LCMXO2-2000HC-5MG132I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,217 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 104 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-5MG132I – MachXO2 Field Programmable Gate Array (FPGA) IC
The LCMXO2-2000HC-5MG132I is a MachXO2-series FPGA in a 132‑LFBGA (CSPBGA) package, providing 2,112 logic elements and flexible on-chip resources for control, glue-logic and system-management functions. It combines a compact package and industrial temperature rating with reconfigurable logic, embedded memory and wide I/O support to address low-power, instant-on and system-control applications.
Key Features
- Logic Capacity — 2,112 logic elements (cells) for implementing custom glue logic, state machines and peripheral control.
- On‑chip Memory — Total on-chip RAM of 75,776 bits to support small FIFOs, buffers and embedded state storage.
- I/O Density and Flexibility — 104 I/Os on package for system interfacing and board-level connectivity.
- Power and Configuration — Single supply range of 2.375 V to 3.465 V; family-level features include instant-on non-volatile configuration and in-field reconfiguration (TransFR) for updating logic while the system operates.
- Low-Power Architecture (family) — Built on an advanced low-power process with standby and power-saving options for energy-sensitive designs.
- Pre-Engineered I/O and Memory Support (family) — Source-synchronous I/O, DDR register support in I/O cells and dedicated FIFO control logic to simplify timing-critical interfaces.
- Package and Mounting — 132‑ball LFBGA (CSPBGA) package, surface-mount for compact board layouts; supplier device package listed as 132‑CSPBGA (8×8).
- Industrial Temperature Range — Rated for −40 °C to 100 °C to support a broad range of industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- System Glue Logic — Replace fixed ASICs or discrete logic with reprogrammable logic for board-level control and protocol bridging.
- Peripheral and Interface Control — Manage and translate multiple I/O standards using the device’s flexible I/O counts and programmable buffers.
- Embedded Control and State Machines — Implement control functions, timers and simple state machines leveraging on-chip RAM and logic elements.
Unique Advantages
- Compact, reconfigurable solution: 2,112 logic elements in a 132‑ball LFBGA provide a small-footprint, reprogrammable alternative to fixed-function ICs.
- Integrated on‑chip memory: Approximately 75.8 kbits of on-chip RAM for local buffering and FIFO implementations, reducing external memory needs.
- Wide I/O count: 104 I/Os enable direct interfacing to multiple peripherals and board-level signals without additional I/O expanders.
- Industrial robustness: Rated −40 °C to 100 °C and RoHS compliant for long-term deployment in industrial systems.
- Flexible power and configuration: Operates from 2.375 V to 3.465 V and supports non-volatile instant-on and in-field reconfiguration capabilities for remote updates.
Why Choose LCMXO2-2000HC-5MG132I?
The LCMXO2-2000HC-5MG132I positions itself as a compact, industrial-grade FPGA option for designs that need reprogrammable logic, moderate on-chip memory and a high I/O count in a small BGA footprint. Its mix of logic capacity, embedded RAM and system-level configuration features make it well suited to replace discrete glue logic, implement peripheral controllers or add field-upgradeable functionality without increasing board area.
For teams focused on scalable, maintainable designs, the device delivers reprogrammability and in-field update options while meeting industrial temperature and RoHS requirements, enabling robust system deployments and simplified long-term support.
Request a quote or submit an inquiry for LCMXO2-2000HC-5MG132I to obtain pricing and availability information tailored to your project requirements.