LCMXO2-1200ZE-3TG144C

The LCMXO2-1200ZE-3TG144C is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It offers a compact, low-power programmable logic solution featuring 1,280 logic elements, 65,536 bits of on-chip RAM and 107 user I/Os in a 144-pin LQFP surface-mount package.

Designed for system control, interface bridging and glue-logic applications, this device combines non-volatile configuration, flexible I/O support and on-chip peripherals to simplify board-level integration and accelerate time-to-market.

Key Features

• Logic Capacity — 1,280 logic elements suitable for glue logic, control functions and medium-complexity FPGA tasks.
• On-chip Memory — 65,536 bits of embedded RAM for FIFOs, small buffers and local data storage.
• Rich I/O Count — 107 user I/Os to support multiple interfaces, board-level peripherals and parallel connections in a single device.
• Low-Voltage Core — Core voltage supply range of 1.14 V to 1.26 V, enabling compatibility with low-voltage system rails.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Package and Mounting — 144-LQFP (supplier package noted as 144-TQFP 20×20) in a surface-mount form factor for easy PCB placement and routing.
• Non-volatile, Instant-On Configuration — Benefits from MachXO2 family non-volatile user flash and instant-on capability for fast startup and single-chip system designs.
• Flexible I/O and Interfaces — MachXO2 family programmable I/O buffer options and on-chip peripheral support (SPI, I²C, JTAG) for interface consolidation and board-level simplification.
• Low Power Options — The MachXO2 family includes ultra low power features and power-saving modes, suitable when overall system power consumption is a concern.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Interface Bridging — Use the device to implement protocol conversion, level translation and bus glue logic where multiple I/Os and flexible buffering are required.
• Control and Timing — Integrate timers, counters and on-chip logic to centralize control functions for consumer or communications equipment.
• Display and Peripheral I/O — Support user interfaces and peripheral connectivity with abundant I/Os and programmable I/O standards from the MachXO2 family.
• Embedded System Glue Logic — Replace discrete components and reduce BOM by consolidating glue logic, simple state machines and interface handlers into a single programmable device.

Unique Advantages

• Highly Integrated Solution: Combines logic, on-chip RAM and non-volatile configuration to reduce board-level component count.
• Flexible I/O Support: 107 I/Os enable multiple parallel interfaces and simplify routing for complex connector layouts.
• Instant-On Non-Volatile Configuration: On-chip flash enables immediate operation after power-up without external configuration memory.
• Compact, Surface-Mount Package: 144-LQFP footprint offers a balance of pin count and PCB area for space-constrained designs.
• Commercial Operating Range: Specified 0 °C to 85 °C operation aligns with a wide range of consumer and commercial electronic products.

Why Choose LCMXO2-1200ZE-3TG144C?

The LCMXO2-1200ZE-3TG144C positions itself as a practical, low-power FPGA option for designs that need moderate logic density, significant I/O count and on-chip RAM in a compact surface-mount package. Its MachXO2 family capabilities — including non-volatile configuration, flexible I/O and on-chip peripherals — make it well-suited for control, interface and glue-logic roles where integration and quick startup matter.

Choose this device when you need a reliable, commercially rated programmable logic component that reduces BOM complexity, accelerates development and supports scalable system-level designs backed by MachXO2 family features.

Request a quote or submit an inquiry to purchase LCMXO2-1200ZE-3TG144C for your next design.