a low-power, instant-on programmable logic device for industrial applications. It provides a compact, surface-mount 144-pin LQFP package with 1280 logic elements and approximately 64 kbits of on-chip RAM, making it suitable for control, interface bridging, and system glue-logic tasks where deterministic I/O and non-volatile configuration are required.

Key Features

  • Core Logic — 1280 logic elements providing flexible LUT-based logic resources for glue logic, finite-state machines, and modest combinational/sequential functions.
  • Embedded Memory — Approximately 64 kbits of on-chip RAM (Total RAM Bits: 65536) for FIFOs, small buffers, and state storage.
  • I/O Capacity and Flexibility — 107 I/Os available in the 144-LQFP package, supporting a wide range of interface needs on a compact footprint.
  • Non-volatile Configuration & System Functions — MachXO2 family features include on-chip user flash memory and background programming options; device supports multiple configuration interfaces documented for the family (JTAG, SPI, I2C).
  • Low-Voltage Operation — Single-supply core voltage specified at 1.14 V to 1.26 V, enabling compatibility with low-voltage system designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Package and Mounting — 144-LQFP surface-mount package (20 mm × 20 mm footprint) for standard PCB assembly and thermal management practices.
  • Regulatory — RoHS compliant.

Typical Applications

  • Industrial Control — Implement deterministic control logic, I/O aggregation, and protocol bridging in factory automation and process-control systems within the specified industrial temperature range.
  • Communications & Interface Bridging — Provide customizable interface translation and glue logic between processors, sensors, and peripheral devices using the device’s flexible I/O resources.
  • Embedded System Utilities — Act as a control plane for power sequencing, reset supervision, or peripheral management where non-volatile, reprogrammable logic is required.
  • Display and Human-Machine Interface — Drive and manage moderate-complexity UI logic, keypad scanning, and display timing using on-chip logic and RAM resources.

Unique Advantages

  • Compact, Programmable Integration: 1280 logic elements and 107 I/Os in a 144-LQFP package reduce external glue logic and simplify PCB routing.
  • On-chip Memory for System Functions: Approximately 64 kbits of embedded RAM enables local buffering and small FIFO implementations without external SRAM.
  • Low-Voltage, Low-Power Ready: Narrow core supply range (1.14 V–1.26 V) supports low-voltage system architectures and predictable power budgeting.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable industrial environments.
  • Reconfigurable Non-Volatile Logic: MachXO2 family configurability and on-chip user flash allow in-field updates and flexible system evolution.

Why Choose LCMXO2-1200ZE-1TG144I?

The LCMXO2-1200ZE-1TG144I positions itself as a practical, industrial-grade programmable logic device for engineers who need reliable, reconfigurable control and interface logic in a compact package. With 1280 logic elements, approximately 64 kbits of embedded RAM, and 107 I/Os, it provides the resources required for glue logic, protocol bridging, and modest embedded control functions while meeting industrial temperature requirements.

This device is well suited to designs that value deterministic I/O, non-volatile configuration, and the ability to update logic in-field. Its combination of density, I/O count, and package footprint delivers a balance of integration and flexibility that can lower BOM count and simplify board-level design decisions.

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