LCMXO2-1200ZE-3SG32I

IC FPGA 21 I/O 32QFNS
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 21 65536 1280 32-UFQFN Exposed Pad

Quantity 964 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package32-QFN (5x5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case32-UFQFN Exposed PadNumber of I/O21Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-3SG32I – MachXO2 FPGA, 1,280 Logic Elements, 32‑UFQFN

The LCMXO2-1200ZE-3SG32I is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for compact, industrial-grade embedded logic and I/O control. The device combines 160 LABs (1280 logic elements) with 65,536 bits of on-chip RAM and 21 general-purpose I/Os in a 32‑UFQFN exposed-pad package for space-efficient surface-mount designs.

Targeted at industrial and embedded applications, this MachXO2 device emphasizes low-power operation, non-volatile configuration, and flexible I/O support to simplify system integration and reduce board-level complexity.

Key Features

  • Logic Capacity — 160 LABs delivering 1,280 logic elements to implement glue logic, state machines, or midsize programmable functions.
  • On‑chip Memory — Includes 65,536 bits of total RAM (approximately 0.066 Mbits) for distributed storage and local buffering.
  • I/O Flexibility — 21 I/Os in a compact package. The MachXO2 family provides a programmable sysIO buffer and support for a wide range of I/O standards to accommodate diverse interface requirements.
  • Power and Supply — Single supply operation at 1.14 V to 1.26 V. MachXO2 family devices are characterized by ultra low power operation, including standby power down to microamp levels.
  • Non‑volatile Configuration — Instant-on, single‑chip non‑volatile configuration with background programming and on-chip user flash memory supported by the MachXO2 family.
  • Reconfiguration and System Features — Family features include in-field reconfiguration (TransFR), on-chip oscillator, timers/counters, SPI and I2C interfaces, and IEEE 1149.1 boundary scan for enhanced system-level capability.
  • Package and Mounting — 32‑UFQFN exposed pad (supplier device package: 32‑QFN 5×5), surface mount package optimized for small footprint designs.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C and RoHS compliant for deployment in industrial environments.

Typical Applications

  • Industrial Control — Deterministic logic and I/O consolidation for sensors, motor control interfaces, and factory automation where industrial temperature operation matters.
  • Interface Bridging and Glue Logic — Compact FPGA logic to implement protocol conversion, bus adaptation, and board-level integration using available I/Os and on-chip memory.
  • Display and Memory Interfaces — MachXO2 family pre-engineered I/O and DDR/DDRx support make the device suitable for intermediate display or memory controller tasks in constrained footprints.
  • Embedded System Management — Instant-on non-volatile configuration and on-chip peripheral functions (SPI, I2C, timers) for system supervision, configuration management, and peripheral control.

Unique Advantages

  • Compact, low-profile package: 32‑UFQFN exposed-pad (5×5) gives a small PCB footprint while maintaining accessible I/Os and thermal performance.
  • Industrial operating range: –40 °C to 100 °C rating supports reliable operation in industrial and harsh environments.
  • Non‑volatile instant-on behavior: Single-chip non-volatile configuration reduces external memory requirements and enables fast system start-up.
  • Flexible system integration: On-chip peripherals (SPI, I2C, timers) and reconfiguration capabilities reduce BOM and simplify firmware/hardware partitioning.
  • Low-power operation: MachXO2 family low standby power characteristics help minimize system-level energy consumption.

Why Choose LCMXO2-1200ZE-3SG32I?

This MachXO2 FPGA balances mid-level logic capacity and on-chip memory with flexible I/O and compact packaging for industrial embedded designs. Its combination of 160 LABs (1,280 logic elements), 65,536 bits of RAM, and 21 I/Os in a 32‑UFQFN surface-mount package makes it suitable for designers who need a small, reconfigurable, and industrial-grade programmable element.

Customers benefit from the MachXO2 family’s system-level features—non-volatile instant-on configuration, on-chip peripheral interfaces, and reconfiguration options—providing long-term design scalability and simplified integration without relying on external configuration hardware.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO2-1200ZE-3SG32I.

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