LCMXO2-2000HC-4BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 762 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-4BG256I – MachXO2 FPGA, 256-LFBGA, Industrial

The LCMXO2-2000HC-4BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) supplied in a 256-LFBGA package and specified for industrial temperature operation. It integrates 2,112 logic elements and up to 206 general-purpose I/Os, delivering a flexible, non-volatile programmable fabric for control, interface, and glue-logic tasks in industrial systems.

Built on the MachXO2 architecture, the device combines low-power operation, embedded memory, on-chip user flash capabilities and flexible I/O to address system-level integration needs where instant-on, reconfigurability and a broad I/O feature set are required.

Key Features

  • Core Logic 264 logic blocks delivering 2,112 logic elements for implementing glue logic, state machines and custom peripherals.
  • On-chip Memory 75,776 bits of on-chip RAM (distributed) for FIFOs and small buffers; MachXO2 family support for embedded block RAM and user Flash memory enables system storage and soft-PROM usage.
  • On-chip User Flash (Family) MachXO2 family supports on-chip user Flash (UFM) with up to 256 kbits and 100,000 write cycles, accessible through JTAG, SPI and I2C for configuration storage and in-field updates.
  • Flexible I/O 206 I/Os with programmable sysIO buffers supporting a wide range of interfaces (LVCMOS, LVTTL, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, HSTL and others) and features such as on-chip differential termination and programmable pull modes.
  • Source-Synchronous and DDR I/O (Family) Pre‑engineered source-synchronous I/O with DDR registers, dedicated gearing for display I/Os (7:1) and support for generic DDR/DDRx gearing and dedicated DDR/DDR2/LPDDR memory interfaces.
  • Low Power MachXO2 family’s advanced low-power process with standby modes (family data reports standby power as low as 22 μW) and programmable power-saving options for energy-conscious designs.
  • Clocking and PLLs (Family) Flexible on-chip clocking including up to two analog PLLs per device with fractional‑N synthesis and a wide input range (7 MHz to 400 MHz) for generating system clocks.
  • Non-volatile, Reconfigurable Instant-on, single-chip non-volatile configuration and TransFR in-field reconfiguration capability for background updates and dual-boot options with external SPI memory (family features).
  • System Functions and Standards (Family) On-chip hardened peripherals such as SPI, I2C and timer/counter, on-chip oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
  • Package and Temperature 256-LFBGA package (supplier device package 256-CABGA 14×14) and industrial operating temperature range of −40 °C to 100 °C. RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic Use the device’s 206 I/Os and flexible sysIO buffer options to consolidate level shifting, protocol adaptation and board-level glue in industrial control systems.
  • Display and Video I/O MachXO2 family display gearing and DDR I/O support make the device suitable for display interface buffering and timing control.
  • Memory and Bus Management On-chip RAM and source-synchronous I/O features enable FIFO buffering and DDR/LPDDR interface support for managing memory and high-speed bus interactions.
  • Field Updatable Systems Non-volatile configuration and TransFR reconfiguration allow in-field logic updates and background programming for deployed equipment.

Unique Advantages

  • Highly Integrated I/O 206 programmable I/Os with on-chip differential termination and broad signaling support reduce external translation components and simplify board design.
  • Non-volatile Instant-on Single-chip, non-volatile configuration provides instant-on system behavior without external configuration PROM.
  • In-field Reconfiguration TransFR support enables logic updates while the system is operating, reducing downtime for firmware and hardware improvements.
  • Industrial-Grade Operation Rated for −40 °C to 100 °C operation and supplied in a 256-LFBGA package suitable for robust industrial deployments.
  • Embedded Memory for System Tasks 75,776 bits of distributed RAM and family support for embedded block RAM and UFM allow local buffering, small data storage and soft-processor boot options.

Why Choose LCMXO2-2000HC-4BG256I?

The LCMXO2-2000HC-4BG256I combines MachXO2 family-level non-volatile configuration, flexible low-power logic and a broad, programmable I/O set in a compact 256-LFBGA package targeted for industrial applications. With 2,112 logic elements, 206 I/Os and on‑chip RAM, it offers a balanced platform for system glue logic, interface consolidation and field-updatable control functions.

This device is well suited for engineering teams designing industrial control, display interface, bus management and in-field-update capable systems that require a single-chip, instantly configurable FPGA with a comprehensive I/O feature set and industrial temperature support.

Request a quote or submit an inquiry to our sales team for pricing and availability of the LCMXO2-2000HC-4BG256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up