LCMXO2-2000HC-4TG100C

The LCMXO2-2000HC-4TG100C is a MachXO2 series FPGA offering 2,112 logic elements and a broad set of embedded resources for flexible on-chip logic, interface and control functions. It combines non-volatile configuration, rich I/O support and on-chip memory in a compact 100-pin package to address glue-logic, interface bridging and low-power embedded system needs.

Designed for commercial-grade applications, this device supports a single-supply voltage range of 2.375 V to 3.465 V and operates from 0 °C to 85 °C, making it suitable for a wide range of board-level designs that require instant-on reconfiguration and robust I/O flexibility.

Key Features

• Core Logic 2,112 logic elements provide the programmable fabric required for glue logic, control, and custom acceleration tasks.
• Embedded Memory 75,776 total RAM bits of on-chip memory for FIFOs, small buffers and distributed storage.
• On‑Chip User Flash Family-level on-chip User Flash Memory is supported; the MachXO2-2000 family provides UFM capacity in the family table (XO2-2000 shown with 80 kbits in the datasheet).
• I/O Density and Flexibility 79 I/O pins with programmable sysIO buffer options and support for a wide range of interface standards as described in the MachXO2 family datasheet.
• Power and Low-Power Modes Advanced low-power device characteristics from the MachXO2 family with standby and power-saving options and single‑supply operation across 2.375 V–3.465 V.
• Clocking and PLL Flexible on-chip clocking with primary clocks and device PLL capability (MachXO2 family provides PLL resources; XO2-2000 family device options include PLL support).
• Non-volatile, Instant-On Non-volatile configuration provides instant-on operation and in-field reconfiguration capability for background programming and remote updates.
• Packaging and Temperature Surface-mount 100-pin package (listed as 100-LQFP; supplier device package noted as 100-TQFP 14×14) rated for commercial operation from 0 °C to 85 °C. RoHS compliant.
• System-Level Support Built-in utilities from the MachXO2 family such as SPI/I2C interfaces, timers/counters and boundary-scan support simplify integration and board-level debugging.

Typical Applications

• Display and Imaging Interfaces Programmable DDR and display gearing features in the MachXO2 family support display timing and source-synchronous I/O requirements.
• Memory Interface Buffering Dedicated DDR/DDR2/LPDDR support and on-chip RAM make the device suitable for buffering, DQS-aligned capture and memory interface glue logic.
• Protocol Bridging and Glue Logic Flexible I/O standards and 2,112 logic elements enable custom protocol adaptation and board-level interface consolidation.
• Low-Power Embedded Systems Instant-on non-volatile configuration and family-level low-power options suit applications that need rapid startup and minimized standby power.

Unique Advantages

• Compact, Integrated Solution: Combines configurable logic, embedded RAM and on-chip user flash in a single 100-pin surface-mount package to reduce BOM and board area.
• Broad I/O Support: 79 programmable I/Os with family-level sysIO buffer options let you implement multiple interface standards without additional transceivers.
• Non-volatile Instant-On: On-chip non-volatile configuration enables microsecond power-up and in-field reconfiguration without external configuration memories.
• Single-Supply Flexibility: Operates across a 2.375 V to 3.465 V supply range to simplify power-rail design and support mixed-voltage systems.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C to match common commercial electronics deployment requirements.

Why Choose LCMXO2-2000HC-4TG100C?

The LCMXO2-2000HC-4TG100C delivers a balanced combination of programmable logic density, embedded RAM and flexible I/O in a compact 100-pin package. Its non-volatile instant-on capability and family-level system features such as SPI/I2C, timers and PLLs make it a practical choice for designs that require reliable startup behavior, in-field updates and reduced external components.

This device is well suited to engineers building interface-intensive boards, display and memory interface subsystems, or low-power embedded controllers that benefit from on-chip reconfiguration and integrated peripheral support. RoHS compliance and a commercial temperature rating support broad deployment across standard electronic products.

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