LCMXO2-1200ZE-2TG100C

The LCMXO2-1200ZE-2TG100C is a MachXO2 family FPGA offering a flexible logic architecture in a 100-pin LQFP surface-mount package. It provides 1,280 logic elements, approximately 65,536 bits of on-chip RAM and 79 I/O pins, making it suitable for control, glue-logic and interface tasks in commercial embedded designs.

Designed for low power and instant-on system requirements, the device operates from a nominal supply range of 1.14 V to 1.26 V and across a commercial temperature range of 0 °C to 85 °C. The part is RoHS-compliant and targeted at applications that require compact, reconfigurable logic with integrated memory and versatile I/O.

Key Features

• Core Logic — 1,280 logic elements (LUT4-based architecture from the MachXO2 family) for implementing custom combinational and sequential logic functions.
• Embedded Memory — Approximately 65,536 bits of on-chip RAM to support state storage, FIFOs and small data buffers.
• I/O and Interface Flexibility — 79 I/O pins provided in the 100-LQFP package, supporting a wide range of board-level interfaces and signal routing.
• On-Chip Non-Volatile Configuration — MachXO2 family supports on-chip user Flash memory and instant-on reconfiguration, enabling single-chip non-volatile solutions and in-field updates.
• Low Power — Family-level low-power characteristics including standby-mode options and ultra-low standby power behavior.
• Clocking and PLLs — Flexible on-chip clocking and PLL resources (family features) to support multiple primary clocks and high-speed I/O timing.
• Package and Mounting — 100-LQFP (14 × 14 mm) surface-mount package for easy PCB integration and prototyping.
• Supply and Temperature — Single supply operation from 1.14 V to 1.26 V; commercial grade operation from 0 °C to 85 °C.
• Standards and Programming — Family-level support for in-system programming and boundary scan; non-volatile configuration programmable via standard interfaces.
• Compliance — RoHS-compliant for environmental compliance in commercial applications.

Typical Applications

• System Glue Logic — Implement control logic, protocol conversion and timing glue between discrete components and peripherals.
• Interface and Display I/O — Use the MachXO2 I/O architecture for source-synchronous interfaces and display or parallel bus buffering and gearing.
• Peripheral and Sensor Control — Aggregate sensor inputs, implement preprocessing or filtering, and provide deterministic control signals for embedded systems.

Unique Advantages

• Instant-on, Non-Volatile Operation: Single-chip, non-volatile configuration enables immediate logic availability at power-up without external configuration devices.
• Compact Integration: 1,280 logic elements and embedded RAM in a 100-LQFP package reduce BOM and board area compared to multi-chip solutions.
• Low Power Modes: Family-level low-power features and standby options help minimize system power consumption in idle states.
• Flexible I/O Support: 79 I/Os and MachXO2 family I/O capabilities support a broad set of signaling standards and hot-socketing options for robust board designs.
• On-Board Memory Resources: Approximately 65 kbits of on-chip RAM support FIFOs and buffering without external SRAM, simplifying memory design.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet typical commercial embedded application requirements.

Why Choose LCMXO2-1200ZE-2TG100C?

The LCMXO2-1200ZE-2TG100C positions itself as a compact, low-power FPGA option for commercial embedded designs that require instant-on non-volatile logic, moderate logic density and integrated RAM. With 1,280 logic elements, around 65,536 bits of on-chip memory and 79 I/Os in a 100-LQFP surface-mount package, it simplifies board-level integration while reducing external component count.

It is well suited to engineers designing interface bridges, control logic and peripheral aggregation where predictable operating voltage (1.14 V–1.26 V) and a commercial temperature range (0 °C–85 °C) are required. The MachXO2 family features referenced in the datasheet — such as flexible clocking, on-chip Flash configuration and low-power modes — provide a scalable platform for longer-term design reuse and in-field updates.

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