LCMXO2-1200ZE-3TG100C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP |
|---|---|
| Quantity | 1,494 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-3TG100C – MachXO2 Field Programmable Gate Array (FPGA) IC, 79 I/Os, 1280 logic elements, 100-LQFP
The LCMXO2-1200ZE-3TG100C is a MachXO2 family FPGA offering reconfigurable logic and on-chip non-volatile configuration for instant-on operation. It provides approximately 1280 logic elements and roughly 64 kbits of embedded RAM in a 100-pin LQFP/TQFP package, targeting compact, low-power control and interface roles in commercial electronic designs.
Designed for flexible I/O and system integration, this device combines on-chip user flash, programmable I/O buffer options and low standby power characteristics to simplify board-level design and accelerate time to market.
Key Features
- Core Logic — Approximately 1280 logic elements supporting general-purpose programmable logic functions for glue logic, protocol bridging and control tasks.
- Embedded Memory — Total on-chip RAM of 65,536 bits (approximately 64 kbits) for FIFOs, small buffers and state storage.
- I/O Density & Flexibility — 79 user I/Os in the 100-pin package with the MachXO2 family’s programmable sysIO buffer options and on-chip differential termination, enabling a wide range of signaling standards.
- Non-Volatile Configuration — On-chip user flash memory and family support for single-chip, instant-on configuration with background programming and optional dual-boot capability.
- Power — Low-power MachXO2 architecture with family standby power as low as 22 μW and device supply range of 1.14 V to 1.26 V for the core.
- Clocking & Timing — Family-level support for multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis and flexible clock management.
- Hardened System Functions — Embedded SPI, I2C and timer/counter primitives plus an on-chip oscillator are available in the MachXO2 family to simplify system-level tasks.
- Packaging & Operating Range — Surface-mount 100-pin LQFP / 100-TQFP (14 × 14 mm) package; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Display & Video Interfaces — Use the family’s pre-engineered display gearing and DDR I/O capabilities for display timing, panel interfaces and signal conditioning.
- Peripheral Bridge & Glue Logic — Consolidate interface translation and board-level glue logic to reduce BOM and simplify wiring between controllers, sensors and peripherals.
- Embedded System Control — Integrate SPI/I2C peripherals, timers and on-chip oscillator for device management, power sequencing and supervisory functions.
- Memory Interface Support — Implement DDR/DDR2/LPDDR-related control and gearing features provided by the MachXO2 family for moderate-speed memory interfaces and buffering.
Unique Advantages
- Instant-on, Non-volatile Operation: Single-chip, infinitely reconfigurable MachXO2 architecture provides immediate availability of logic at power-up without external configuration memory.
- Low Standby Power: Family-level standby figures as low as 22 μW help minimize idle power in battery-assisted or always-on designs.
- Integrated System Functions: On-chip SPI, I2C, timer/counter and oscillator reduce external component count and simplify firmware and hardware partitioning.
- Flexible, Programmable I/O: Programmable sysIO buffer options and differential I/O support enable compatibility with multiple signaling standards from a single device.
- Field Update Capability: TransFR reconfiguration and background programming allow in-field logic updates while maintaining system operation.
- Compact Packaging: 100-pin LQFP/TQFP package delivers a balance of I/O count and small PCB footprint for space-constrained commercial products.
Why Choose LCMXO2-1200ZE-3TG100C?
The LCMXO2-1200ZE-3TG100C positions itself as a compact, low-power, non-volatile FPGA solution for commercial embedded designs that require flexible I/O, on-chip control peripherals and instant-on capability. With approximately 1280 logic elements, around 64 kbits of embedded RAM and 79 I/Os in a 100-pin package, it fits applications that need a balance of logic density and integration without relying on external configuration devices.
Engineers benefit from the MachXO2 family’s integrated features—on-chip user flash, hardened SPI/I2C, PLLs and programmable I/O—enabling reduced BOM, simplified board design and straightforward scalability across related family densities.
Request a quote or submit a sales inquiry to get pricing and availability for the LCMXO2-1200ZE-3TG100C and discuss how it can fit into your next design.