LCMXO2-2000HE-4TG144I

The LCMXO2-2000HE-4TG144I is a MachXO2 family FPGA offering 2,112 logic elements and 111 general-purpose I/Os in a 144-pin LQFP package. Designed for industrial applications, it combines configurable logic, embedded memory and flexible I/O to handle glue logic, interface bridging, and control-plane functions where low power and non-volatile instant-on behavior are valued.

This device delivers system-level integration with on-chip configuration and peripheral support, making it suitable for designs that require fast startup, reconfigurability, and a compact BOM in industrial temperature environments.

Key Features

• Core Logic 2,112 logic elements (cells) for implementing combinational and sequential logic, state machines, and glue logic.
• Embedded Memory Approximately 75,776 bits of on-chip RAM to support FIFOs, buffering and small data structures in-system.
• I/O Density & Flexibility 111 I/Os with programmable sysIO buffer options; family-level I/O support includes LVCMOS (1.2–3.3 V), LVTTL, LVDS and a variety of differential and legacy interface standards for broad connectivity.
• Non-volatile Configuration & UFM MachXO2 family supports on-chip user flash memory (UFM) and instant-on non-volatile configuration; family UFM capacity is available up to 256 kbits for storing configuration and small user data.
• Power and Supply Single core voltage supply range of 1.14 V to 1.26 V; family devices are optimized for low standby power (family-level standby power as low as 22 µW).
• Clocking and PLLs Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs (family-level), supporting a wide input frequency range for system timing and high-speed interfaces.
• System Integration On-chip hardened functions at the family level include SPI, I2C, timer/counter and an oscillator; supports multiple configuration interfaces (JTAG, SPI, I2C) and in-system programming.
• Package & Mounting 144-pin LQFP (supplier package listed as 144-TQFP 20 × 20 mm) in a surface-mount form factor for board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as Industrial grade for use in extended-temperature applications.

Typical Applications

• Industrial Control Implement sensor interfacing, control logic and real-time glue logic where industrial operating temperature and low-power standby are important.
• Interface Bridging Bridge between legacy and modern interfaces or adapt signaling levels using the flexible sysIO buffer options and abundant I/Os.
• Boot and Configuration Management Use on-chip non-volatile configuration and UFM for instant-on system boot, secure single-chip solutions and in-field firmware updates.
• Display and Source-Synchronous I/O Implement source-synchronous and DDR-style I/O paths for display or memory-interface glue logic leveraging dedicated I/O gearing and DDR register support at the family level.

Unique Advantages

• Highly integrated, compact solution: Combines logic, embedded RAM and on-chip flash configuration in a single 144-LQFP package to reduce BOM and board area.
• Instant-on non-volatile operation: Powers up quickly with on-chip configuration memory, enabling fast system availability and simplified boot flows.
• Flexible I/O support: Programmable buffer options and differential I/O support allow direct interfacing to a wide range of signaling standards without external translators.
• Low-power family characteristics: Family-level low standby power behavior helps minimize energy use in always-on or battery-assisted systems.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for robust performance in harsh environments.
• System-level peripherals: Built-in SPI, I2C and timers simplify integration of management and peripheral control functions.

Why Choose LCMXO2-2000HE-4TG144I?

The LCMXO2-2000HE-4TG144I positions itself as a versatile, industrial-grade FPGA for designs that require a balance of logic capacity, embedded memory and flexible I/O in a compact, surface-mount package. Its non-volatile configuration and family-level system features reduce external components and streamline boot and in-field update flows.

This device is suited to engineers building industrial control, interface bridging and system-management functions who need predictable operation across −40 °C to 100 °C, a solid set of on-chip peripherals and programmable I/O options to simplify integration and reduce total system cost.

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