LCMXO2-1200ZE-1UWG25ITR50

IC FPGA 18 I/O 25WLCSP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 18 65536 1280 25-UFBGA, WLCSP

Quantity 1,180 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package25-WLCSPGradeIndustrialOperating Temperature-40°C – 100°C
Package / Case25-UFBGA, WLCSPNumber of I/O18Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-1UWG25ITR50 – MachXO2 FPGA, 1,280 Logic Elements, 25‑WLCSP

The LCMXO2-1200ZE-1UWG25ITR50 is a MachXO2 field programmable gate array (FPGA) IC delivering 1,280 logic elements and 65,536 bits of on-chip RAM in a compact 25-ball WLCSP (25-UFBGA) package. Designed for low-power, instant-on control and glue logic, this device targets compact embedded systems and industrial applications that require flexible I/O, non-volatile configuration, and extended temperature operation.

With a single-chip, non-volatile architecture and support for background programming and reconfiguration, the device is suited to roles such as system control, interface bridging, and display or memory I/O support where small footprint and robust configuration are important.

Key Features

  • Core Logic — 1,280 logic elements provide flexible LUT-based logic for control, glue, and custom peripherals.
  • On-Chip Memory — 65,536 bits of total RAM for distributed and embedded user memory needs.
  • Non-Volatile Configuration — MachXO2 family supports on-chip user flash and instant-on capability enabling microsecond power‑up and single‑chip, secure configuration.
  • Low Power — Family-level features include an advanced 65 nm low-power process and standby modes with standby power as low as 22 μW.
  • Flexible I/O — 18 I/Os with programmable sysIO buffer support and a wide range of interface standards as defined for the MachXO2 family, enabling differential and single‑ended signaling options.
  • Clocking and PLLs — Family supports multiple primary clocks and up to two PLLs per device for fractional‑n frequency synthesis (as specified for MachXO2 family devices).
  • System Functions — Hardened functions present in the family include SPI, I2C, timer/counter and an on-chip oscillator for system-level integration.
  • Package and Mounting — 25-ball WLCSP (25-UFBGA) surface-mount package for minimal board footprint and compact system designs.
  • Operating Range — Single-supply operation with a supply range of 1.14 V to 1.26 V and an industrial temperature rating from −40 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Use as compact glue logic, sensor interface controller or peripheral aggregator where industrial temperature range and low-power standby are required.
  • Interface Bridging and System Glue — Implements protocol translation, reset and power sequencing, and supervisory functions leveraging on-chip SPI/I2C and timer resources.
  • Display and Memory I/O — Supports pre‑engineered source synchronous and gearing features from the MachXO2 family for display and DDR-style I/O requirements.

Unique Advantages

  • Compact, Low-Profile Packaging — 25-ball WLCSP enables minimal PCB area and small form-factor product designs.
  • Non-Volatile, Instant-On Operation — Powers up in microseconds and supports in-field reconfiguration for flexible updates without external configuration memory.
  • Low Standby Power — Family-level low-power architecture and standby modes reduce energy consumption in battery- or power-constrained designs.
  • Integrated System Functions — On-chip SPI, I2C, timers and oscillator simplify BOM and speed time-to-market for control and supervisory tasks.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C, suitable for a wide range of embedded and industrial environments.

Why Choose LCMXO2-1200ZE-1UWG25ITR50?

This MachXO2 device combines a compact WLCSP package with 1,280 logic elements and 65,536 bits of on-chip RAM to deliver a tightly integrated FPGA solution for space‑constrained embedded and industrial designs. It pairs non‑volatile, instant‑on configuration with low standby power and flexible I/O options from the MachXO2 family, making it a practical choice for designers who need reliable configuration, minimal external components, and sustained operation across industrial temperatures.

Engineers designing control logic, interface bridges, display or memory I/O support, and other system glue functions will find this device provides a balance of integration, configurability, and power efficiency while simplifying board-level design and supply-chain choices.

Request a quote or submit a purchase inquiry to evaluate the LCMXO2-1200ZE-1UWG25ITR50 for your next design project.

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