LCMXO2-1200ZE-3TG144CR1

IC FPGA 107 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP

Quantity 85 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O107Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-3TG144CR1 – MachXO2 FPGA, 1,280 Logic Elements, ~64 kbit RAM, 144-LQFP

The LCMXO2-1200ZE-3TG144CR1 is a MachXO2 family Field Programmable Gate Array (FPGA) IC in a 144-pin LQFP package. It delivers a compact, low-power programmable fabric with 1,280 logic elements, approximately 65,536 bits of embedded RAM and 107 I/O pins for I/O‑centric embedded designs.

Designed for commercial-grade applications, this device combines flexible, low-power architecture with on-chip resources and rich I/O capabilities to address control, interface bridging and memory/display interface roles where instant-on and non-volatile configuration are valuable.

Key Features

  • Core Logic  1,280 logic elements provide the programmable fabric for glue logic, control functions and custom peripherals.
  • Embedded Memory  Approximately 65,536 bits of on-chip RAM for FIFOs, buffers and small data stores.
  • I/O Density  107 user I/Os in a 144-LQFP (20×20 mm) package, supporting a range of interface requirements while keeping a compact PCB footprint.
  • Low-Power Process  MachXO2 family devices are implemented in an advanced 65 nm low-power process with ultra-low standby options (family data shows standby power as low as 22 μW).
  • On-Chip Non-Volatile Configuration  Family-level support for on-chip user flash memory and instant-on behavior enables single-chip, secure, non-volatile configuration and rapid start-up.
  • Flexible I/O Standards (Family Capabilities)  MachXO2 family programmable sysIO buffers support a broad range of standards including multiple LVCMOS levels and differential interfaces, enabling versatile board-level interfacing.
  • Clocking and PLLs  Family-level flexible clocking with multiple primary clocks and up to two analog PLLs (family specification) for fractional‑n frequency synthesis and high-speed I/O timing.
  • Power and Supply  Device supply range specified at 1.14 V to 1.26 V and surface-mount package simplify power design for single-supply systems.
  • RoHS Compliant, Commercial Grade  Commercial operating temperature range 0 °C to 85 °C, RoHS-compliant manufacturing and surface-mount packaging for standard commercial applications.

Typical Applications

  • Display and Video I/O  Pre-engineered source-synchronous I/O and DDR gearing capabilities in the MachXO2 family make the device suitable for display timing, buffering and interface adaptation.
  • Memory Interface Glue Logic  Use as a bridge or control logic for DDR/DDR2/LPDDR memory interfaces and DQS-supporting subsystems (family-level features).
  • Embedded Control and System Glue  Replace discrete logic with programmable control, state machines and peripheral interfaces using the device’s logic elements and embedded RAM.
  • Peripheral and Sensor Aggregation  Aggregate and format signals from multiple sensors or peripherals using the available I/Os and embedded logic.

Unique Advantages

  • Compact, Integrated Solution: 1,280 logic elements, ~65 kbits of embedded RAM and 107 I/Os in a 144-LQFP package reduce external components and PCB area for mid-density designs.
  • Low-Power Operation: Built on a 65 nm low-power process with family-level standby modes to minimize power consumption in idle states.
  • Instant-On Non-Volatile Configuration: On-chip user flash and instant-on behavior (family capability) enable rapid system start-up without external configuration memory.
  • Flexible I/O and Interface Support: Programmable sysIO buffer options and family-level differential and single-ended interface support simplify integration with diverse peripherals.
  • Robust Clocking Options: Multiple primary clocks and analog PLL support (family-level) provide flexible timing for complex I/O and high-speed interfaces.
  • Commercial Temperature and RoHS Compliance: 0 °C to 85 °C operating range and RoHS-compliant manufacturing meet common commercial product requirements.

Why Choose LCMXO2-1200ZE-3TG144CR1?

The LCMXO2-1200ZE-3TG144CR1 positions itself as a compact, low-power MachXO2 FPGA option for designers needing a balance of programmable logic, embedded memory and substantial I/O in a standard 144-LQFP package. With around 1,280 logic elements, ~65 kbits of RAM and 107 I/Os, it is well-suited to embedded control, interface conversion and display/memory interface tasks where non-volatile, instant-on behavior and low standby power are valuable.

This commercial-grade device offers designers a scalable, integrated building block that leverages MachXO2 family-level features—flexible I/O standards, on-chip flash configuration and advanced clocking—backed by RoHS compliance and a defined operating temperature range for reliable deployment in commercial products.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LCMXO2-1200ZE-3TG144CR1.

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