LCMXO2-2000HC-5BG256C

The LCMXO2-2000HC-5BG256C is a commercial-grade MachXO2 family FPGA offering flexible, non-volatile programmable logic in a 256-ball LFBGA package. It provides 2112 logic elements, 206 user I/Os and on-chip RAM to implement control, interface bridging and system glue logic within the commercial temperature range.

Designed for low-power, instant-on applications, this device combines embedded and distributed memory, programmable I/O standards and family-level system features to simplify board-level integration and reduce external components.

Key Features

• Flexible Logic Capacity — 2112 logic elements for implementing combinational and sequential logic in glue-logic, control and interface functions.
• On-chip Memory — 75,776 total RAM bits available on-chip; MachXO2 family devices also include family-level embedded and distributed memory options for system designs.
• High-density I/O — 206 user I/Os with programmable sysIO support for multiple standards, including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL 25/18 and HSTL 18. I/Os support on-chip differential termination and programmable pull-up/pull-down modes.
• Power and Voltage — Single-supply operation across a wide range: 2.375 V to 3.465 V. Family-level low-power capabilities include standby modes and ultra-low standby currents.
• Non-volatile Reconfiguration — MachXO2 family supports on-chip user flash memory and background programming; family-level UFM up to 256 kbits enables device configuration and in-field updates.
• Clocking and PLLs — Family-level clocking includes multiple primary clocks, up to two analog PLLs with fractional-N synthesis and a wide input frequency range (7 MHz to 400 MHz) for flexible timing architectures.
• System-level Functions — Hardened on-chip functions such as SPI, I²C, timer/counter and an on-chip oscillator simplify common control and communication tasks.
• Package and Temperature — Surface-mount 256-LFBGA package (supplier device package: 256-CABGA, 14×14 mm) rated for commercial operation from 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Translation — Use the device’s flexible sysIO buffers and diverse I/O standards to convert or bridge between disparate bus and serial interfaces.
• Display and Video I/O — Family-level pre‑engineered source-synchronous I/O, DDR registers and gearing support make it suitable for display timing, buffering and capture applications.
• Peripheral and Sensor Aggregation — Hardened SPI and I²C controllers plus on-chip timers simplify sensor interfacing, aggregation and local control tasks.
• System Glue Logic and Control — Implement board-level finite state machines, reset logic, power sequencing and custom control functions with integrated non‑volatile configuration.

Unique Advantages

• High integration density: 2112 logic elements and 206 I/Os reduce the need for discrete glue logic and external interface chips.
• Non-volatile, instant-on capability: On-chip flash and MachXO2 family instant-on behavior enable rapid system startup and field updates without external configuration memory.
• Broad I/O flexibility: Programmable sysIO buffer and on-chip termination support a wide range of signaling standards to simplify board-level design.
• Built-in system peripherals: Hardened SPI, I²C, timer/counter and oscillator functions accelerate common control tasks and reduce IP integration work.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching many consumer and industrial-adjacent applications requiring commercial-grade components.
• RoHS compliant packaging: 256-ball surface-mount LFBGA package meets lead-free assembly requirements.

Why Choose LCMXO2-2000HC-5BG256C?

This MachXO2 device balances programmable logic capacity, on-chip memory and a high count of flexible I/Os in a compact 256-LFBGA package. It is well suited for designers who need a non-volatile, low-power FPGA for system glue logic, interface conversion and peripheral aggregation within a commercial temperature range.

Built on the MachXO2 family platform, the device benefits from family-level features such as hardened SPI/I²C peripherals, flexible clocking and in-field reconfiguration options that help reduce BOM complexity and support future design changes.

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