LCMXO2-2000HE-4TG100C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP |
|---|---|
| Quantity | 930 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HE-4TG100C – MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP
The LCMXO2-2000HE-4TG100C is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, delivered in a 100-pin LQFP surface-mount package (14 mm × 14 mm). It provides 2,112 logic elements, 79 general-purpose I/Os and 75,776 bits of on-chip RAM, making it suited for control, glue-logic and interface-oriented roles in commercial electronic designs.
Designed for low-power operation and flexible I/O, the device supports single-supply operation (1.14 V to 1.26 V), RoHS compliance, and commercial temperature operation from 0 °C to 85 °C, enabling reliable integration into board-level systems requiring non‑volatile, reconfigurable logic.
Key Features
- Core Logic — 2,112 logic elements across 264 logic blocks, providing programmable fabric for control, glue logic and custom logic functions.
- On-chip Memory — 75,776 bits of total RAM for distributed and embedded storage needs within user logic.
- I/O and Interfaces — 79 I/Os with programmable I/O buffer support as described for the MachXO2 family, enabling a wide range of interface options on a single device.
- Non-volatile Configuration — MachXO2 family supports on-chip user flash memory and instant-on, allowing single-chip, reconfigurable non‑volatile operation and background programming.
- Low Power Architecture — Built on a low-power process with family features for standby and power-saving modes to minimize system idle power.
- Clocking and PLLs — Family-level flexible clocking with multiple primary clocks and up to two analog PLLs for fractional-N frequency synthesis (family feature).
- Package and Mounting — Surface mount 100-LQFP (14×14 mm) package for straightforward PCB integration; supplier device package referenced as 100-TQFP (14×14).
- Electrical and Environmental — Supply voltage range 1.14 V to 1.26 V and commercial grade operating range of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Display and Video Interfaces — Family support for geared display I/Os and source-synchronous I/O simplifies implementation of display pipelines and timing-critical interfaces.
- Memory Interface and Buffering — Dedicated DDR/DDR2/LPDDR support and FIFO control logic capabilities at the family level enable use as memory interface glue or timing adapters.
- System Control and Peripherals — On-chip SPI, I²C and timer/counter primitives support system management, peripheral bridging and sensor interfacing in embedded designs.
Unique Advantages
- Instant-on, single-chip solution: Non-volatile configuration and instant-on capability reduce system complexity and eliminate external configuration memory in many designs.
- Flexible, programmable I/O: Family-level sysIO buffer support and programmable differential I/Os provide interface flexibility across voltage standards and signaling types.
- In-field reconfiguration: TransFR reconfiguration support enables in-field logic updates while the system is operating, simplifying firmware and feature upgrades.
- Compact, production-ready package: 100-LQFP surface-mount package offers a compact footprint and established assembly flow for commercial products.
- Integrated system functions: Hardened SPI, I²C and timer/counter blocks reduce logic consumption for common functions and accelerate time-to-market.
- Low-power options: Family power-saving modes and low standby power characteristics support energy-conscious designs.
Why Choose LCMXO2-2000HE-4TG100C?
The LCMXO2-2000HE-4TG100C combines a mid-density logic fabric (2,112 logic elements) with substantial on-chip RAM (75,776 bits) and 79 I/Os in a compact 100‑pin LQFP package, offering a balanced mix of integration, I/O flexibility and memory for commercial embedded designs. Single‑chip non-volatile configuration, in-field reconfiguration and integrated peripheral functions simplify BOM and accelerate system development.
This device is suitable for designers who need reconfigurable logic for control, interface bridging, timing adaptation and peripheral integration while maintaining low-power operation and straightforward PCB implementation within commercial temperature ranges.
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