LCMXO2-1200ZE-3TG144I

IC FPGA 107 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP

Quantity 461 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O107Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200ZE-3TG144I – MachXO2 FPGA IC — 1280 logic elements, 107 I/Os, 144‑LQFP

The LCMXO2-1200ZE-3TG144I is an industrial-grade MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a flexible low-power FPGA architecture suitable for glue logic, system control, and interface bridging in industrial and embedded designs.

Built on the MachXO2 family, this device combines 1,280 logic elements, approximately 65 kbits of on-chip RAM, and 107 user I/Os in a 144‑lead package. Key value propositions include low standby power, on-chip non‑volatile configuration options, and system-level features that simplify integration and in-field updates.

Key Features

  • Core (Logic Elements) — 1,280 logic elements for implementing glue logic, control state machines, and small accelerators.
  • Embedded Memory — 65,536 total RAM bits (approximately 64 kbits) for distributed storage and buffering within user logic.
  • I/O and Package — 107 general-purpose I/O pins delivered in a 144‑lead package (specified as 144‑LQFP; supplier package 144‑TQFP, 20 × 20 mm). Surface-mount mounting type simplifies placement on compact PCBs.
  • Power and Voltage — Single-supply operation with a specified core voltage range of 1.14 V to 1.26 V and ultra-low-power family options including microampere-class standby modes.
  • Temperature and Grade — Industrial-grade device rated for operation from −40°C to 100°C, suitable for extended-temperature embedded systems.
  • On-Chip Non-Volatile Memory — MachXO2 family includes on-chip user flash memory and background programming options for single-chip, secure configurations and instant-on behavior.
  • Clocking and PLL — XO2-1200 family devices include an integrated PLL to support flexible clocking schemes for system and I/O timing.
  • Flexible I/O Standards (Family-level) — MachXO2 family I/O supports a broad set of signaling standards and programmable buffer options for interfacing with a wide range of peripherals and subsystems.
  • System-Level Support — Family features include on-chip peripherals (SPI, I²C, timer/counter), JTAG and in-system programming, and support for field reconfiguration (TransFR).
  • RoHS Compliant — Device is compliant with RoHS requirements for lead-free assembly.

Typical Applications

  • System Glue Logic — Replace multiple discrete components by consolidating control, decoding, and interfacing in a single FPGA for cleaner BOM and PCB routing.
  • Industrial Control — Implement interfaces, signal conditioning logic, and control finite-state machines within an industrial-temperature-rated device.
  • Interface Bridging — Bridge between disparate buses and I/O standards using the MachXO2 family’s flexible I/O and programmable buffers.
  • In-System Configuration and Field Updates — Use on-chip non-volatile memory and TransFR reconfiguration to enable secure instant-on and in-field logic updates.

Unique Advantages

  • Compact, integrated solution: 1,280 logic elements plus on-chip RAM and I/Os reduce external glue logic and lower BOM complexity.
  • Industrial temperature range: Rated −40°C to 100°C to support long-term operation in extended-temperature embedded and industrial systems.
  • Low standby and operational power: MachXO2 family low-power characteristics help reduce system power budget and enable energy-efficient standby modes.
  • Instant-on and secure configuration: On-chip user flash and family-level secure single-chip programming simplify system boot and configuration management.
  • Flexible I/O and clocking: 107 I/Os and integrated PLL support efficient interfacing and timing for a wide range of peripherals and external devices.
  • RoHS-compliant surface-mount package: 144‑lead package and surface-mount mounting support standard manufacturing flows and compact board layouts.

Why Choose LCMXO2-1200ZE-3TG144I?

The LCMXO2-1200ZE-3TG144I positions itself as a flexible, industrial-grade FPGA option for designers needing moderate logic capacity, on-chip RAM, and a generous set of I/Os in a compact 144‑lead package. Its MachXO2 family capabilities—non-volatile configuration, low-power operation, and system-level peripherals—help shorten development time and simplify system architecture.

This device is well suited for embedded and industrial customers looking to consolidate discrete logic, implement robust interface bridging, and enable field-updatable designs while maintaining low power and extended-temperature operation.

Request a quote or submit an inquiry to obtain pricing, lead time, and available inventory for the LCMXO2-1200ZE-3TG144I. Our team can provide technical details and support to help integrate this MachXO2 FPGA into your next design.

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