LCMXO2-2000HE-4FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA

Quantity 719 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HE-4FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC, 256-LBGA

The LCMXO2-2000HE-4FTG256I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball ftBGA (17 × 17) package designed for industrial applications. It provides a flexible logic architecture with 2,112 logic elements and 206 programmable I/Os, enabling system control, interface bridging and glue-logic functions in space-constrained designs.

Built for integration and configurability, the device offers on-chip RAM, non-volatile configuration options and a range of family-level I/O and clocking features that support diverse embedded system requirements while operating from a 1.14 V to 1.26 V core supply across an extended temperature range.

Key Features

  • Core Logic  Provides 2,112 logic elements suitable for mid-density glue logic, control and interface functions.
  • On-chip Memory  Approximately 75,776 total RAM bits of on-chip RAM for FIFO buffering, small data tables and state storage.
  • I/O Capacity & Flexibility  206 I/Os in a 256-LBGA package; family-level programmable sysIO buffer and differential I/O support provide flexible interface options for mixed-signal systems.
  • Power  Single core voltage range of 1.14 V to 1.26 V to support the device’s low-voltage operation.
  • Clocking & Timing  MachXO2 family supports multiple primary clocks and PLLs for flexible clock management (family feature).
  • Non-volatile Configuration & Reconfiguration  Family-level features include on-chip user flash and in-field reconfiguration capabilities (see family datasheet for options and details).
  • Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm), surface-mount package suitable for compact PCB layouts.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet extended-temperature application needs.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Use for system glue logic, control sequencing and protocol conversion where extended temperature range and robust I/O count are required.
  • Interface and Protocol Bridging  Deploy as an interface translator or bridge between subsystems using its flexible I/O and programmable logic resources.
  • Embedded System Glue Logic  Implement bus arbitration, reset management and peripheral aggregation in compact board layouts.
  • Display and Peripheral Timing  Support timing, FIFO buffering and clocking functions for displays and external memory interfaces (family-level timing and DDR support available).

Unique Advantages

  • Mid-density logic with high I/O count: 2,112 logic elements combined with 206 I/Os enable complex interfacing without large FPGAs or multi-chip solutions.
  • Compact BGA packaging: 256-LBGA (17 × 17 mm) reduces PCB footprint while preserving a high pin count for dense designs.
  • Extended operating range: Industrial temperature rating (−40 °C to 100 °C) supports deployment in demanding environments.
  • On-chip memory resources: Approximately 75,776 bits of RAM for buffering and state storage, reducing external memory requirements for many control tasks.
  • Flexible power profile: Narrow, defined core supply range (1.14 V to 1.26 V) supports predictable power budgeting in system designs.
  • RoHS compliant: Facilitates regulatory-aligned manufacturing and assembly processes.

Why Choose LCMXO2-2000HE-4FTG256I?

The LCMXO2-2000HE-4FTG256I delivers a balanced combination of mid-range programmable logic, a high I/O count and compact BGA packaging for industrial applications requiring reliable interface and control functions. Its on-chip memory and family-level features for flexible I/O and clocking make it a practical option for designers who need configurable glue logic and system integration in a compact, industrial-grade package.

Choose this part when you need a scalable, reconfigurable device that simplifies board-level design and supports extended-temperature operation while keeping component count and PCB area under control.

Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO2-2000HE-4FTG256I. Our team can provide lead-time details and support for your procurement and design planning needs.

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