LCMXO2-1200ZE-1UWG25ITR50
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 18 65536 1280 25-UFBGA, WLCSP |
|---|---|
| Quantity | 1,180 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 25-WLCSP | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 25-UFBGA, WLCSP | Number of I/O | 18 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-1UWG25ITR50 – MachXO2 FPGA, 1,280 Logic Elements, 25‑WLCSP
The LCMXO2-1200ZE-1UWG25ITR50 is a MachXO2 field programmable gate array (FPGA) IC delivering 1,280 logic elements and 65,536 bits of on-chip RAM in a compact 25-ball WLCSP (25-UFBGA) package. Designed for low-power, instant-on control and glue logic, this device targets compact embedded systems and industrial applications that require flexible I/O, non-volatile configuration, and extended temperature operation.
With a single-chip, non-volatile architecture and support for background programming and reconfiguration, the device is suited to roles such as system control, interface bridging, and display or memory I/O support where small footprint and robust configuration are important.
Key Features
- Core Logic — 1,280 logic elements provide flexible LUT-based logic for control, glue, and custom peripherals.
- On-Chip Memory — 65,536 bits of total RAM for distributed and embedded user memory needs.
- Non-Volatile Configuration — MachXO2 family supports on-chip user flash and instant-on capability enabling microsecond power‑up and single‑chip, secure configuration.
- Low Power — Family-level features include an advanced 65 nm low-power process and standby modes with standby power as low as 22 μW.
- Flexible I/O — 18 I/Os with programmable sysIO buffer support and a wide range of interface standards as defined for the MachXO2 family, enabling differential and single‑ended signaling options.
- Clocking and PLLs — Family supports multiple primary clocks and up to two PLLs per device for fractional‑n frequency synthesis (as specified for MachXO2 family devices).
- System Functions — Hardened functions present in the family include SPI, I2C, timer/counter and an on-chip oscillator for system-level integration.
- Package and Mounting — 25-ball WLCSP (25-UFBGA) surface-mount package for minimal board footprint and compact system designs.
- Operating Range — Single-supply operation with a supply range of 1.14 V to 1.26 V and an industrial temperature rating from −40 °C to 100 °C.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control and Automation — Use as compact glue logic, sensor interface controller or peripheral aggregator where industrial temperature range and low-power standby are required.
- Interface Bridging and System Glue — Implements protocol translation, reset and power sequencing, and supervisory functions leveraging on-chip SPI/I2C and timer resources.
- Display and Memory I/O — Supports pre‑engineered source synchronous and gearing features from the MachXO2 family for display and DDR-style I/O requirements.
Unique Advantages
- Compact, Low-Profile Packaging — 25-ball WLCSP enables minimal PCB area and small form-factor product designs.
- Non-Volatile, Instant-On Operation — Powers up in microseconds and supports in-field reconfiguration for flexible updates without external configuration memory.
- Low Standby Power — Family-level low-power architecture and standby modes reduce energy consumption in battery- or power-constrained designs.
- Integrated System Functions — On-chip SPI, I2C, timers and oscillator simplify BOM and speed time-to-market for control and supervisory tasks.
- Industrial Temperature Range — Rated for −40 °C to 100 °C, suitable for a wide range of embedded and industrial environments.
Why Choose LCMXO2-1200ZE-1UWG25ITR50?
This MachXO2 device combines a compact WLCSP package with 1,280 logic elements and 65,536 bits of on-chip RAM to deliver a tightly integrated FPGA solution for space‑constrained embedded and industrial designs. It pairs non‑volatile, instant‑on configuration with low standby power and flexible I/O options from the MachXO2 family, making it a practical choice for designers who need reliable configuration, minimal external components, and sustained operation across industrial temperatures.
Engineers designing control logic, interface bridges, display or memory I/O support, and other system glue functions will find this device provides a balance of integration, configurability, and power efficiency while simplifying board-level design and supply-chain choices.
Request a quote or submit a purchase inquiry to evaluate the LCMXO2-1200ZE-1UWG25ITR50 for your next design project.