LCMXO2-2000HE-4BG256C

The LCMXO2-2000HE-4BG256C is a non-volatile MachXO2 family FPGA packaged for surface-mount applications. It provides a flexible logic architecture with 2,112 logic elements and 206 I/Os in a 256-ball LFBGA footprint intended for commercial-temperature designs.

Designed for control, glue-logic and I/O-centric roles, this device combines on-chip RAM, programmable I/O options and non-volatile configuration to enable instant-on system designs and in-field reconfiguration.

Key Features

• Core Logic: 2,112 logic elements (LUT4-based architecture) suitable for mid-density programmable logic tasks and glue logic integration.
• On-chip Memory: Approximately 75,776 bits of total RAM available for distributed and embedded memory structures to support FIFOs, buffers and small data storage.
• I/O Capacity and Flexibility: 206 I/Os with programmable I/O buffer support from the MachXO2 family for a wide range of signal standards and source-synchronous interfaces.
• Non-volatile, Reconfigurable: Family-level features include on-chip user flash memory and instant-on non-volatile operation with support for background programming and in-field reconfiguration.
• Power and Supply: Single supply operation with a specified voltage supply range of 1.14 V to 1.26 V and low-power family capabilities including microsecond power-up and standby modes.
• Package and Mounting: Surface-mount 256-ball LFBGA package; supplier device package listed as 256-CABGA (14×14) for compact board-level integration.
• Operating Range and Compliance: Commercial-grade temperature range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

• System Glue Logic and Control: Implement board-level control, protocol bridging and state machines where compact, reconfigurable logic is required.
• Peripheral and Sensor Interfaces: Use the device’s programmable I/Os and on-chip memory to manage SPI, I2C and other peripheral interfaces and buffering.
• Display and Memory Interfaces: Leverage the MachXO2 family’s source-synchronous I/O and DDR support for display gearing and memory interface control.
• In-field Updatable Systems: Apply non-volatile configuration and TransFR reconfiguration features to enable field updates without removing the device from the system.

Unique Advantages

• Instant-on Non-Volatile Configuration: Powers up quickly with stored configuration, enabling fast system start-up and deterministic initialization sequencing.
• Mid-Density Integration: 2,112 logic elements and ~75.8 kbits of on-chip RAM consolidate logic and buffering that reduce external components and PCB complexity.
• High I/O Count: 206 programmable I/Os support extensive interfacing requirements, minimizing the need for additional I/O expanders.
• Flexible Power and Low-Power Modes: Narrow supply range (1.14 V–1.26 V) and family power-saving features support power-conscious designs.
• Compact BGA Package: 256-ball LFBGA (supplier 256-CABGA 14×14) provides a small board footprint for space-constrained applications.
• Regulatory and Environmental: RoHS compliant construction supports modern manufacturing and environmental requirements.

Why Choose LCMXO2-2000HE-4BG256C?

This MachXO2 device targets designers who need a compact, non-volatile, reconfigurable logic element with a high I/O count and modest on-chip memory for control, interface and glue-logic functions. Its combination of 2,112 logic elements, approximately 75,776 bits of RAM and instant-on configuration streamlines BOM and board design for commercial-temperature applications.

Choose this part when you need a scalable, reprogrammable solution with robust I/O capacity and a small BGA footprint that benefits from MachXO2 family features such as low-power operation, in-field reconfiguration and integrated peripheral support.

Request a quote or submit an inquiry to learn about availability, pricing and lead times for the LCMXO2-2000HE-4BG256C.