LCMXO2-1200ZE-1UWG25ITR

The LCMXO2-1200ZE-1UWG25ITR is a MachXO2 family FPGA optimized for low-power, instant-on system control and interface tasks. It provides a flexible logic fabric with 1,280 logic elements and 65,536 bits of on-chip RAM in a compact 25-ball WLCSP (25-UFBGA) package targeted at industrial applications.

Designed for integration into space-constrained, industrial environments, this device combines reconfigurability, on-chip non-volatile memory options and programmable I/O to handle glue-logic, protocol bridging, system control and low-power standby modes while operating across an extended voltage and temperature range.

Key Features

• Core Logic – 1,280 logic elements provide a compact, reprogrammable logic fabric suitable for control, interface and glue-logic functions.
• On-Chip Memory – 65,536 total RAM bits of embedded memory for FIFOs, small buffers and control tables; family-level support for on-chip user flash memory and background programming is provided in the MachXO2 series.
• I/O Flexibility – 18 I/O pins with programmable sysIO buffer and differential I/O capabilities as described for the MachXO2 family, supporting a wide range of interface options.
• Low Power Operation – Family-level ultra low power characteristics (advanced 65 nm low power process and standby modes) enable energy-efficient system designs and microsecond-scale instant-on behavior.
• Clocking & PLLs – Flexible on-chip clocking options are available across the MachXO2 family, including primary clocks and analog PLL support for synchronized interfaces and I/O timing.
• Power & Supply Range – Single supply operation with a specified supply voltage range of 1.14 V to 1.26 V for core power.
• Package & Temperature – Compact 25-UFBGA WLCSP package (25-WLCSP) for minimal board footprint; rated for industrial operation from -40 °C to 100 °C.
• Standards & Reliability – RoHS compliant and designed for non-volatile, reconfigurable operation with family-level features such as background programming and optional dual-boot capability.

Typical Applications

• Industrial Control – Implement control logic, state machines and interface conditioning in industrial automation equipment that requires industrial temperature range operation.
• Interface Bridging – Act as a protocol bridge or glue logic between disparate interfaces using the device’s programmable I/O and embedded memory.
• System Management – Provide system supervisory functions such as configuration management, in-field logic updates (reconfiguration) and low-power standby control.
• Compact Embedded Systems – Integrate into space-constrained products where a small WLCSP footprint and on-chip non-volatile configuration reduce board area and BOM complexity.

Unique Advantages

• Highly integrated solution: Combines 1,280 logic elements and 65,536 bits of embedded RAM in a single compact device, reducing external component count.
• Compact, low-profile package: 25-ball WLCSP (25-UFBGA) minimizes PCB area for compact designs and small form-factor products.
• Industrial temperature capability: Rated from -40 °C to 100 °C to meet the environmental demands of industrial applications.
• Low-power, instant-on architecture: Family-level low standby power and fast configuration support lower energy use and quicker startup.
• Flexible I/O and memory: Programmable sysIO buffers, differential I/O support and embedded RAM enable diverse interface and buffering needs without large external memory.
• Non-volatile reconfiguration: MachXO2 family features such as on-chip user flash memory and background programming support in-field updates and secure configuration strategies.

Why Choose LCMXO2-1200ZE-1UWG25ITR?

This MachXO2 device is positioned for designers needing a compact, low-power, industrial-grade FPGA for control, interface and system management tasks. With 1,280 logic elements, 65,536 bits of on-chip RAM, flexible I/O and WLCSP packaging, it delivers a balanced mix of integration and configurability for space- and power-constrained designs.

Choose this part when you require a reprogrammable, non-volatile FPGA with industrial temperature capability and a small board footprint—ideal for reducing BOM complexity while providing long-term scalability through in-field reconfiguration and family-level ecosystem support.

Request a quote or submit a purchase inquiry to evaluate the LCMXO2-1200ZE-1UWG25ITR for your next design.