LCMXO2-2000HC-4BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 762 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-4BG256I – MachXO2 FPGA, 256-LFBGA, Industrial
The LCMXO2-2000HC-4BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) supplied in a 256-LFBGA package and specified for industrial temperature operation. It integrates 2,112 logic elements and up to 206 general-purpose I/Os, delivering a flexible, non-volatile programmable fabric for control, interface, and glue-logic tasks in industrial systems.
Built on the MachXO2 architecture, the device combines low-power operation, embedded memory, on-chip user flash capabilities and flexible I/O to address system-level integration needs where instant-on, reconfigurability and a broad I/O feature set are required.
Key Features
- Core Logic 264 logic blocks delivering 2,112 logic elements for implementing glue logic, state machines and custom peripherals.
- On-chip Memory 75,776 bits of on-chip RAM (distributed) for FIFOs and small buffers; MachXO2 family support for embedded block RAM and user Flash memory enables system storage and soft-PROM usage.
- On-chip User Flash (Family) MachXO2 family supports on-chip user Flash (UFM) with up to 256 kbits and 100,000 write cycles, accessible through JTAG, SPI and I2C for configuration storage and in-field updates.
- Flexible I/O 206 I/Os with programmable sysIO buffers supporting a wide range of interfaces (LVCMOS, LVTTL, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and others) and features such as on-chip differential termination and programmable pull modes.
- Source-Synchronous and DDR I/O (Family) Pre‑engineered source-synchronous I/O with DDR registers, dedicated gearing for display I/Os (7:1) and support for generic DDR/DDRx gearing and dedicated DDR/DDR2/LPDDR memory interfaces.
- Low Power MachXO2 family’s advanced low-power process with standby modes (family data reports standby power as low as 22 μW) and programmable power-saving options for energy-conscious designs.
- Clocking and PLLs (Family) Flexible on-chip clocking including up to two analog PLLs per device with fractional‑N synthesis and a wide input range (7 MHz to 400 MHz) for generating system clocks.
- Non-volatile, Reconfigurable Instant-on, single-chip non-volatile configuration and TransFR in-field reconfiguration capability for background updates and dual-boot options with external SPI memory (family features).
- System Functions and Standards (Family) On-chip hardened peripherals such as SPI, I2C and timer/counter, on-chip oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
- Package and Temperature 256-LFBGA package (supplier device package 256-CABGA 14×14) and industrial operating temperature range of −40 °C to 100 °C. RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic Use the device’s 206 I/Os and flexible sysIO buffer options to consolidate level shifting, protocol adaptation and board-level glue in industrial control systems.
- Display and Video I/O MachXO2 family display gearing and DDR I/O support make the device suitable for display interface buffering and timing control.
- Memory and Bus Management On-chip RAM and source-synchronous I/O features enable FIFO buffering and DDR/LPDDR interface support for managing memory and high-speed bus interactions.
- Field Updatable Systems Non-volatile configuration and TransFR reconfiguration allow in-field logic updates and background programming for deployed equipment.
Unique Advantages
- Highly Integrated I/O 206 programmable I/Os with on-chip differential termination and broad signaling support reduce external translation components and simplify board design.
- Non-volatile Instant-on Single-chip, non-volatile configuration provides instant-on system behavior without external configuration PROM.
- In-field Reconfiguration TransFR support enables logic updates while the system is operating, reducing downtime for firmware and hardware improvements.
- Industrial-Grade Operation Rated for −40 °C to 100 °C operation and supplied in a 256-LFBGA package suitable for robust industrial deployments.
- Embedded Memory for System Tasks 75,776 bits of distributed RAM and family support for embedded block RAM and UFM allow local buffering, small data storage and soft-processor boot options.
Why Choose LCMXO2-2000HC-4BG256I?
The LCMXO2-2000HC-4BG256I combines MachXO2 family-level non-volatile configuration, flexible low-power logic and a broad, programmable I/O set in a compact 256-LFBGA package targeted for industrial applications. With 2,112 logic elements, 206 I/Os and on‑chip RAM, it offers a balanced platform for system glue logic, interface consolidation and field-updatable control functions.
This device is well suited for engineering teams designing industrial control, display interface, bus management and in-field-update capable systems that require a single-chip, instantly configurable FPGA with a comprehensive I/O feature set and industrial temperature support.
Request a quote or submit an inquiry to our sales team for pricing and availability of the LCMXO2-2000HC-4BG256I.

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