LCMXO2-2000HC-4MG132C

IC FPGA 104 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA

Quantity 722 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O104Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-4MG132C – MachXO2 Field Programmable Gate Array (FPGA) IC

The LCMXO2-2000HC-4MG132C is a MachXO2 family FPGA offering a flexible, non-volatile logic solution in a compact 132‑LFBGA / CSPBGA package. It combines reconfigurable logic, embedded RAM and programmable I/O to support control, interface and glue-logic functions in commercial electronic designs.

Designed for low-power, instant-on operation and a broad range of I/O standards, this device is targeted at applications that require on-chip configuration, background programming and flexible system-level integration.

Key Features

  • Logic Capacity — 2112 logic elements for implementing combinatorial and sequential logic functions in a single-chip FPGA.
  • Embedded Memory — 75,776 total RAM bits (approximately 75 kbits) of on-chip RAM to support buffers, FIFOs and small lookup tables.
  • I/O Density & Flexibility — 104 I/Os with programmable sysIO buffer options and on-chip differential termination to support multiple interface standards.
  • Supply & Temperature — Single supply operating range from 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
  • Package & Mounting — 132‑LFBGA / CSPBGA package (132‑CSPBGA, 8×8) with surface-mount mounting for compact board integration.
  • Low Power Architecture — Built on an advanced low-power process with standby modes and power-saving options; family data shows ultra-low standby power behavior.
  • On-Chip Non-Volatile Configuration — Instant-on, single-chip, non-volatile configuration with support for background programming and multiple programming interfaces (JTAG, SPI, I²C).
  • Clocking & PLLs — Flexible on-chip clocking including multiple primary clocks and analog PLL support for a variety of timing and high-speed I/O needs.
  • Standards & System Support — Built-in system-level features such as SPI, I²C, timer/counter, and industry-standard boundary-scan and in-system programming support.
  • Regulatory — RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Implement board-level protocol translation and glue logic using the device’s 2112 logic elements and flexible I/O.
  • Embedded Control and Sequencing — Use on-chip RAM and non-volatile configuration to implement control state machines and startup sequencing with instant-on behavior.
  • Display and High-Speed I/O — Support source-synchronous and geared display interfaces and DDR-style I/O by leveraging the device’s programmable I/O and clocking features.
  • In-field Updatable Logic — Field reconfiguration and background programming allow logic updates without full system downtime.

Unique Advantages

  • Highly Integrated, Single-Chip Solution: Combines reconfigurable logic, on-chip RAM and non-volatile configuration to reduce BOM count and board complexity.
  • Flexible I/O and Protocol Support: 104 programmable I/Os with programmable termination and buffer options enable broad interface compatibility on a single device.
  • Compact Packaging: 132‑LFBGA / CSPBGA (8×8) surface-mount package minimizes PCB footprint while delivering substantial logic and I/O capacity.
  • Instant-On and Background Programming: Non-volatile instant-on configuration and support for background programming simplify firmware updates and field maintenance.
  • Low-Power Operation: Family-level low-power architecture and standby modes help minimize energy consumption in always-on or battery-assisted systems.
  • Industry-Standard Integration: Support for JTAG, SPI, I²C, boundary-scan and in-system programming streamlines development and production test flows.

Why Choose LCMXO2-2000HC-4MG132C?

This MachXO2 device balances substantive logic capacity (2112 logic elements) and on-chip memory (approximately 75 kbits) with flexible, programmable I/O in a compact 132‑LFBGA/CSPBGA package. It is well suited to commercial embedded designs that require instant-on non-volatile configuration, in-field updates, and a variety of interface standards.

Choose this part when you need a reconfigurable, low-power FPGA that integrates system-level functions (SPI, I²C, timers, clocking) and supports common in-system programming and test standards for streamlined development and deployment.

Request a quote for the LCMXO2-2000HC-4MG132C to begin procurement or to obtain pricing and availability information for your next design.

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