LCMXO2-2000HC-5MG132C

IC FPGA 104 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA

Quantity 395 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O104Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-5MG132C – MachXO2 FPGA, 132‑LFBGA, 104 I/Os

The LCMXO2-2000HC-5MG132C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 132‑LFBGA (132‑CSPBGA 8×8) surface-mount package. It provides a flexible low-power programmable fabric with 2,112 logic elements and 104 I/Os for control, glue logic and interface tasks in commercial applications.

Designed for compact systems, the device combines on-chip memory resources and a wide supply voltage window (2.375 V to 3.465 V) with commercial temperature range operation (0 °C to 85 °C), enabling reliable board-level integration where low standby power and instant-on configurability are important.

Key Features

  • Logic Capacity — 2,112 logic elements, suitable for glue logic, protocol bridging and moderate-density control functions.
  • Memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) for distributed and embedded memory requirements within designs.
  • I/O — 104 general-purpose I/Os provided in the 132‑LFBGA package for flexible interfacing to sensors, peripherals and memory devices.
  • Power and Voltage — Operates from 2.375 V to 3.465 V, supporting a range of single-supply system designs and enabling low standby current operation.
  • Low Power Architecture — MachXO2 family features an advanced low-power process with options for ultra-low standby power, suitable for energy-conscious applications.
  • Non-Volatile, Instant-On — Family-level support for on-chip non-volatile configuration enables instant-on behavior and field reconfiguration via standard interfaces.
  • Package & Mounting — 132‑LFBGA (132‑CSPBGA, 8×8) surface-mount package for small-footprint board designs and reliable soldered mounting.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to meet typical commercial environment requirements.
  • Standards and Compliance — RoHS compliant, facilitating lead-free assembly and environmental compliance.

Typical Applications

  • Interface Bridging and Glue Logic — Use the FPGA’s 104 I/Os and 2,112 logic elements to consolidate discrete glue logic and implement protocol converters on a single chip.
  • Embedded Control — On-chip RAM and logic capacity support control tasks, timers and small state machines for consumer and commercial equipment.
  • Display and Memory I/O — Family capabilities include pre‑engineered source-synchronous I/O and geared display I/O options that assist display interfacing and memory controller functions.

Unique Advantages

  • Compact, Solderable Package: The 132‑LFBGA (8×8) CSPBGA footprint enables high-density board layouts while maintaining robust surface-mount reliability.
  • Low-Voltage Flexibility: A wide supply range (2.375 V–3.465 V) simplifies compatibility with common system rails and reduces power-rail design complexity.
  • Non-Volatile Configuration: Instant-on programmable fabric and on-chip non-volatile features reduce boot time and simplify system start-up.
  • Integrated Memory Resources: Nearly 76 kbits of on-chip RAM provide local storage for FIFOs, state, and small buffers without external memory.
  • RoHS Compliant: Meets lead-free assembly requirements for modern commercial product manufacturing.

Why Choose LCMXO2-2000HC-5MG132C?

This MachXO2 FPGA delivers a balanced combination of logic capacity, embedded memory and I/O density in a compact 132‑LFBGA package for commercial designs. Its low-power family architecture and non-volatile configuration support make it well suited for applications that need instant-on behavior and on-board reconfigurability while keeping the bill-of-materials low.

Designers building control logic, interface bridges or compact embedded systems will find the LCMXO2-2000HC-5MG132C a practical, verifiable option that integrates key system functions within a single solderable package and fits commercial temperature and voltage requirements.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the LCMXO2-2000HC-5MG132C.

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