LCMXO2-2000HE-4FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA |
|---|---|
| Quantity | 719 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HE-4FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC, 256-LBGA
The LCMXO2-2000HE-4FTG256I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball ftBGA (17 × 17) package designed for industrial applications. It provides a flexible logic architecture with 2,112 logic elements and 206 programmable I/Os, enabling system control, interface bridging and glue-logic functions in space-constrained designs.
Built for integration and configurability, the device offers on-chip RAM, non-volatile configuration options and a range of family-level I/O and clocking features that support diverse embedded system requirements while operating from a 1.14 V to 1.26 V core supply across an extended temperature range.
Key Features
- Core Logic Provides 2,112 logic elements suitable for mid-density glue logic, control and interface functions.
- On-chip Memory Approximately 75,776 total RAM bits of on-chip RAM for FIFO buffering, small data tables and state storage.
- I/O Capacity & Flexibility 206 I/Os in a 256-LBGA package; family-level programmable sysIO buffer and differential I/O support provide flexible interface options for mixed-signal systems.
- Power Single core voltage range of 1.14 V to 1.26 V to support the device’s low-voltage operation.
- Clocking & Timing MachXO2 family supports multiple primary clocks and PLLs for flexible clock management (family feature).
- Non-volatile Configuration & Reconfiguration Family-level features include on-chip user flash and in-field reconfiguration capabilities (see family datasheet for options and details).
- Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm), surface-mount package suitable for compact PCB layouts.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet extended-temperature application needs.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Use for system glue logic, control sequencing and protocol conversion where extended temperature range and robust I/O count are required.
- Interface and Protocol Bridging Deploy as an interface translator or bridge between subsystems using its flexible I/O and programmable logic resources.
- Embedded System Glue Logic Implement bus arbitration, reset management and peripheral aggregation in compact board layouts.
- Display and Peripheral Timing Support timing, FIFO buffering and clocking functions for displays and external memory interfaces (family-level timing and DDR support available).
Unique Advantages
- Mid-density logic with high I/O count: 2,112 logic elements combined with 206 I/Os enable complex interfacing without large FPGAs or multi-chip solutions.
- Compact BGA packaging: 256-LBGA (17 × 17 mm) reduces PCB footprint while preserving a high pin count for dense designs.
- Extended operating range: Industrial temperature rating (−40 °C to 100 °C) supports deployment in demanding environments.
- On-chip memory resources: Approximately 75,776 bits of RAM for buffering and state storage, reducing external memory requirements for many control tasks.
- Flexible power profile: Narrow, defined core supply range (1.14 V to 1.26 V) supports predictable power budgeting in system designs.
- RoHS compliant: Facilitates regulatory-aligned manufacturing and assembly processes.
Why Choose LCMXO2-2000HE-4FTG256I?
The LCMXO2-2000HE-4FTG256I delivers a balanced combination of mid-range programmable logic, a high I/O count and compact BGA packaging for industrial applications requiring reliable interface and control functions. Its on-chip memory and family-level features for flexible I/O and clocking make it a practical option for designers who need configurable glue logic and system integration in a compact, industrial-grade package.
Choose this part when you need a scalable, reconfigurable device that simplifies board-level design and supports extended-temperature operation while keeping component count and PCB area under control.
Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO2-2000HE-4FTG256I. Our team can provide lead-time details and support for your procurement and design planning needs.

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