LCMXO2-1200ZE-3TG100I

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP

Quantity 1,134 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-3TG100I – MachXO2 Field Programmable Gate Array (FPGA), 1280 Logic Elements, 79 I/Os, 100-LQFP

The LCMXO2-1200ZE-3TG100I is a MachXO2-series field programmable gate array (FPGA) IC in a 100-pin LQFP package targeted at industrial applications. It combines a flexible logic fabric with embedded memory and configurable I/O to address system control, I/O expansion and interface bridging in industrial and embedded designs.

Key on-chip resources include 1,280 logic elements (160 CLBs), approximately 65,536 bits of embedded RAM and 79 I/O pins. The device supports low-voltage operation (1.14 V to 1.26 V) and an extended operating temperature range of –40 °C to 100 °C for industrial deployments.

Key Features

  • Programmable Logic Capacity — 1,280 logic elements (160 CLBs) to implement glue logic, protocol conversion and custom control functions.
  • Embedded Memory — Approximately 65,536 bits of on-chip RAM to support FIFOs, small frame buffers and state storage.
  • Flexible I/O — 79 general-purpose I/Os in the 100-LQFP package for wide-ranging peripheral and sensor interfacing.
  • Low-Voltage Operation — Voltage supply range of 1.14 V to 1.26 V for integration into low-voltage systems.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C to meet industrial environment requirements.
  • Surface Mount Package — 100-LQFP (supplier package: 100-TQFP 14 × 14 mm) for board-level assembly in compact designs.
  • MachXO2 Family Capabilities — Family-level features include ultra-low-power options, on-chip user flash memory, programmable differential and single‑ended I/Os, pre‑engineered source-synchronous I/O and flexible clocking including PLLs and multiple primary clocks.
  • Non‑volatile, Reconfigurable — MachXO2 family devices offer instant-on, single-chip non‑volatile configuration and support reprogramming via standard interfaces (JTAG, SPI, I2C) as described in the family datasheet.
  • Standards and System Support — Family-level system features include on-chip SPI/I2C controllers, timers/counters, boundary-scan support and background programming options.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement custom control logic, I/O aggregation and timing-critical glue logic in industrial automation equipment using the device’s extended temperature range and industrial grade.
  • Interface Bridging — Bridge between different logic standards and protocols using flexible sysIO buffers and the device’s dense I/O count.
  • Display and Memory Interfaces — Leverage family-level pre‑engineered source-synchronous I/O and DDR gearing for display or memory interface support in embedded systems.
  • Sensor and Peripheral Aggregation — Consolidate sensor inputs, handle debouncing and preprocessing, and provide deterministic I/O response using on-chip logic and embedded RAM.

Unique Advantages

  • Compact, Integrated Solution: Combines logic, embedded RAM and a high I/O count in a single 100-LQFP package to reduce BOM and board area.
  • Industrial Readiness: Industrial temperature rating (–40 °C to 100 °C) and surface-mount packaging enable deployment in real-world industrial environments.
  • Low-Voltage, Low-Power Options: Operates at a narrow low-voltage supply (1.14 V–1.26 V) consistent with low-power system designs and MachXO2 family low-power capabilities.
  • Reconfigurable Non-Volatile Logic: Instant-on, single-chip non‑volatile configuration and family support for background programming allow in-field updates and secure boot options.
  • Rich System-Level Features: On-chip peripherals (SPI, I2C, timers), programmable I/O standards and clocking resources help simplify external component count and system design.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose LCMXO2-1200ZE-3TG100I?

The LCMXO2-1200ZE-3TG100I positions itself as a versatile, industrial-grade FPGA option for embedded and industrial system designers who need a compact, reconfigurable device with a balanced mix of logic, embedded memory and I/O. Its combination of 1,280 logic elements, approximately 65,536 bits of RAM and 79 I/Os in a 100‑pin LQFP package makes it suitable for control logic, interface bridging and sensor aggregation tasks where board space and system integration matter.

Choosing this MachXO2-series part offers the benefits of family-level features—non‑volatile instant-on configuration, flexible I/O standards and system peripherals—helping reduce external components and enabling in-field reconfiguration. The device is well-suited for teams seeking a scalable, robust FPGA building block backed by documented MachXO2 family capabilities.

If you would like pricing or availability information, request a quote or submit a quote request to receive a formal quotation and lead-time details.

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