LCMXO2-1200ZE-3TG100C

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP

Quantity 1,494 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-3TG100C – MachXO2 Field Programmable Gate Array (FPGA) IC, 79 I/Os, 1280 logic elements, 100-LQFP

The LCMXO2-1200ZE-3TG100C is a MachXO2 family FPGA offering reconfigurable logic and on-chip non-volatile configuration for instant-on operation. It provides approximately 1280 logic elements and roughly 64 kbits of embedded RAM in a 100-pin LQFP/TQFP package, targeting compact, low-power control and interface roles in commercial electronic designs.

Designed for flexible I/O and system integration, this device combines on-chip user flash, programmable I/O buffer options and low standby power characteristics to simplify board-level design and accelerate time to market.

Key Features

  • Core Logic — Approximately 1280 logic elements supporting general-purpose programmable logic functions for glue logic, protocol bridging and control tasks.
  • Embedded Memory — Total on-chip RAM of 65,536 bits (approximately 64 kbits) for FIFOs, small buffers and state storage.
  • I/O Density & Flexibility — 79 user I/Os in the 100-pin package with the MachXO2 family’s programmable sysIO buffer options and on-chip differential termination, enabling a wide range of signaling standards.
  • Non-Volatile Configuration — On-chip user flash memory and family support for single-chip, instant-on configuration with background programming and optional dual-boot capability.
  • Power — Low-power MachXO2 architecture with family standby power as low as 22 μW and device supply range of 1.14 V to 1.26 V for the core.
  • Clocking & Timing — Family-level support for multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis and flexible clock management.
  • Hardened System Functions — Embedded SPI, I2C and timer/counter primitives plus an on-chip oscillator are available in the MachXO2 family to simplify system-level tasks.
  • Packaging & Operating Range — Surface-mount 100-pin LQFP / 100-TQFP (14 × 14 mm) package; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Display & Video Interfaces — Use the family’s pre-engineered display gearing and DDR I/O capabilities for display timing, panel interfaces and signal conditioning.
  • Peripheral Bridge & Glue Logic — Consolidate interface translation and board-level glue logic to reduce BOM and simplify wiring between controllers, sensors and peripherals.
  • Embedded System Control — Integrate SPI/I2C peripherals, timers and on-chip oscillator for device management, power sequencing and supervisory functions.
  • Memory Interface Support — Implement DDR/DDR2/LPDDR-related control and gearing features provided by the MachXO2 family for moderate-speed memory interfaces and buffering.

Unique Advantages

  • Instant-on, Non-volatile Operation: Single-chip, infinitely reconfigurable MachXO2 architecture provides immediate availability of logic at power-up without external configuration memory.
  • Low Standby Power: Family-level standby figures as low as 22 μW help minimize idle power in battery-assisted or always-on designs.
  • Integrated System Functions: On-chip SPI, I2C, timer/counter and oscillator reduce external component count and simplify firmware and hardware partitioning.
  • Flexible, Programmable I/O: Programmable sysIO buffer options and differential I/O support enable compatibility with multiple signaling standards from a single device.
  • Field Update Capability: TransFR reconfiguration and background programming allow in-field logic updates while maintaining system operation.
  • Compact Packaging: 100-pin LQFP/TQFP package delivers a balance of I/O count and small PCB footprint for space-constrained commercial products.

Why Choose LCMXO2-1200ZE-3TG100C?

The LCMXO2-1200ZE-3TG100C positions itself as a compact, low-power, non-volatile FPGA solution for commercial embedded designs that require flexible I/O, on-chip control peripherals and instant-on capability. With approximately 1280 logic elements, around 64 kbits of embedded RAM and 79 I/Os in a 100-pin package, it fits applications that need a balance of logic density and integration without relying on external configuration devices.

Engineers benefit from the MachXO2 family’s integrated features—on-chip user flash, hardened SPI/I2C, PLLs and programmable I/O—enabling reduced BOM, simplified board design and straightforward scalability across related family densities.

Request a quote or submit a sales inquiry to get pricing and availability for the LCMXO2-1200ZE-3TG100C and discuss how it can fit into your next design.

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