LCMXO2-1200ZE-3TG100CR1

The LCMXO2-1200ZE-3TG100CR1 is a MachXO2 family FPGA from Lattice Semiconductor offered in a 100-pin LQFP surface-mount package. It provides 1,280 logic elements, 65,536 bits of on-chip RAM and 79 general-purpose I/O pins, making it suitable for commercial embedded systems that require flexible glue logic, interface control and low-power programmable logic.

Designed around the MachXO2 architecture, the device combines configurable logic and embedded memory with programmable I/O and single-supply operation to simplify system integration in commercial-grade applications.

Key Features

• Logic Capacity – 1,280 logic elements for implementing glue logic, protocol bridging and custom finite-state machines.
• On-chip RAM – 65,536 bits of embedded RAM to support small FIFOs, buffers and state storage without external memory.
• I/O Count and Flexibility – 79 I/O pins available in the 100-pin package for broad connectivity to peripherals and interfaces.
• Low Voltage Operation – Single-supply voltage range from 1.14 V to 1.26 V to match low-voltage system rails.
• Package and Mounting – 100-LQFP (supplier device package 100-TQFP, 14×14 mm) surface-mount package for compact PCB designs.
• Commercial Grade Temperature – Rated for operation from 0 °C to 85 °C to meet standard commercial environmental requirements.
• RoHS Compliant – Meets RoHS requirements for lead-free assembly and environmental compliance.
• MachXO2 Family Capabilities – Family-level features include flexible logic architecture, low-power operation, programmable I/O buffering and on-chip non-volatile configuration (as described in the MachXO2 family datasheet).

Typical Applications

• Interface Bridging and Glue Logic – Use the device to implement protocol translation, bus interfacing and system glue where flexible logic and multiple I/Os are required.
• User Interface and Display Control – Suitable for display I/O and user-interface functions that benefit from programmable I/O and embedded memory.
• Peripheral Expansion – Add or re-map peripheral signals, implement simple state machines, or provide buffered I/O to support evolving hardware requirements.

Unique Advantages

• Compact, Surface-Mount Package: The 100-LQFP package (14×14 mm) balances pin count and PCB footprint for space-constrained commercial designs.
• Integrated Memory and Logic: 65,536 bits of on-chip RAM plus 1,280 logic elements reduce reliance on external memory and discrete logic, simplifying BOM and board layout.
• Wide I/O Count: 79 I/Os provide flexible connectivity for sensors, interfaces and peripherals without sacrificing package density.
• Low-Voltage Single-Supply Operation: Operates from 1.14 V to 1.26 V to align with modern low-voltage digital rails and minimize power-supply complexity.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream commercial applications and environments.
• Regulatory Compliance: RoHS-compliant construction supports lead-free assembly workflows and regulatory requirements.

Why Choose LCMXO2-1200ZE-3TG100CR1?

The LCMXO2-1200ZE-3TG100CR1 delivers a balanced combination of programmable logic, embedded RAM and flexible I/O in a compact 100-pin LQFP package. Its 1,280 logic elements and 65,536 bits of on-chip RAM make it well suited for commercial embedded designs that need reconfigurable glue logic, interface control and compact system integration while operating on low-voltage rails.

Backed by the MachXO2 family architecture and Lattice Semiconductor’s feature set, this device offers designers a practical route to reduce external components, manage power footprints and accelerate development cycles for commercial products.

Request a quote or submit a parts inquiry to get pricing and availability for LCMXO2-1200ZE-3TG100CR1 for your next design.