LCMXO2-2000HC-5BG256I

The LCMXO2-2000HC-5BG256I is a MachXO2 family FPGA in a 256-LFBGA package, offering 2,112 logic elements, 206 I/Os and 75,776 bits of on-chip RAM. This industrial-grade, surface-mount device is designed for reconfigurable logic, interface conversion and system control in environments that require extended temperature and supply flexibility.

Built on the MachXO2 architecture, the device provides a combination of programmable logic, embedded memory and non-volatile configuration to enable instant-on operation, low standby power and flexible I/O support for a wide range of industrial embedded applications.

Key Features

• Logic Capacity — 2,112 logic elements (cells) for implementing combinational and sequential logic functions.
• On-chip Memory — Total on-chip RAM of 75,776 bits to support distributed memory and FIFO implementations.
• I/O Density & Flexibility — 206 I/Os in a compact 256-LFBGA (14×14 mm caBGA) package, supporting a wide variety of external interfaces.
• Power & Process — MachXO2 family architecture targets ultra-low power operation; family datasheet cites an advanced 65 nm low power process and standby power as low as 22 μW.
• Non-Volatile Configuration — Family-level on-chip user flash memory and single-chip instant-on capability enable secure, infinitely reconfigurable designs with background programming support.
• Clocking and PLLs — Flexible on-chip clocking including multiple primary clocks and PLL support as described for the MachXO2 family.
• Operating Range — Single-supply voltage support from 2.375 V to 3.465 V and industrial-grade operating temperature range of −40 °C to 100 °C.
• Package & Mounting — 256-ball caBGA package (256-LFBGA), surface mount, optimized for compact system-level integration.
• Standards & Programming — Family supports JTAG, SPI and I²C programming and IEEE 1149.1 boundary scan and in-system programming support as described in the MachXO2 family datasheet.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Reconfigurable logic and on-chip memory support control sequencing, interface timing and glue logic within industrial automation equipment operating across the device’s industrial temperature range.
• Interface Bridging — High I/O count and flexible I/O buffer options enable protocol translation and signal conditioning between subsystems.
• System Configuration & Security — On-chip user flash memory and instant-on configuration are suited for storing device configuration and enabling secure, single-chip system start-up.
• Low-Power Embedded Systems — Ultra-low standby power characteristics described for the MachXO2 family make this device appropriate where minimizing idle power is important.

Unique Advantages

• High I/O Density: 206 I/Os in a 256-LFBGA package reduce board routing complexity for multi-interface designs.
• Compact, Industrial-Grade Package: Surface-mount 256-ball caBGA (14×14 mm) balances a small footprint with industrial temperature capability (−40 °C to 100 °C).
• On-Chip Memory and Logic: 75,776 bits of RAM and 2,112 logic elements provide integrated resources for control, buffering and custom logic without external SRAM for many use cases.
• Flexible Power Supply Range: Supports 2.375 V to 3.465 V operation to match a variety of board power architectures.
• Non-Volatile, Reconfigurable Operation: MachXO2 family features enable instant-on and in-field updates, simplifying firmware and hardware iteration.
• Standards-Based Programming & Test: JTAG, SPI and I²C programming along with IEEE 1149.1 boundary scan support streamline development and manufacturing test.

Why Choose LCMXO2-2000HC-5BG256I?

The LCMXO2-2000HC-5BG256I delivers a balanced combination of logic capacity, embedded memory and high I/O density in an industrial-grade, compact caBGA package. Its MachXO2 family features—non-volatile configuration, low standby power and flexible clocking—provide designers with an immediately deployable, reconfigurable building block for control, interfacing and system configuration tasks.

This device is well suited for engineers and procurement teams designing industrial embedded systems that require reliable operation across extended temperature ranges, flexible I/O and the ability to update logic in the field while maintaining compact board-level integration.

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