LCMXO2-1200ZE-3TG144CR1
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP |
|---|---|
| Quantity | 85 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 107 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-3TG144CR1 – MachXO2 FPGA, 1,280 Logic Elements, ~64 kbit RAM, 144-LQFP
The LCMXO2-1200ZE-3TG144CR1 is a MachXO2 family Field Programmable Gate Array (FPGA) IC in a 144-pin LQFP package. It delivers a compact, low-power programmable fabric with 1,280 logic elements, approximately 65,536 bits of embedded RAM and 107 I/O pins for I/O‑centric embedded designs.
Designed for commercial-grade applications, this device combines flexible, low-power architecture with on-chip resources and rich I/O capabilities to address control, interface bridging and memory/display interface roles where instant-on and non-volatile configuration are valuable.
Key Features
- Core Logic 1,280 logic elements provide the programmable fabric for glue logic, control functions and custom peripherals.
- Embedded Memory Approximately 65,536 bits of on-chip RAM for FIFOs, buffers and small data stores.
- I/O Density 107 user I/Os in a 144-LQFP (20×20 mm) package, supporting a range of interface requirements while keeping a compact PCB footprint.
- Low-Power Process MachXO2 family devices are implemented in an advanced 65 nm low-power process with ultra-low standby options (family data shows standby power as low as 22 μW).
- On-Chip Non-Volatile Configuration Family-level support for on-chip user flash memory and instant-on behavior enables single-chip, secure, non-volatile configuration and rapid start-up.
- Flexible I/O Standards (Family Capabilities) MachXO2 family programmable sysIO buffers support a broad range of standards including multiple LVCMOS levels and differential interfaces, enabling versatile board-level interfacing.
- Clocking and PLLs Family-level flexible clocking with multiple primary clocks and up to two analog PLLs (family specification) for fractional‑n frequency synthesis and high-speed I/O timing.
- Power and Supply Device supply range specified at 1.14 V to 1.26 V and surface-mount package simplify power design for single-supply systems.
- RoHS Compliant, Commercial Grade Commercial operating temperature range 0 °C to 85 °C, RoHS-compliant manufacturing and surface-mount packaging for standard commercial applications.
Typical Applications
- Display and Video I/O Pre-engineered source-synchronous I/O and DDR gearing capabilities in the MachXO2 family make the device suitable for display timing, buffering and interface adaptation.
- Memory Interface Glue Logic Use as a bridge or control logic for DDR/DDR2/LPDDR memory interfaces and DQS-supporting subsystems (family-level features).
- Embedded Control and System Glue Replace discrete logic with programmable control, state machines and peripheral interfaces using the device’s logic elements and embedded RAM.
- Peripheral and Sensor Aggregation Aggregate and format signals from multiple sensors or peripherals using the available I/Os and embedded logic.
Unique Advantages
- Compact, Integrated Solution: 1,280 logic elements, ~65 kbits of embedded RAM and 107 I/Os in a 144-LQFP package reduce external components and PCB area for mid-density designs.
- Low-Power Operation: Built on a 65 nm low-power process with family-level standby modes to minimize power consumption in idle states.
- Instant-On Non-Volatile Configuration: On-chip user flash and instant-on behavior (family capability) enable rapid system start-up without external configuration memory.
- Flexible I/O and Interface Support: Programmable sysIO buffer options and family-level differential and single-ended interface support simplify integration with diverse peripherals.
- Robust Clocking Options: Multiple primary clocks and analog PLL support (family-level) provide flexible timing for complex I/O and high-speed interfaces.
- Commercial Temperature and RoHS Compliance: 0 °C to 85 °C operating range and RoHS-compliant manufacturing meet common commercial product requirements.
Why Choose LCMXO2-1200ZE-3TG144CR1?
The LCMXO2-1200ZE-3TG144CR1 positions itself as a compact, low-power MachXO2 FPGA option for designers needing a balance of programmable logic, embedded memory and substantial I/O in a standard 144-LQFP package. With around 1,280 logic elements, ~65 kbits of RAM and 107 I/Os, it is well-suited to embedded control, interface conversion and display/memory interface tasks where non-volatile, instant-on behavior and low standby power are valuable.
This commercial-grade device offers designers a scalable, integrated building block that leverages MachXO2 family-level features—flexible I/O standards, on-chip flash configuration and advanced clocking—backed by RoHS compliance and a defined operating temperature range for reliable deployment in commercial products.
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