LCMXO2-1200ZE-3SG32I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 21 65536 1280 32-UFQFN Exposed Pad |
|---|---|
| Quantity | 964 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 32-QFN (5x5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 32-UFQFN Exposed Pad | Number of I/O | 21 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-3SG32I – MachXO2 FPGA, 1,280 Logic Elements, 32‑UFQFN
The LCMXO2-1200ZE-3SG32I is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for compact, industrial-grade embedded logic and I/O control. The device combines 160 LABs (1280 logic elements) with 65,536 bits of on-chip RAM and 21 general-purpose I/Os in a 32‑UFQFN exposed-pad package for space-efficient surface-mount designs.
Targeted at industrial and embedded applications, this MachXO2 device emphasizes low-power operation, non-volatile configuration, and flexible I/O support to simplify system integration and reduce board-level complexity.
Key Features
- Logic Capacity — 160 LABs delivering 1,280 logic elements to implement glue logic, state machines, or midsize programmable functions.
- On‑chip Memory — Includes 65,536 bits of total RAM (approximately 0.066 Mbits) for distributed storage and local buffering.
- I/O Flexibility — 21 I/Os in a compact package. The MachXO2 family provides a programmable sysIO buffer and support for a wide range of I/O standards to accommodate diverse interface requirements.
- Power and Supply — Single supply operation at 1.14 V to 1.26 V. MachXO2 family devices are characterized by ultra low power operation, including standby power down to microamp levels.
- Non‑volatile Configuration — Instant-on, single‑chip non‑volatile configuration with background programming and on-chip user flash memory supported by the MachXO2 family.
- Reconfiguration and System Features — Family features include in-field reconfiguration (TransFR), on-chip oscillator, timers/counters, SPI and I2C interfaces, and IEEE 1149.1 boundary scan for enhanced system-level capability.
- Package and Mounting — 32‑UFQFN exposed pad (supplier device package: 32‑QFN 5×5), surface mount package optimized for small footprint designs.
- Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C and RoHS compliant for deployment in industrial environments.
Typical Applications
- Industrial Control — Deterministic logic and I/O consolidation for sensors, motor control interfaces, and factory automation where industrial temperature operation matters.
- Interface Bridging and Glue Logic — Compact FPGA logic to implement protocol conversion, bus adaptation, and board-level integration using available I/Os and on-chip memory.
- Display and Memory Interfaces — MachXO2 family pre-engineered I/O and DDR/DDRx support make the device suitable for intermediate display or memory controller tasks in constrained footprints.
- Embedded System Management — Instant-on non-volatile configuration and on-chip peripheral functions (SPI, I2C, timers) for system supervision, configuration management, and peripheral control.
Unique Advantages
- Compact, low-profile package: 32‑UFQFN exposed-pad (5×5) gives a small PCB footprint while maintaining accessible I/Os and thermal performance.
- Industrial operating range: –40 °C to 100 °C rating supports reliable operation in industrial and harsh environments.
- Non‑volatile instant-on behavior: Single-chip non-volatile configuration reduces external memory requirements and enables fast system start-up.
- Flexible system integration: On-chip peripherals (SPI, I2C, timers) and reconfiguration capabilities reduce BOM and simplify firmware/hardware partitioning.
- Low-power operation: MachXO2 family low standby power characteristics help minimize system-level energy consumption.
Why Choose LCMXO2-1200ZE-3SG32I?
This MachXO2 FPGA balances mid-level logic capacity and on-chip memory with flexible I/O and compact packaging for industrial embedded designs. Its combination of 160 LABs (1,280 logic elements), 65,536 bits of RAM, and 21 I/Os in a 32‑UFQFN surface-mount package makes it suitable for designers who need a small, reconfigurable, and industrial-grade programmable element.
Customers benefit from the MachXO2 family’s system-level features—non-volatile instant-on configuration, on-chip peripheral interfaces, and reconfiguration options—providing long-term design scalability and simplified integration without relying on external configuration hardware.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO2-1200ZE-3SG32I.

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