LCMXO2-2000HC-5FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA

Quantity 125 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-5FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC, 206 I/Os, 2,112 logic elements, 75,776 bits RAM, 256‑LBGA

The LCMXO2-2000HC-5FTG256I is an industrial-grade MachXO2 FPGA designed for low-power, instant-on system control and glue-logic applications. Built on the MachXO2 family architecture, this device combines 2,112 logic elements with approximately 75,776 bits of on-chip RAM and 206 general-purpose I/Os to address control, interface bridging, and configuration tasks in embedded systems.

Its core value proposition is compact, low-power reconfigurable logic with non-volatile, in-field update capability—suitable for industrial designs requiring robust I/O density, flexible interfacing and a small footprint package.

Key Features

  • Core Logic  2,112 logic elements (LEs) provide user-configurable combinational and sequential resources for glue logic, control state machines and protocol handling.
  • Embedded Memory  Approximately 75,776 bits of on-chip RAM support distributed storage and FIFO buffering for mid-size data handling and packet staging.
  • I/O Density & Flexibility  206 I/Os in the 256‑LBGA package deliver high pin count for interfacing to peripherals, sensors, displays and memory; family-level sysIO buffer support spans common standards for flexible integration.
  • Non-volatile Configuration  MachXO2 family devices include on-chip user flash memory and support instant-on operation and in-field reconfiguration for secure, single-chip, reprogrammable solutions.
  • Low Power Architecture  Family features include an advanced 65 nm low-power process and standby options; the MachXO2 family lists ultra low standby power modes for energy-sensitive designs.
  • Clocking & PLL  Family-level clock resources include multiple primary clocks and up to two analog PLLs for fractional-N frequency synthesis, useful for timing-critical interfaces.
  • Package & Mounting  Supplied in a 256‑LBGA / supplier 256‑FTBGA (17×17) package for surface-mount assembly and compact board-level implementation.
  • Supply & Operating Range  Single supply operation across 2.375 V to 3.465 V and industrial temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Implement control logic, sensor aggregation and protocol bridging in factory automation and building management systems using durable industrial temperature range and high I/O count.
  • Embedded System Glue Logic  Replace discrete logic and CPLDs for address decoding, bus arbitration and signal conditioning with compact reconfigurable logic.
  • Interface and Protocol Conversion  Use the device’s abundant I/Os and family-level programmable I/O buffers to adapt between different peripheral standards and legacy interfaces.
  • Display and User Interface Control  Drive multiplexed displays, push-button matrices and status indicators while handling debounce and timing tasks in a single device.

Unique Advantages

  • Compact, High‑I/O Integration: 206 I/Os in a 256‑ball BGA package reduce board complexity and connector count for dense embedded designs.
  • Non‑Volatile, Instant‑On Operation: On-chip user flash memory and instant-on behavior enable secure single-chip solutions and fast system start-up without external configuration ROM.
  • Low‑Power System Design: Family-level low-power process and standby modes help minimize idle energy consumption in always-on or battery-assisted systems.
  • Flexible Clocking and PLLs: Integrated clock resources and PLLs support a range of timing and high-speed I/O needs without external clock management ICs.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C, the device supports higher ambient applications commonly found in industrial environments.
  • RoHS Compliance: Meets current lead‑free manufacturing requirements for environmentally conscious designs.

Why Choose LCMXO2-2000HC-5FTG256I?

The LCMXO2-2000HC-5FTG256I positions itself as a versatile, industrial-grade FPGA for designers who need compact, reconfigurable logic with substantial I/O and embedded memory. Its balance of 2,112 logic elements, approximately 75,776 bits of RAM and 206 I/Os makes it well suited for replacing discrete logic, implementing protocol bridges, and consolidating board-level functions into a single device.

Backed by MachXO2 family features—non-volatile flash-based configuration, low-power operation, programmable I/O standards and integrated clocking—the device offers a scalable, long-term building block for embedded control, interface and system-management applications.

Request a quote or submit a pricing inquiry to receive availability and lead-time details for the LCMXO2-2000HC-5FTG256I.

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